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    Thermal management and/or EMI mitigation materials including coated fillers
    1.
    发明授权
    Thermal management and/or EMI mitigation materials including coated fillers 有权

    公开(公告)号：US11411263B2

    公开(公告)日：2022-08-09

    申请号：US16811684

    申请日：2020-03-06

    Applicant: Laird Technologies, Inc.

    Inventor： Jason L. Strader ,  John Song

    IPC: H01M10/653 ,  C04B14/06 ,  H05K9/00 ,  H01M50/116 ,  H01M50/124 ,  H01M50/20

    Abstract: Disclosed are exemplary embodiments of thermal management and/or electromagnetic interference (EMI) mitigation materials including coated fillers (e.g., coated thermally-conductive, electrically-conductive, dielectric absorbing, and/or electromagnetic wave absorbing particles, sand particles coated with a binder, other coated functional fillers, combinations thereof, etc.). For example, a thermal management and/or EMI mitigation material may comprise a thermal interface material (TIM) including one or more coated fillers (e.g., coated thermally-conductive particles, sand particles coated with a binder, etc.), whereby the TIM is suitable for providing a thermal management solution for one or more batteries and/or battery packs (e.g., a battery pack for electric vehicle, etc.), or other device(s), etc.

    MID-PLATES AND ELECTROMAGNETIC INTERFERENCE (EMI) BOARD LEVEL SHIELDS WITH EMBEDDED AND/OR INTERNAL HEAT SPREADERS
    7.
    发明申请
    MID-PLATES AND ELECTROMAGNETIC INTERFERENCE (EMI) BOARD LEVEL SHIELDS WITH EMBEDDED AND/OR INTERNAL HEAT SPREADERS 审中-公开
    嵌入式和/或内部散热器的中板和电磁干扰（EMI）板级

    公开(公告)号：US20160242321A1

    公开(公告)日：2016-08-18

    申请号：US14734715

    申请日：2015-06-09

    Applicant: Laird Technologies, Inc.

    Inventor： Philip van Haaster ,  Joseph C. Boetto ,  Paul W. Crotty, JR. ,  Kenneth M. Robinson ,  Jason L. Strader

    IPC: H05K7/20 ,  B23P15/26

    CPC classification number: H05K7/20509

    Abstract: According to various aspects, exemplary embodiments are disclosed of mid-plates and EMI shields for electronic devices. In an exemplary embodiment, a mid-plate generally includes one or more recessed portions along a surface of the mid-plate. A heat spreader is within the one or more recessed portions. Dielectric is along an outward-facing surface of the heat spreader. The dielectric inhibits the heat spreader from directly contacting and electrically shorting one or more components. In another exemplary embodiment, a board level shield (BLS) generally includes a cover having one or more recessed portions along an inner surface of the cover. A heat spreader is within the one or more recessed portions. Dielectric is along an outward-facing surface of the heat spreader, whereby the dielectric inhibits the heat spreader from directly contacting and electrically shorting one or more components when the one or more components are under the BLS.

    Abstract translation: 根据各个方面，公开了用于电子设备的中间板和EMI屏蔽的示例性实施例。 在示例性实施例中，中间板通常包括沿着中间板的表面的一个或多个凹部。 散热器在一个或多个凹部内。 电介质沿着散热器的向外表面。 电介质阻止散热器直接接触和电短路一个或多个部件。 在另一示例性实施例中，板级屏蔽（BLS）通常包括沿着盖的内表面具有一个或多个凹部的盖。 散热器在一个或多个凹部内。 电介质沿着散热器的向外表面，由此当所述一个或多个部件在BLS之下时，介电体阻止散热器直接接触和电短路一个或多个部件。

    Non-Condensing Thermal Materials With Low Sulfur Content
    10.
    发明申请
    Non-Condensing Thermal Materials With Low Sulfur Content 有权

    公开(公告)号：US20250098121A1

    公开(公告)日：2025-03-20

    申请号：US18885167

    申请日：2024-09-13

    Applicant: Laird Technologies, Inc.

    Inventor： Karen J. BRUZDA ,  John D. Ryan ,  Jason L. Strader

    IPC: H05K7/20

    Abstract: The present disclosure relates to non-condensing thermal materials (e.g., thermal interface materials (TIMs), thermally-conductive pads, thermally-conductive EMI absorbers, etc.) with low sulfur content. In exemplary embodiments, a thermal interface material has a thermal conductivity of at least 4.5 Watts per meter per Kelvin (W/mK). The thermal interface material includes less than 50 parts per million (PPM) sulfur. And the thermal interface material is configured to be non-condensing. The thermal interface material may comprise a thermally-conductive EMI absorber; and/or the thermal interface material may be silicone free and/or have no detectable silicone.

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