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    1.
    发明专利
    未知

    公开(公告)号：DE60000025D1

    公开(公告)日：2001-12-06

    申请号：DE60000025

    申请日：2000-08-21

    Applicant: LUCENT TECHNOLOGIES INC

    Inventor： BLYLER JR ,  GRIMES GARY J ,  SHERMAN CHARLES J

    IPC: G02B6/00 ,  B29C47/00 ,  B29D11/00 ,  G02B6/028 ,  G02B6/18

    Abstract: Fabricating graded index plastic optical fiber by diffusing a high molecular weight dopant within a step index plastic optical fiber after the step index plastic optical fiber has been drawn from a preform using a conventional draw tower in a first embodiment. Also, the step index plastic optical fiber may be fabricated by extruding one material circumferentially around another material, e.g., by use of a concentric nozzle. The dopant is diffused after the drawing or extruding of the step index plastic optical fiber by heating the plastic optical fiber to a temperature that causes a high rate of diffusion state while measuring the transmission bandwidth of the plastic optical fiber. When the predetermined specified transmission bandwidth is measured, the plastic optical fiber is immediately returned to an ambient temperature. In addition, the plastic optical fiber may be gradually heated to an equilibrium temperature that is just below the temperature required to produce the high rate of diffusion state. Once the equilibrium temperature has been achieved, additional heating is carried out to raise the temperature to that required to produce the high rate of diffusion and the transmission bandwidth is tested. In a second embodiment of the invention, the preform is initially heated for an amount of time that will allow the diffusion process to be partially completed. After the plastic optical fiber has been drawn, the remaining diffusion is accomplished by testing for the specified transmission bandwidth. Similarly, a partially diffused plastic optical fiber may be extruded.

    INTERCONNECTION SYSTEM FOR OPTICAL CIRCUIT BOARDS
    3.
    发明专利
    INTERCONNECTION SYSTEM FOR OPTICAL CIRCUIT BOARDS 未知

    公开(公告)号：CA2332780A1

    公开(公告)日：2001-08-29

    申请号：CA2332780

    申请日：2001-01-26

    Applicant: LUCENT TECHNOLOGIES INC

    Inventor： LAMPERT NORMAN ROGER ,  SHERMAN CHARLES J ,  GRIMES GARY J

    IPC: G02B6/36 ,  G02B6/38 ,  G02B6/42

    Abstract: An interconnection system is shown that enables an optical circuit board [30 0] having a number of optical devices [400, 500] to be easily connected to and disconnected from a backplane [100]. The optical devices are positioned alon g a side edge [311 ] of a substrate [310] and are adapted to interconnect with a like number of optical connectors [200] that are arrayed on the backplane in a row or colum n. Each optical plug is held in a holder [120], which is retained in backplane [100] by a clip [110]. Each of the optical connectors is a plug that includes a ferrule [24] , which encloses an optical fiber and projects from one end of the plug. Each of the edge- mounted optical devices includes a jack receptacle [410, 510] at its front e nd and has a cavity [401, 501] that is shaped to receive the optical plug. All of the jac k receptacles are similarly shaped. Each cavity further includes a boss [421, 521 ] for receiving the ferrule. The plugs and jack receptacles are arranged to engage, but not interlock with, each other. The optical devices include two or more downward-extending pins [430, 530] that are received in corresponding holes [334, 335] in the substrate board for accurate positioning. Illustratively, optical device [400] includes a jack receptacle in its front-end portion [410] and its back-end portion [420]; whereas optical device [500] includes a jack receptacle in its front-end portion [510] and one or more transducers [550], for converting between electrical and optical signals, in its back-end portion [520].

    INTERCONNECTION SYSTEM FOR OPTICAL CIRCUIT BOARDS
    4.
    发明专利
    INTERCONNECTION SYSTEM FOR OPTICAL CIRCUIT BOARDS 未知

    公开(公告)号：CA2332780C

    公开(公告)日：2004-06-01

    申请号：CA2332780

    申请日：2001-01-26

    Applicant: LUCENT TECHNOLOGIES INC

    Inventor： GRIMES GARY J ,  SHERMAN CHARLES J ,  LAMPERT NORMAN ROGER

    IPC: G02B6/36 ,  G02B6/38 ,  G02B6/42

    Abstract: An interconnection system is shown that enables an optical circuit board [30 0] having a number of optical devices [400, 500] to be easily connected to and disconnected from a backplane [100]. The optical devices are positioned alon g a side edge [311] of a substrate [310] and are adapted to interconnect with a like number of optical connectors [200] that are arrayed on the backplane in a row or colum n. Each optical plug is held in a holder [120], which is retained in backplane [100] by a clip [110]. Each of the optical connectors is a plug that includes a ferrule [24] , which encloses an optical fiber and projects from one end of the plug. Each of the edge-mounted optical devices includes a jack receptacle [410, 510] at its front end and h as a cavity [401, 501] that is shaped to receive the optical plug. All of the jac k receptacles are similarly shaped. Each cavity further includes a boss [421, 521] for receiving the ferrule. The plugs and jack receptacles are arranged to engage, but not interlock with, each other. The optical devices include two or more downward-extending pins [430, 530] that are received in corresponding holes [334, 335] in the substrate board for accurate positioning. Illustratively, optical device [400] includes a jack receptacle in its front-end portion [410] and its back-end portion [420]; whereas optical device [500] includes a jack receptacle in its front-end portion [510] and one or more transducers [550], for converting between electrical and optical signals, in its back-end portion [520].

    6.
    发明专利
    未知

    公开(公告)号：DE60000025T2

    公开(公告)日：2002-07-11

    申请号：DE60000025

    申请日：2000-08-21

    Applicant: LUCENT TECHNOLOGIES INC

    Inventor： BLYLER JR ,  GRIMES GARY J ,  SHERMAN CHARLES J

    IPC: G02B6/00 ,  B29C47/00 ,  B29D11/00 ,  G02B6/028 ,  G02B6/18

    Abstract: Fabricating graded index plastic optical fiber by diffusing a high molecular weight dopant within a step index plastic optical fiber after the step index plastic optical fiber has been drawn from a preform using a conventional draw tower in a first embodiment. Also, the step index plastic optical fiber may be fabricated by extruding one material circumferentially around another material, e.g., by use of a concentric nozzle. The dopant is diffused after the drawing or extruding of the step index plastic optical fiber by heating the plastic optical fiber to a temperature that causes a high rate of diffusion state while measuring the transmission bandwidth of the plastic optical fiber. When the predetermined specified transmission bandwidth is measured, the plastic optical fiber is immediately returned to an ambient temperature. In addition, the plastic optical fiber may be gradually heated to an equilibrium temperature that is just below the temperature required to produce the high rate of diffusion state. Once the equilibrium temperature has been achieved, additional heating is carried out to raise the temperature to that required to produce the high rate of diffusion and the transmission bandwidth is tested. In a second embodiment of the invention, the preform is initially heated for an amount of time that will allow the diffusion process to be partially completed. After the plastic optical fiber has been drawn, the remaining diffusion is accomplished by testing for the specified transmission bandwidth. Similarly, a partially diffused plastic optical fiber may be extruded.

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