公开(公告)号：EP1942524A2

公开(公告)日：2008-07-09

申请号：EP07123215.1

申请日：2007-12-14

Applicant: M/A-COM, INC.

Inventor： Anderson, Richard

IPC: H01L23/58

CPC classification number: H01L23/49861 ,  H01L23/49541 ,  H01L23/66 ,  H01L2223/6622 ,  H01L2224/16 ,  H01L2224/73204 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/3025 ,  H01L2224/0401

Abstract: A apparatus and method for providing a radio frequency ("RF") input/output ("I/O") land grid array ("LGA") package (301) structure is described. The package structure comprises grounded shield rings (307) surrounding free-standing RF I/O interconnects (305). The free-standing RF I/O interconnects (305) eliminate long leads and the shield rings (307) provide ground protection thereby minimizing losses, inductance, leakage, and crosstalk, and improving performance.

Abstract translation: 描述了用于提供射频（“RF”）输入/输出（“I / O”）陆地格阵列（“LGA”）封装（301）结构的装置和方法。 封装结构包括围绕独立式RF I / O互连（305）的接地屏蔽环（307）。 独立的RF I / O互连（305）消除长引线，屏蔽环（307）提供接地保护，从而最大限度地减少损耗，电感，泄漏和串扰，并提高性能。