SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREFOR

    公开(公告)号:JP2001144289A

    公开(公告)日:2001-05-25

    申请号:JP2000304527

    申请日:2000-10-04

    Abstract: PROBLEM TO BE SOLVED: To provide a MOS device structure, whose gate length is smaller than 50 nm and a method of manufacturing the same. SOLUTION: This method comprises a first step, where a sacrificial gate is formed on the active region of a semiconductor substrate, a second step where the distance between a source region and a drain region inside the semiconductor substrate is prescribed by the width of the sacrificial gate, and a dielectric layer for a trench is formed adjacent to the sacrificial gate, a third step where the sacrificial gate is removed so as to form a trench in the dielectric layer as prescribed, a fourth step where a spacer is formed in the trench, and a fifth step where the gate of a device is so formed as to enable its part to be formed between the spacers.

Patent Agency Ranking