公开(公告)号：DE602005002187T2

公开(公告)日：2008-05-29

申请号：DE602005002187

申请日：2005-02-22

Applicant: LUCENT TECHNOLOGIES INC

Inventor： ISAACS ERIC D ,  METZ CARSTEN

IPC: H01Q3/44 ,  H01Q15/08 ,  H01Q3/46 ,  H01Q15/00 ,  H01Q19/06

公开(公告)号：DE602004000109T2

公开(公告)日：2006-06-14

申请号：DE602004000109

申请日：2004-02-20

Applicant: LUCENT TECHNOLOGIES INC

Inventor： BARAS TORBEN ,  LYONS ALAN MICHAEL ,  METZ CARSTEN

IPC: H05K1/02 ,  H05K3/42 ,  H05K1/11 ,  H05K3/46

Abstract: An apparatus is disclosed that substantially reduces or eliminates the resonance that occurs in vias that connect the layers of a printed circuit board by electrically coupling a first transmission line (704) in a circuit board to a second transmission line (705) in a circuit board by two electrical paths (706,707) having substantially the same electrical length. The two electrical paths are created by connecting the first transmission line to a first via which is in turn connected to a second via having a second transmission line with a plurality of connecting electrical paths between the two vias. In one illustrative embodiment, electrical traces are used to connect the top of the first via to the top of the second via and the bottom of the first via to the bottom of the second via.

公开(公告)号：AT306186T

公开(公告)日：2005-10-15

申请号：AT04250909

申请日：2004-02-20

Applicant: LUCENT TECHNOLOGIES INC

Inventor： BARAS TORBEN ,  LYONS ALAN MICHAEL ,  METZ CARSTEN

IPC: H05K1/11 ,  H05K1/02 ,  H05K3/42 ,  H05K3/46

Abstract: An apparatus is disclosed that substantially reduces or eliminates the resonance that occurs in vias that connect the layers of a printed circuit board by electrically coupling a first transmission line (704) in a circuit board to a second transmission line (705) in a circuit board by two electrical paths (706,707) having substantially the same electrical length. The two electrical paths are created by connecting the first transmission line to a first via which is in turn connected to a second via having a second transmission line with a plurality of connecting electrical paths between the two vias. In one illustrative embodiment, electrical traces are used to connect the top of the first via to the top of the second via and the bottom of the first via to the bottom of the second via.

公开(公告)号：DE602005002187D1

公开(公告)日：2007-10-11

申请号：DE602005002187

申请日：2005-02-22

Applicant: LUCENT TECHNOLOGIES INC

Inventor： ISAACS ERIC D ,  METZ CARSTEN

IPC: H01Q3/44 ,  H01Q15/08 ,  H01Q3/46 ,  H01Q15/00 ,  H01Q19/06

公开(公告)号：DE602004000109D1

公开(公告)日：2005-11-10

申请号：DE602004000109

申请日：2004-02-20

Applicant: LUCENT TECHNOLOGIES INC

Inventor： BARAS TORBEN ,  LYONS ALAN MICHAEL ,  METZ CARSTEN

IPC: H05K1/02 ,  H05K1/11 ,  H05K3/42 ,  H05K3/46

Abstract: An apparatus is disclosed that substantially reduces or eliminates the resonance that occurs in vias that connect the layers of a printed circuit board by electrically coupling a first transmission line (704) in a circuit board to a second transmission line (705) in a circuit board by two electrical paths (706,707) having substantially the same electrical length. The two electrical paths are created by connecting the first transmission line to a first via which is in turn connected to a second via having a second transmission line with a plurality of connecting electrical paths between the two vias. In one illustrative embodiment, electrical traces are used to connect the top of the first via to the top of the second via and the bottom of the first via to the bottom of the second via.