公开(公告)号：JP2001053239A

公开(公告)日：2001-02-23

申请号：JP2000187151

申请日：2000-06-22

Applicant: LUCENT TECHNOLOGIES INC

Inventor： KOSSIVES DEAN P ,  LOTFI ASHRAF W ,  SCHNEEMEYER LYNN F ,  STEIGERWALD MICHAEL ,  VAN DOVER R BRUCE

IPC: H01F3/02 ,  H01F17/00 ,  H01F27/00 ,  H01F41/04 ,  H01L21/822 ,  H01L21/8234 ,  H01L27/04 ,  H01L27/06 ,  H03H7/01 ,  H03H7/075

Abstract: PROBLEM TO BE SOLVED: To provide an integrated circuit, which not only comprises a micromagnetic device but comprises other microcomputers, such as a capacitor and a transistor. SOLUTION: An integrated circuit 400 includes a substrate 410 with an insulator and a capacitor, which are formed thereon. Moreover, the circuit 400 comprises bonding agents 480 and 485 formed on the insulator and includes a micromagnetic device. The device includes a ferromagnetic core 490 formed on the bonding agent 485. The bonding agents form a bond between the insulator and the core 490 for fixing the core 400 on the substrate 410. The device comprises at least the one wiring of wirings 440 and 460, arranged in close proximity to the core 490 for giving desired magnetic characteristics to the core 490. The device is coupled electrically with the capacitor.

公开(公告)号：DE60020011T2

公开(公告)日：2006-03-16

申请号：DE60020011

申请日：2000-06-13

Applicant: LUCENT TECHNOLOGIES INC

Inventor： KOSSIVES DEAN P ,  LOTFI ASHRAF W ,  SCHNEEMEYER LYNN F ,  STEIGERWALD MICHAEL L ,  VAN DOVER R BRUCE

IPC: H01F3/02 ,  H01F17/00 ,  H01F27/00 ,  H01F41/04 ,  H01L21/822 ,  H01L21/8234 ,  H01L23/64 ,  H01L27/04 ,  H01L27/06 ,  H03H7/01 ,  H03H7/075

Abstract: An integrated circuit and method of manufacturing therefor. In one embodiment, the integrated circuit includes a substrate with an insulator and a capacitor formed over the substrate. The integrated circuit further includes an adhesive formed over the insulator. The integrated circuit still further includes a micromagnetic device. The micromagnetic device includes a ferromagnetic core formed over the adhesive. The adhesive forms a bond between the insulator and the ferromagnetic core to secure the ferromagnetic core to the substrate. The micromagnetic device also includes at least one winding, located proximate the ferromagnetic core, to impart a desired magnetic property to the ferromagnetic core. The micromagnetic device is electrically coupled to the capacitor.

公开(公告)号：DE60020011D1

公开(公告)日：2005-06-16

申请号：DE60020011

申请日：2000-06-13

Applicant: LUCENT TECHNOLOGIES INC

Inventor： KOSSIVES DEAN P ,  LOTFI ASHRAF W ,  SCHNEEMEYER LYNN F ,  STEIGERWALD MICHAEL L ,  VAN DOVER R BRUCE

IPC: H01F3/02 ,  H01F17/00 ,  H01F27/00 ,  H01F41/04 ,  H01L21/822 ,  H01L21/8234 ,  H01L27/04 ,  H01L27/06 ,  H03H7/01 ,  H03H7/075 ,  H01L23/64

Abstract: An integrated circuit and method of manufacturing therefor. In one embodiment, the integrated circuit includes a substrate with an insulator and a capacitor formed over the substrate. The integrated circuit further includes an adhesive formed over the insulator. The integrated circuit still further includes a micromagnetic device. The micromagnetic device includes a ferromagnetic core formed over the adhesive. The adhesive forms a bond between the insulator and the ferromagnetic core to secure the ferromagnetic core to the substrate. The micromagnetic device also includes at least one winding, located proximate the ferromagnetic core, to impart a desired magnetic property to the ferromagnetic core. The micromagnetic device is electrically coupled to the capacitor.