Abstract:
The invention is a method and apparatus for dissipating heat in a dielectric resonator circuit in which resonators are mounted to an enclosure by highly thermally and electrically conductive supports, such as metal rods, that pass through the longitudinal through hole in the center of the resonator. The supports preferably are attached within the through holes by a highly thermally conductive, but dielectric sleeve positioned between the support and the resonator. The rod or support has a diameter selected to minimize any reduction in quality factor, Q, for the circuit. Alternately, the support can be a highly thermally conductive dielectric and the inner wall of the through hole can be metalized. The invention is a method and apparatus for dissipating heat in a dielectric resonator circuit in which resonators are mounted to an enclosure by highly thermally and electrically conductive supports, such as metal rods, that pass through the longitudinal through hole in the center of the resonator. The supports preferably are attached within the through holes by a highly thermally conductive, but dielectric sleeve positioned between the support and the resonator. The rod or support has a diameter selected to minimize any reduction in quality factor, Q, for the circuit. Alternately, the support can be a highly thermally conductive dielectric and the inner wall of the through hole can be metalized.
Abstract:
The invention is a method and apparatus for dissipating heat in a dielectric resonator circuit in which resonators are mounted to an enclosure by highly thermally and electrically conductive supports, such as metal rods, that pass through the longitudinal through hole in the center of the resonator. The supports preferably are attached within the through holes by a highly thermally conductive, but dielectric sleeve positioned between the support and the resonator. The rod or support has a diameter selected to minimize any reduction in quality factor, Q, for the circuit. Alternately, the support can be a highly thermally conductive dielectric and the inner wall of the through hole can be metalized.
Abstract:
The invention is a method and apparatus for dissipating heat in a dielectric resonator circuit in which resonators are mounted to an enclosure by highly thermally and electrically conductive supports, such as metal rods, that pass through the longitudinal through hole in the center of the resonator. The supports preferably are attached within the through holes by a highly thermally conductive, but dielectric sleeve positioned between the support and the resonator. The rod or support has a diameter selected to minimize any reduction in quality factor, Q, for the circuit. Alternately, the support can be a highly thermally conductive dielectric and the inner wall of the through hole can be metalized.
Abstract:
A cross-coupled dielectric resonator circuit. Resonator circuits in accordance with the invention may be used to build low-loss compact filters, oscillators, and other circuits, particularly microwave circuits. The resonators are arranged relatively to each othe within an enclosure in a very efficient and compact design that enhances adjustability and coupling between adjacent resonators and the cross-coupling of alternate resonators.
Abstract:
The present invention is directed to a dual polarization planar antenna. The antenna comprises a first layer comprising a first patch (134; 539) and a second layer beneath the first layer comprising a first feed line (105a; 505a) for coupling a first signal to the first patch (134; 539) and a second feed line (105b; 505b) for coupling a second signal to the first patch (134; 539) such that the first patch (134; 539) radiates a field that has two different polarizations. The antenna also includes a third layer comprising first and second coupling discs (122a, 122b; 522a, 522b) electrically connected to the first feed line (105a; 505a) and third and fourth coupling discs electrically connected to the second feed line (105b; 505b). The first and second discs (122a, 122b; 522a, 522b) are electrically coupled to each other by a first half wavelength conductor (112, 523) and the third and fourth discs (122c, 122d; 522c, 522d) are electrically coupled the each other by a second half wavelength conductor (116, 525), the first and second half wavelength conductors not being disposed in the second layer.
Abstract:
A cross-coupled dielectric resonator circuit. Resonator circuits in accordance with the invention may be used to build low-loss compact filters, oscillators, and other circuits, particularly microwave circuits. The resonators are arranged relatively to each other within an enclosure in a very efficient and compact design that enhances adjustability and coupling between adjacent resonators and the cross-coupling of alternate resonators.
Abstract:
The invention is a dielectric resonator in the shape of a truncated cone and variations with a longitudinal through hole. The truncated cone shape physically displaces the H 11 mode from the TE mode in the longitudinal direction of the cone. Particularly, the TE mode tends to concentrate in the base of the cone while the H 11 mode tends to concentrate at the top of the cone. By truncating the cone so as to eliminate the portion of the cone where the H 11 mode field exists, yet keep the portion of the cone where the TE mode exists, the H 11 mode can be virtually eliminated while having no effect on the magnitude of the TE mode. Resonators in accordance with the invention may be used to build low-loss compact and/or variable bandwidth filters, oscillators, and other circuits, particularly microwave circuits. The conical resonators are arranged relatively to each other within an enclosure in a very efficient and compact design that enhances coupling and the adjustability between adjacent resonators. A plurality of conical dielectric resonators may be arranged in the enclosure such that the longitudinal orientation of each resonator is inverted relative to its adjacent resonator(s). Alternately, the conical resonators may be arranged in a radial pattern relative to each other. The invention also comprises a spiral coupling loop that provides greater magnetic flux in the same physical volume. Further, conical resonators can be positioned relative to microstrips on printed circuit boards and other substrates so as to provide enhanced electromagnetic coupling between the resonator and the microstrip. Particularly, because the TE mode tends to be concentrated in the base portion of the resonator, the resonator can be mounted upside down to the substrate in the vicinity of the microstrip. In this manner, the TE mode field concentration is positioned above and more closely to the microstrip than with cylindrical resonators. Accordingly, the TE mode field can be positioned much closer to the microstrip than previously possible.