公开(公告)号：WO2013162927A1

公开(公告)日：2013-10-31

申请号：PCT/US2013036477

申请日：2013-04-12

Applicant: LUXVUE TECHNOLOGY CORP

Inventor： HU HSIN-HUA ,  BIBL ANDREAS

IPC: H01L33/36

CPC classification number: H01L27/156 ,  H01L24/75 ,  H01L24/83 ,  H01L24/95 ,  H01L25/0753 ,  H01L33/0079 ,  H01L33/0095 ,  H01L33/20 ,  H01L33/405 ,  H01L33/44 ,  H01L2224/7598 ,  H01L2224/95 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/00

Abstract: A method of fabricating and transferring a micro device and an array of micro devices to a receiving substrate are described. In an embodiment, a patterned sacrificial layer is utilized to form a self-aligned metallization stack and is utilized as an etch stop layer during etching of a p-n diode layer to form a plurality of micro p-n diodes.

Abstract translation: 描述了将微器件和微器件阵列制造和传送到接收衬底的方法。 在一个实施例中，利用图案化的牺牲层来形成自对准金属化堆叠，并且在蚀刻p-n二极管层以形成多个微型p-n二极管期间用作蚀刻停止层。

公开(公告)号：WO2015171267A2

公开(公告)日：2015-11-12

申请号：PCT/US2015025611

申请日：2015-04-13

Applicant: LUXVUE TECHNOLOGY CORP

Inventor： PARKS PAUL ARGUS ,  LIGHT NILE ALEXANDER ,  BATHURST STEPHEN P ,  HIGGINSON JOHN A ,  BIBL ANDREAS

IPC: B25J7/00

CPC classification number: B25J7/00 ,  B25J9/0015 ,  B25J18/007 ,  Y10T74/20354

Abstract: Systems and methods for transferring a micro device or an array of micro devices to or from a substrate are disclosed. In an embodiment, a remote center robot allows on-the-fly alignment between a micro pick up array and a target substrate. The remote center robot may include a plurality of symmetric linkages that move independently and share a remote rotational center. In an embodiment, the remote rotational center may be positioned at a surface of the micro pick up array to prevent damage to the array of micro devices during transfer.

Abstract translation: 公开了用于将微器件或微阵列阵列转移到衬底或从衬底传送微阵列的系统和方法。 在一个实施例中，远程中心机器人允许微拾取阵列和目标基板之间的即时对准。 远程中心机器人可以包括独立移动并共享远程旋转中心的多个对称联动。 在一个实施例中，远程旋转中心可以定位在微拾取阵列的表面处，以防止在传送期间损坏微器件阵列。

公开(公告)号：EP2780953A4

公开(公告)日：2015-07-22

申请号：EP12849007

申请日：2012-11-08

Applicant: LUXVUE TECHNOLOGY CORP

Inventor： BIBL ANDREAS ,  HIGGINSON JOHN A ,  LAW HUNG-FAI STEPHEN ,  HU HSIN-HUA

IPC: H01L33/36 ,  H01L25/075 ,  H01L33/00 ,  H01L33/20

CPC classification number: H01L33/06 ,  F21V7/00 ,  H01L25/0753 ,  H01L27/15 ,  H01L29/0684 ,  H01L33/0079 ,  H01L33/04 ,  H01L33/20 ,  H01L33/28 ,  H01L33/30 ,  H01L2224/95

Abstract: A micro light emitting diode (LED) and a method of forming an array of micro LEDs for transfer to a receiving substrate are described. The micro LED structure may include a micro p-n diode and a metallization layer, with the metallization layer between the micro p-n diode and a bonding layer. A conformal dielectric barrier layer may span sidewalls of the micro p-n diode. The micro LED structure and micro LED array may be picked up and transferred to a receiving substrate.

公开(公告)号：AU2014367064A1

公开(公告)日：2016-04-07

申请号：AU2014367064

申请日：2014-11-24

Applicant: LUXVUE TECHNOLOGY CORP

Inventor： BIBL ANDREAS ,  SAKARIYA KAPIL V ,  PAVATE VIKRAM

IPC: G06F1/16

Abstract: A display module (201) and system applications including a display module are described. The display module may include a display substrate (202) including a front surface (203), a back surface (205), and a display area (201) on the front surface. A plurality of interconnects (204, 206) extend through the display substrate from the front surface to the back surface. An array (214) of light emitting diodes (LEDs) are in the display area and electrically connected with the plurality of interconnects, and one or more driver circuits (230, 234) are on the back surface of the display substrate. Exemplary system applications include wearable, rollable, and foldable displays.

公开(公告)号：MX336453B

公开(公告)日：2016-01-20

申请号：MX2014006031

申请日：2012-11-08

Applicant: LUXVUE TECHNOLOGY CORP

Inventor： BIBL ANDREAS ,  HIGGINSON JOHN A ,  LAW HUNG-FAI STEPHEN ,  HU HSIN-HUA

IPC: H01L33/36

Abstract: Se describe un método para fabricar y transferir un microdispositivo y un arreglo de microdispositivos a un sustrato receptor. En una modalidad, una capa eléctricamente aislante se utiliza como capa de detención de grabado durante el grabado al ácido de una capa de diodos p-n para formar una pluralidad de microdiodos p-n. En una modalidad, una capa de enlace intermedia eléctricamente conductora se utiliza durante la formación y transferencia de los microdispositivos al sustrato receptor.

公开(公告)号：IN3711CHN2014A

公开(公告)日：2015-10-09

申请号：IN3711CHN2014

申请日：2014-05-16

Applicant: LUXVUE TECHNOLOGY CORP

Inventor： HU HSIN HUA ,  BIBL ANDREAS ,  HIGGINSON JOHN A ,  LAW HUNG FAI STEPHEN

IPC: H01L33/46 ,  H01L33/36 ,  H01L33/48

Abstract: A method of fabricating and transferring a micro device and an array of micro devices to a receiving substrate are described. In an embodiment an electrically insulating layer is utilized as an etch stop layer during etching of a p n diode layer to form a plurality of micro p n diodes. In an embodiment an electrically conductive intermediate bonding layer is utilized during the formation and transfer of the micro devices to the receiving substrate.

公开(公告)号：DE112013004389T5

公开(公告)日：2015-06-03

申请号：DE112013004389

申请日：2013-08-27

Applicant: LUXVUE TECHNOLOGY CORP

Inventor： HIGGINSON JOHN A ,  BIBL ANDREAS ,  ALBERTALLI DAVID

IPC: H01L21/677 ,  B25J9/04 ,  B65G49/07 ,  H01L21/68

Abstract: Es werden Systeme und Verfahren zum Transfer einer Mikrovorrichtung von einem Trägersubstrat offenbart. In einer Ausführungsform enthält ein Massentransferinstrument eine Gelenk-Transferkopf-Einheit, einen Trägersubstrathalter und eine Stellgerät-Einheit, um ein räumliches Verhältnis zwischen einer Gelenk-Transferkopf-Einheit und dem Trägersubstrathalter anzupassen. Die Gelenk-Transferkopf-Einheit kann eine Verbindung zu einer elektrostatischen Spannungsquelle und ein Substrat, das ein Array von elektrostatischen Transferköpfen trägt, enthalten.

公开(公告)号：WO2015094601A3

公开(公告)日：2015-10-29

申请号：PCT/US2014067190

申请日：2014-11-24

Applicant: LUXVUE TECHNOLOGY CORP

Inventor： BIBL ANDREAS ,  SAKARIYA KAPIL V ,  PAVATE VIKRAM

IPC: G06F1/16 ,  G04G17/04 ,  G09F9/33 ,  G09G3/32 ,  H01L25/075 ,  H01L25/16 ,  H05K1/11 ,  H05K1/18

CPC classification number: H01L25/167 ,  G04G9/10 ,  G06F1/163 ,  G06F1/1652 ,  G06F3/0412 ,  G06F3/042 ,  G06F3/14 ,  G09G3/32 ,  G09G2380/02 ,  H01L23/293 ,  H01L23/3171 ,  H01L23/5384 ,  H01L23/5386 ,  H01L23/5387 ,  H01L25/0753 ,  H01L31/0216 ,  H01L31/16 ,  H01L33/44 ,  H01L33/62 ,  H01L2924/0002 ,  H05K1/115 ,  H05K1/147 ,  H05K1/189 ,  H05K2201/10106 ,  H05K2201/10128 ,  H01L2924/00

Abstract: A display module (201) and system applications including a display module are described. The display module may include a display substrate (202) including a front surface (203), a back surface (205), and a display area (201) on the front surface. A plurality of interconnects (204, 206) extend through the display substrate from the front surface to the back surface. An array (214) of light emitting diodes (LEDs) are in the display area and electrically connected with the plurality of interconnects, and one or more driver circuits (230, 234) are on the back surface of the display substrate. Exemplary system applications include wearable, rollable, and foldable displays.

Abstract translation: 描述了显示模块（201）和包括显示模块的系统应用。 显示模块可以包括前表面（203），后表面（205）和前表面上的显示区域（201）的显示基板（202）。 多个互连件（204,206）从前表面到后表面延伸穿过显示基板。 发光二极管（LED）的阵列（214）在显示区域中并与多个互连件电连接，并且一个或多个驱动电路（230,234）位于显示基板的背面。 示例性系统应用包括可穿戴的，可滚动的和可折叠的显示器。

公开(公告)号：EP2780933A4

公开(公告)日：2015-11-04

申请号：EP12850120

申请日：2012-11-07

Applicant: LUXVUE TECHNOLOGY CORP

Inventor： BIBL ANDREAS ,  HIGGINSON JOHN A ,  LAW HUNG-FAI STEPHEN ,  HU HSIN-HUA

IPC: H01L33/46 ,  B32B37/00 ,  B32B37/06 ,  H01L21/67 ,  H01L21/683 ,  H01L23/00 ,  H01L33/00 ,  H01L33/20 ,  H01L33/36 ,  H01L33/48

CPC classification number: H01L24/83 ,  B32B37/025 ,  B32B37/06 ,  B32B2457/20 ,  H01L21/67144 ,  H01L21/6833 ,  H01L24/75 ,  H01L24/95 ,  H01L24/97 ,  H01L2224/75725 ,  H01L2224/7598 ,  H01L2224/83005 ,  H01L2224/97 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/12041 ,  H01L2924/1421 ,  H01L2924/1431 ,  H01L2924/1434 ,  H01L2924/1461 ,  H01L2924/15153 ,  Y10T156/1153 ,  Y10T156/1707 ,  Y10T156/1744 ,  Y10T156/1749 ,  Y10T156/1776 ,  H01L2224/83 ,  H01L2924/00

公开(公告)号：EP2780934A4

公开(公告)日：2015-07-22

申请号：EP12850366

申请日：2012-11-07

Applicant: LUXVUE TECHNOLOGY CORP

Inventor： BIBL ANDREAS ,  HIGGINSON JOHN A ,  LAW HUNG-FAI STEPHEN ,  HU HSIN-HUA

IPC: H01L21/58 ,  B32B37/00 ,  B32B37/06 ,  H01L21/48 ,  H01L21/67 ,  H01L21/677 ,  H01L21/683 ,  H01L23/00 ,  H05K13/04

CPC classification number: H01L24/83 ,  B32B37/025 ,  B32B37/06 ,  B32B2457/20 ,  H01L21/67144 ,  H01L21/6833 ,  H01L24/75 ,  H01L24/95 ,  H01L24/97 ,  H01L2224/75725 ,  H01L2224/7598 ,  H01L2224/83005 ,  H01L2224/97 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/12041 ,  H01L2924/1421 ,  H01L2924/1431 ,  H01L2924/1434 ,  H01L2924/1461 ,  H01L2924/15153 ,  Y10T156/1153 ,  Y10T156/1707 ,  Y10T156/1744 ,  Y10T156/1749 ,  Y10T156/1776 ,  H01L2224/83 ,  H01L2924/00