公开(公告)号：WO2006052310A3

公开(公告)日：2006-12-21

申请号：PCT/US2005028628

申请日：2005-08-10

Applicant: MACDERMID INC

Inventor： BUNCE SIONA ,  ROWAN ANTHONY ,  LONG ERNEST

IPC: C23C16/00 ,  C25D3/12

CPC classification number: C25D3/12 ,  C25D5/12

Abstract: A nickel electroplating bath is disclosed which is suitable for plating, a base layer of nickel over zinc or zinc alloy parts. Subsequent plating onto this base layer can be achieved with copper, chromium or bright nickel with good adhesion and appearance. The nickel electroplating solution proposed comprises an additive package comprising (i) sulphonic acid or sulphonic acid salts, (ii) sulfonated alkoxylate and (iii) organic acid selected from the group consisting of tolylacetic acid, salicylic acid, hydroxy-benzoic acid, benzyloxyacetone and mixtures of the foregoing.

Abstract translation: 公开了适用于电镀的镍电镀浴，锌或锌合金部件上的镍基底层。 用铜，铬或光亮镍具有良好的附着力和外观，可以在此基层上进行后续电镀。 所提出的电镀镍溶液包含添加剂包，其包含（i）磺酸或磺酸盐，（ii）磺化烷氧基化物和（iii）选自甲基乙酸，水杨酸，羟基苯甲酸，苄氧基丙酮和 前述的混合物。