公开(公告)号：DE112013006020T5

公开(公告)日：2015-09-03

申请号：DE112013006020

申请日：2013-12-10

Applicant: LUXVUE TECHNOLOGY CORP

Inventor： MCGRODDY KELLY ,  SAKARIYA KAPIL V ,  BIBL ANDREAS

IPC: H05B37/02

Abstract: Eine lichtemittierende Baugruppe wird beschrieben. In einer Ausführungsform werden eine oder mehrere lichtemittierende Dioden(LED)-Vorrichtungen und eine oder mehrere Mikrosteuereinheiten auf eine selbe Seite eines Substrats gebondet, um durch die eine oder mehreren Mikrosteuereinheiten die eine oder mehreren LED-Vorrichtungen zu schalten und zu betreiben.

公开(公告)号：WO2015094600A8

公开(公告)日：2015-12-30

申请号：PCT/US2014067186

申请日：2014-11-24

Applicant: LUXVUE TECHNOLOGY CORP

Inventor： HU HSIN-HUA ,  MCGRODDY KELLY

IPC: H01L33/14 ,  G02F1/1335 ,  G09G3/32 ,  H01L33/08 ,  H01L33/20 ,  H01L33/60 ,  H01L33/62

CPC classification number: H01L33/06 ,  H01L33/0095 ,  H01L33/14 ,  H01L33/20 ,  H01L33/405 ,  H01L33/60 ,  H01L33/62 ,  H01L2224/95 ,  H01L2924/12044 ,  H01L2933/0016 ,  H01L2924/00

Abstract: A method and structure for forming an array of LED devices is disclosed. The LED devices in accordance with embodiments of the invention may include a confined current injection area, embedded mirror, or sidewall passivation layer, and any combination thereof.

Abstract translation: 公开了用于形成LED器件阵列的方法和结构。 根据本发明实施例的LED器件可以包括限制电流注入区域，嵌入式镜面或侧壁钝化层以及它们的任何组合。

公开(公告)号：AU2014370328A1

公开(公告)日：2016-04-07

申请号：AU2014370328

申请日：2014-11-25

Applicant: LUXVUE TECHNOLOGY CORP

Inventor： MCGRODDY KELLY ,  HU HSIN-HUA ,  BIBL ANDREAS ,  CHAN CLAYTON KA TSUN ,  HAEGER DANIEL ARTHUR

IPC: H01L33/14 ,  G02F1/1335 ,  G09G3/32 ,  H01L23/00 ,  H01L25/075 ,  H01L27/12 ,  H01L27/15 ,  H01L33/16 ,  H01L33/20

Abstract: Methods and structures for forming arrays of LED devices are disclosed. The LED devices in accordance with embodiments of the invention may include an internally confined current injection area to reduce non-radiative recombination due to edge effects. Several manners for confining current may include etch removal of a current distribution layer, etch removal of a current distribution layer and active layer followed by mesa re-growth, isolation by ion implant or diffusion, quantum well intermixing, and oxide isolation.

公开(公告)号：GB2522590A

公开(公告)日：2015-07-29

申请号：GB201509556

申请日：2013-12-10

Applicant: LUXVUE TECHNOLOGY CORP

Inventor： SAKARIYA KAPIL V ,  BIBL ANDREAS ,  MCGRODDY KELLY

IPC: G09G3/32 ,  G02F1/133 ,  H01L25/16

Abstract: A light emitting assembly is described. In one embodiment, one or more light emitting diode (LED) devices and one or more microcontrollers are bonded to a same side of a substrate, with the one or more microcontrollers to switch and drive the one or more LED devices.