公开(公告)号：SG87169A1

公开(公告)日：2002-03-19

申请号：SG200005261

申请日：2000-09-19

Applicant: LUCENT TECHNOLOGIES INC

Inventor： JOSEPH ANTHONY ABYS ,  CHONGLUN FAN

IPC: C25D5/12 ,  B32B15/01 ,  C23C18/08 ,  C25D5/10 ,  C25D7/00 ,  H01L23/495 ,  H01L23/50 ,  H01R13/03

Abstract: In accordance with the invention, a metal substrate (10) is coated with a multilayer surface finish (11) comprising, in succession, an amorphous metal underlayer (12) a corrosion-resistent metal middle layer (13) and one or more outer layers of precious metal (14). In an exemplary embodiment the metal substrate comprises copper alloy, the amorphous metal underlayer is Ni-P, the middle layer is nickel and the outer layer is palladium. The resulting structure is particularly useful as an electrical connector.

公开(公告)号：SG85726A1

公开(公告)日：2002-01-15

申请号：SG200004635

申请日：2000-08-18

Applicant: LUCENT TECHNOLOGIES INC

Inventor： JOSEPH ANTHONY ABYS ,  CONOR ANTHONY DULLAGHAN ,  CHONGLUN FAN ,  BRIAN THOMAS SMITH

IPC: C25D3/12 ,  C25D3/56 ,  C25D3/62 ,  C25D5/12 ,  C25D15/00 ,  C25D15/02 ,  H01R13/00 ,  H01R13/03 ,  H05K3/24

Abstract: An electrical connector comprises connector contacts having a metal base and a surface finish layer over the base, the surface finish layer being a composite of an electroplated precious metal composition and wear resistant particles dispersed therein. In the preferred embodiment, the precious metal layer is a PdCo alloy and the wear resistant particles are sub-micron sized lubricating particles, e.g. polytetrafluoroethylene particles and a flash coat of gold is provided over the composite layer.

公开(公告)号：SG84600A1

公开(公告)日：2001-11-20

申请号：SG200002894

申请日：2000-05-26

Applicant: LUCENT TECHNOLOGIES INC

Inventor： JOSEPH ANTHONY ABYS ,  CONOR ANTHONY DULLAGHAN ,  PETER EPSTEIN ,  JOSEPH JOHN MAISANO JR

IPC: C25D3/00 ,  C01G55/00 ,  C25D3/50 ,  C25D3/56 ,  C25D21/12 ,  C25D21/18 ,  C25D

Abstract: This invention provides for a palladium replenisher comprising a complex of palladium tetraammine sulfate made according to a process whereby the processing temperature is maintained at or below about 115 DEG C in the presence of excess nitrate solution. The replenisher of the invention is used to replenish depleted palladium during palladium electroplating to maintain the palladium concentration in the bath within from about 5 to about 10 weight percent of recommended plating bath levels.

公开(公告)号：SG71204A1

公开(公告)日：2000-03-21

申请号：SG1999001692

申请日：1999-04-20

Applicant: LUCENT TECHNOLOGIES INC

Inventor： JOSEPH ANTHONY ABYS ,  FAN CHONGLUN

IPC: H01L23/495 ,  H01L21/52 ,  H01L21/58

Abstract: A method for controlling resin bleeding on integrated circuit packages (125) is disclosed. Resin bleeding is controlled by lowering the surface energy of an IC substrate (110) to less than or about equal to the surface energy of an adhesive (130) which attaches IC units thereto. The IC substrate is treated with a material (150) that lowers its surface energy. The material layer forms a less wettable surface on the IC substrate which inhibits resin bleeding when the adhesive applied thereto is hardened. The material layer is formed from a solution of a polymer in a solvent. Suitable polymers include polyfluorinated hydrocarbon compounds.

公开(公告)号：SG89270A1

公开(公告)日：2002-06-18

申请号：SG1998004625

申请日：1998-11-10

Applicant: LUCENT TECHNOLOGIES INC

Inventor： JOSEPH ANTHONY ABYS ,  IRINA BOGUSLAVSKY ,  HEINRICH KARL STRASCHIL

IPC: C25D3/56

Abstract: An aqueous electroplating bath for the electrodeposition of palladium alloys in a mixed ligand system. A first ligand operates to form a complex of palladium and a second ligand functions to form a complex of another metal which brings the plating potentials of the two metals closer together. Palladium and the alloying metal thus exist as complexes with different structures.

公开(公告)号：HK1038383A1

公开(公告)日：2002-03-15

申请号：HK02100097

申请日：2002-01-07

Applicant: LUCENT TECHNOLOGIES INC

Inventor： CONOR ANTHONY DULLAGHAN ,  JOSEPH ANTHONY ABYS ,  PETER EPSTEIN ,  JOSEPH JOHN MAISANO

IPC: C25D20060101 ,  C25D3/50 ,  C25D3/52 ,  C25D3/56 ,  C25D5/34 ,  C25D7/00

公开(公告)号：SG83186A1

公开(公告)日：2001-09-18

申请号：SG200000571

申请日：2000-02-01

Applicant: LUCENT TECHNOLOGIES INC

Inventor： JOSEPH ANTHONY ABYS ,  KENNETH J MURSKI ,  YUN ZHANG

IPC: C25D3/00 ,  C25D3/32 ,  C25D3/36 ,  C25D3/56 ,  C25D3/60 ,  H05K3/34

Abstract: An electroplating solution for plating bright tin, lead, or tin-lead alloy solder coatings in high speed electroplating applications. The electroplating solution includes an alkane or alkanol sulfonic acid electrolyte, a non-ionic surfactant, a grain refiner and two brightening agents: an aromatic aldehyde and a carboxylic acid. In one embodiment of the electroplating solution, the sulfonic acid electrolyte is methane sulfonic acid, the non-ionic surfactant is octylphenoxy(10)polyethoxy ethanol, the grain refiner is phenolphthalein, the aromatic aldehyde is chlorobenzaldehyde, and the carboxylic acid is methacrylic acid.