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    METHOD FOR THE MANUFACTURE OF PRINTED CIRCUIT BOARDS WITH INTEGRAL PLATED RESISTORS
    1.
    发明申请
    METHOD FOR THE MANUFACTURE OF PRINTED CIRCUIT BOARDS WITH INTEGRAL PLATED RESISTORS 审中-公开
    印制电路板与整体电阻制作方法

    公开(公告)号：WO2004036964A2

    公开(公告)日：2004-04-29

    申请号：PCT/US2003/024499

    申请日：2003-08-06

    Applicant: MACDERMID, INCORPORATED

    Inventor： KUKANSKIS, Peter ,  DURSO, Frank ,  SAWOSKA, David

    IPC: H05K

    CPC classification number: H01C17/06 ,  C23C18/1605 ,  C23C18/1651 ,  C23C18/32 ,  C23C18/42 ,  H05K1/167 ,  H05K3/184 ,  H05K3/244 ,  H05K3/28 ,  H05K2203/0565 ,  H05K2203/1453

    Abstract: The present invention is a process for manufacturing resistors integral with the printed circuit board by plating the resistors onto the insulative substrate. The invention uses a mask during the activation step so as to selectively activate only selected portions of the surface thus enabling smaller areas to be plated on the printed circuit board because no plating mask is used. The process of the instant invention produced printed circuit boards having greater uniformity and reliability as compared to the prior art.

    Abstract translation: 本发明是通过将电阻器电镀到绝缘基板上来制造与印刷电路板成一体的电阻器的方法。 本发明在激活步骤期间使用掩模，以便仅选择性地激活表面的选定部分，从而使得能够在印刷电路板上镀更小的区域，因为不使用电镀掩模。 与现有技术相比，本发明的方法生产出具有更大的均匀性和可靠性的印刷电路板。

    PROCESS FOR CREATING A PATTERN ON A COPPER SURFACE
    3.
    发明申请
    PROCESS FOR CREATING A PATTERN ON A COPPER SURFACE 审中-公开
    在铜表面上形成图案的方法

    公开(公告)号：WO2007126516A2

    公开(公告)日：2007-11-08

    申请号：PCT/US2007/005105

    申请日：2007-02-27

    Applicant: MACDERMID, INCORPORATED

    Inventor： SAWOSKA, David ,  KROL, Andrew, M. ,  CASTALDI, Steven, A.

    IPC: B05D5/00 ,  B05D3/00

    CPC classification number: H05K3/061 ,  B41M5/0047 ,  B41M5/0058 ,  C23F1/18 ,  H05K3/383 ,  H05K2203/013 ,  H05K2203/1173

    Abstract: A process for printing inks or organic resists using a droplet discharge printing mechanism onto a copper or copper alloy surface with increased resolution is described. The increased resolution is achieved by first preferably microetching the surface and then treating the copper surface with an organic substance which is capable of lowering the surface energy of the copper surface or capable of making the copper surface more hydrophobic prior to printing thereon. The process is useful in the manufacture of electronic circuits.

    Abstract translation: 描述了使用液滴喷射印刷机构将印刷油墨或有机抗蚀剂印刷到铜或铜合金表面上的分辨率提高的方法。 通过首先优选对表面进行微蚀刻，然后用能够降低铜表面的能量或能够使铜表面在其上印刷之前更具疏水性的有机物质来处理铜表面来实现增加的分辨率。 该方法在电子电路的制造中是有用的。

    OXIDIZING ACCELERATOR
    4.
    发明申请
    OXIDIZING ACCELERATOR 审中-公开
    氧化加速器

    公开(公告)号：WO1985000387A1

    公开(公告)日：1985-01-31

    申请号：PCT/US1984000779

    申请日：1984-05-21

    Applicant: MacDERMID, INCORPORATED

    Inventor： MacDERMID, INCORPORATED ,  KUKANSKIS, Peter, E. ,  GRUNWALD, John, J. ,  SAWOSKA, David

    IPC: C23C03/02

    CPC classification number: C23C18/28 ,  H05K3/422

    Abstract: A method of electroless deposition of metal on a non-conductive substrate is disclosed and comprises treating a substrate prior to electroless deposition with a catalyst composition containing a mixed tin-palladium catalyst. An improvement in metal deposition is obtained by contacting the treated substrate with an accelerator bath containing an agent which oxidizes the tin.

    Abstract translation: 公开了一种在非导电基底上无电沉积金属的方法，包括在用含有混合锡 - 钯催化剂的催化剂组合物进行无电沉积之前处理基底。 通过使经处理的基板与含有氧化锡的试剂的加速槽接触来获得金属沉积的改进。

    UV INKJET RESIST
    5.
    发明申请
    UV INKJET RESIST 审中-公开
    紫外线吸收剂

    公开(公告)号：WO2008156523A1

    公开(公告)日：2008-12-24

    申请号：PCT/US2008/005338

    申请日：2008-04-25

    Applicant: MACDERMID, INCORPORATED ,  KROL, Andrew, M. ,  GANJEI, John ,  SAWOSKA, David

    Inventor： KROL, Andrew, M. ,  GANJEI, John ,  SAWOSKA, David

    IPC: C09D11/00 ,  C08J7/04

    CPC classification number: C09D11/101

    Abstract: A UV curable, etch-resistant ink composition for ink jet printing of variable information on printed circuit boards and for printing the circuit boards themselves. The ink composition of the invention includes a novel thermal stabilizer for preventing the ink composition from hardening and gelling in the print head when heated.

    Abstract translation: 一种用于喷墨印刷印刷电路板上的可变信息并用于印刷电路板本身的UV可固化，耐蚀刻油墨组合物。 本发明的油墨组合物包括一种新颖的热稳定剂，用于防止油墨组合物在加热时在印刷头中硬化和胶凝。

    OXIDIZING ACCELERATOR
    7.
    发明公开
    OXIDIZING ACCELERATOR 失效
    氧化促进剂。

    公开(公告)号：EP0148209A1

    公开(公告)日：1985-07-17

    申请号：EP84902283.0

    申请日：1984-05-21

    Applicant: MACDERMID, INCORPORATED

    Inventor： KUKANSKIS, Peter, E. ,  GRUNWALD, John, J. ,  SAWOSKA, David

    IPC: C23C18 ,  H05K3

    CPC classification number: C23C18/28 ,  H05K3/422

    Abstract: Procédé de déposition de métal sans apport de courant électrique sur un substrat non conducteur, comportant le traitement d'un substrat avant la déposition sans apport de courant électrique au moyen d'une composition catalytique contenant un catalyseur d'étain et de palladium mélangés. On améliore la déposition du métal en mettant le substrat traité en contact avec un bain accélérateur contenant un agent oxydant l'étain.

    OXIDIZING ACCELERATOR
    8.
    发明授权
    OXIDIZING ACCELERATOR 失效
    氧化加速器

    公开(公告)号：EP0148209B1

    公开(公告)日：1988-11-02

    申请号：EP84902283.5

    申请日：1984-05-21

    Applicant: MACDERMID, INCORPORATED

    Inventor： KUKANSKIS, Peter, E. ,  GRUNWALD, John, J. ,  SAWOSKA, David

    IPC: C23C18/28

    CPC classification number: C23C18/28 ,  H05K3/422

    Abstract: A method of electroless deposition of metal on a non-conductive substrate is disclosed and comprises treating a substrate prior to electroless deposition with a catalyst composition containing a mixed tin-palladium catalyst. An improvement in metal deposition is obtained by contacting the treated substrate with an accelerator bath containing an agent which oxidizes the tin.

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