公开(公告)号：EP0231560A1

公开(公告)日：1987-08-12

申请号：EP86300398.4

申请日：1986-01-21

Applicant: M/A-COM, INC.

Inventor： Armstrong, Albert L. ,  Moroney, William

IPC: H01L29/90 ,  H03G11/00 ,  H01L23/66

CPC classification number: H01L23/66 ,  H01L2924/0002 ,  H03G11/025 ,  H01L2924/00

Abstract: A method of making a microwave semiconductor component and concurrently forming therewith a mounting membrane adapted for positioning the semiconductor component in an RF transmission medium such as a waveguide. Substantially concurrently with the deposition of a metallic film in connection with forming a semiconductor elements, there is deposited a metallic membrane on the base silicon substrate and outside of the circuit element. The outer periphery of the base substrate is removed to expose the membrane. The metallic membrane is preferably of gold.

Abstract translation: 一种制造微波半导体部件并且同时形成适于将半导体部件定位在诸如波导的RF传输介质中的安装膜的方法。 在与形成半导体元件相关的金属膜沉积的同时，在基底硅基板上和电路元件外部沉积金属膜。 去除基底基材的外周以露出膜。 金属膜优选为金。

公开(公告)号：EP0231560B1

公开(公告)日：1992-09-23

申请号：EP86300398.4

申请日：1986-01-21

Applicant: M/A-COM, INC.

Inventor： Armstrong, Albert L. ,  Moroney, William

IPC: H01L29/90 ,  H03G11/00 ,  H01L23/66

CPC classification number: H01L23/66 ,  H01L2924/0002 ,  H03G11/025 ,  H01L2924/00