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公开(公告)号:GB2323756B
公开(公告)日:1999-04-07
申请号:GB9802755
申请日:1998-02-10
Applicant: LUCENT TECHNOLOGIES INC
Inventor: GABARA THADDEUS JOHN , RUDNICK ROBERT
IPC: G06F3/00 , H03K19/0175 , H04L12/40 , H04L25/02 , G06F13/40
Abstract: Embodiments of the invention include a method and arrangement of integrated circuit components for enhancing the integrity of communication signals transmitted through a multi-device communication system. Embodiments of the invention provide controllable impedance arrangements for coupling to one or more integrated circuit components coupled along a bus transmission line within the communications system. The coupled impedance arrangements establish damping impedances for selected devices between the signal transmitting component and the signal receiving component along the bus transmission line to advantageously reduce distortion and ringing associated with the LC parasitic network behavior of the devices. Typically, a damping impedance is coupled to the integrated circuit component immediately adjacent to the signal transmitting component along the bus transmission line between the signal transmitting component and the signal receiving component. Alternatively, other integrated circuit components between the signal transmitting component and the signal receiving component have damping impedances coupled thereto in addition to or instead of the integrated circuit component adjacent to the signal transmitting component. According to an embodiment of the invention, the controllable damping impedance arrangements are on-chip and off-chip configurations of switchable impedance elements that when actuated couple the necessary impedance to the characteristic capacitance and associated inductance of selected integrated circuit components. The damping impedance arrangements are controlled by a controller operably coupled to the arrangement or by other suitable means. Implementation of the damping impedance arrangements advantageously improves the integrity of signals transmitted along the bus transmission line and reduces ringing without unnecessarily increasing power dissipation and/or driving power requirements of the signal transmitting components within the communications system.
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公开(公告)号:GB2323756A
公开(公告)日:1998-09-30
申请号:GB9802755
申请日:1998-02-10
Applicant: LUCENT TECHNOLOGIES INC
Inventor: GABARA THADDEUS JOHN , RUDNICK ROBERT
IPC: G06F3/00 , H03K19/0175 , H04L12/40 , H04L25/02 , G06F13/40
Abstract: Controllable impedance arrangements (60) are provided for coupling to one or more integrated circuit components 20a-20f coupled along a bus transmission line (24) within a communications system, to establish damping impedances for selected devices between the signal transmitting component and the signal receiving component along the bus transmission line to advantageously reduce distortion and ringing associated with the LC parasitic network behavior of the devices. Typically, a damping impedance is coupled to the integrated circuit component immediately adjacent to the signal transmitting component along the bus. Alternatively, other integrated circuit components between the signal transmitting component and the signal receiving component have damping impedances coupled thereto in addition to or instead of the integrated circuit component adjacent to the signal transmitting component. The controllable damping impedance arrangements are on-chip or off-chip configurations of switchable impedance elements that, when actuated, couple the necessary impedance to the characteristic capacitance and associated inductance of selected integrated circuit components. The damping impedance arrangements are controlled by a controller 72 operably coupled to the arrangement or by other suitable means. Implementation of the damping impedance arrangements advantageously improves the integrity of signals transmitted along the bus transmission line and reduces ringing without unnecessarily increasing power dissipation and/or driving power requirements of the signal transmitting components within the communications system.
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