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公开(公告)号：DE69015164T2
公开(公告)日：1995-05-24
申请号：DE69015164
申请日：1990-12-24
Applicant: MACDERMID INC
Inventor： BENGSTON JON E
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公开(公告)号：CA2046202C
公开(公告)日：1997-06-10
申请号：CA2046202
申请日：1991-07-04
Applicant: MACDERMID INC
Inventor： BENGSTON JON E , LARSON GARY B
Abstract: Conductive copper areas of printed circuits, such as through-holes, pads and lands, to which electronic components can thereafter be electrically connected by, e.g., wave soldering, are provided with a coating of nickel or cobalt, such as by electroless deposition from nickel-or cobalt-boron and nickel-or cobalt-phosphorous plating baths, or entirely or partly electrolytically, followed by a coating of a protective material which protects the nickel or cobalt coating from oxidation prior to the subsequent solder connection operation, is wettable by solder in the subsequent solder connection operation, and substantially dissolves in the solder in the subsequent solder connection operation without adverse effect on the solder joint between the electronic component and the through-hole, pad or land. A particular preferred protective material is gold, such as applied by deposition from immersion or electroless gold plating baths. The invention renders the so-treated areas readily susceptible to the soldering of components thereat, thereby avoiding the need for hot air solder levelling.
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公开(公告)号：DE69015164D1
公开(公告)日：1995-01-26
申请号：DE69015164
申请日：1990-12-24
Applicant: MACDERMID INC
Inventor： BENGSTON JON E
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公开(公告)号：ES2068351T3
公开(公告)日：1995-04-16
申请号：ES90314246
申请日：1990-12-24
Applicant: MACDERMID INC
Inventor： BENGSTON JON E
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Patent Agency Ranking
公开(公告)号：CA2046202A1
公开(公告)日：1992-03-13
申请号：CA2046202
申请日：1991-07-04
Applicant: MACDERMID INC
Inventor： BENGSTON JON E , LARSON GARY B
Abstract: Conductive copper areas of printed circuits, such as through-holes, pads and lands, to which electronic components can thereafter be electrically connected by, e.g., wave soldering, are provided with a coating of nickel or cobalt, such as by electroless deposition from nickel-or cobalt-boron and nickel-or cobalt-phosphorous plating baths, or entirely or partly electrolytically, followed by a coating of a protective material which protects the nickel or cobalt coating from oxidation prior to the subsequent solder connection operation, is wettable by solder in the subsequent solder connection operation, and substantially dissolves in the solder in the subsequent solder connection operation without adverse effect on the solder joint between the electronic component and the through-hole, pad or land. A particular preferred protective material is gold, such as applied by deposition from immersion or electroless gold plating baths. The invention renders the so-treated areas readily susceptible to the soldering of components thereat, thereby avoiding the need for hot air solder levelling.
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公开(公告)号：CA2031549A1
公开(公告)日：1991-11-09
申请号：CA2031549
申请日：1990-12-05
Applicant: MACDERMID INC
Inventor： BENGSTON JON E
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公开(公告)号：CA2031549C
公开(公告)日：1998-04-28
申请号：CA2031549
申请日：1990-12-05
Applicant: MACDERMID INC
Inventor： BENGSTON JON E
Abstract: Conductive surfaces such as copper and/or tungsten surfaces, particularly copper circuitry areas of printed circuit board substrates or fused tungsten circuitry areas of fused tungsten-ceramic packages, are activated for receipt of electroless nickel plating thereon by providing the surfaces with particulate zinc metal, particularly by contact of the surfaces with an aqueous suspension of particulate zinc metal.
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公开(公告)号：DE69125233T2
公开(公告)日：1997-08-14
申请号：DE69125233
申请日：1991-07-17
Applicant: MACDERMID INC
Inventor： BENGSTON JON E , LARSON GARY B
Abstract: Conductive copper areas of printed circuits, such as through-holes, pads and lands, to which electronic components can thereafter be electrically connected by, e.g., wave soldering, are provided with a coating of nickel or cobalt, such as by electroless deposition from nickel- or cobalt-boron and nickel-or cobalt-phosphorous plating baths, or entirely or partly electrolytically, followed by a coating of a protective material which protects the nickel or cobalt coating from oxidation prior to the subsequent solder connection operation, is wettable by solder in the subsequent solder connection operation, and substantially dissolves in the solder in the subsequent solder connection operation without adverse effect on the solder joint between the electronic component and the through-hole, pad or land. A particular preferred protective material is gold, such as applied by deposition from immersion or electroless gold plating baths. The invention renders the so-treated areas readily susceptible to the soldering of components thereat, thereby avoiding the need for hot air solder levelling.
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公开(公告)号：DE69125233D1
公开(公告)日：1997-04-24
申请号：DE69125233
申请日：1991-07-17
Applicant: MACDERMID INC
Inventor： BENGSTON JON E , LARSON GARY B
Abstract: Conductive copper areas of printed circuits, such as through-holes, pads and lands, to which electronic components can thereafter be electrically connected by, e.g., wave soldering, are provided with a coating of nickel or cobalt, such as by electroless deposition from nickel- or cobalt-boron and nickel-or cobalt-phosphorous plating baths, or entirely or partly electrolytically, followed by a coating of a protective material which protects the nickel or cobalt coating from oxidation prior to the subsequent solder connection operation, is wettable by solder in the subsequent solder connection operation, and substantially dissolves in the solder in the subsequent solder connection operation without adverse effect on the solder joint between the electronic component and the through-hole, pad or land. A particular preferred protective material is gold, such as applied by deposition from immersion or electroless gold plating baths. The invention renders the so-treated areas readily susceptible to the soldering of components thereat, thereby avoiding the need for hot air solder levelling.
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