ELECTROPLATING SOLUTION FOR ELECTROPLATING LEAD AND LEAD/TIN ALLOYS

    公开(公告)号:SG83186A1

    公开(公告)日:2001-09-18

    申请号:SG200000571

    申请日:2000-02-01

    Abstract: An electroplating solution for plating bright tin, lead, or tin-lead alloy solder coatings in high speed electroplating applications. The electroplating solution includes an alkane or alkanol sulfonic acid electrolyte, a non-ionic surfactant, a grain refiner and two brightening agents: an aromatic aldehyde and a carboxylic acid. In one embodiment of the electroplating solution, the sulfonic acid electrolyte is methane sulfonic acid, the non-ionic surfactant is octylphenoxy(10)polyethoxy ethanol, the grain refiner is phenolphthalein, the aromatic aldehyde is chlorobenzaldehyde, and the carboxylic acid is methacrylic acid.

    TIN ELECTROPLATING PROCESS
    2.
    发明专利

    公开(公告)号:SG95611A1

    公开(公告)日:2003-04-23

    申请号:SG1999006082

    申请日:1999-12-01

    Abstract: An electrolyte bath for plating tin or tin alloy onto metal substrates using a high speed plating process is described. The electrolyte bath contains a stannous alkyl sulfonate and an alkyl sulfonic acid. The bath also contains an organic compound that is the reaction product of polyalkylene glycol and phenolphthalein or derivatives of phenolphthalein.

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