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    PULSE REVERSE ELECTROLYSIS OF ACIDIC COPPER ELECTROPLATING SOLUTIONS
    1.
    发明申请
    PULSE REVERSE ELECTROLYSIS OF ACIDIC COPPER ELECTROPLATING SOLUTIONS 审中-公开
    酸性电镀解决方案的脉冲反向电解

    公开(公告)号：WO2006011922A3

    公开(公告)日：2007-02-22

    申请号：PCT/US2005008502

    申请日：2005-03-15

    Applicant: MACDERMID INC

    Inventor： HERDMAN RODERICK D ,  PEARSON TREVOR ,  LONG ERNEST ,  GARDNER ALAN

    IPC: C25D7/00 ,  C25D3/38 ,  C25D5/18 ,  C25D7/04

    CPC classification number: C25D5/18 ,  C25D3/38

    Abstract: Pulse reverse electrolysis of acid copper solutions is used for applying copper to printing cylinders, especially gravure printing cylinders. The plating composition generally comprising copper ions, counter ions, chloride ions, a polyalkylene glycol, and a bath-soluble divalent sulfur compound. The benefits include an improved thickness distribution of the copper electrodeposited on the plated article, reduced metal waste, reduced plating times and increased production capacity.

    Abstract translation: 酸性铜溶液的脉冲反向电解用于将铜应用于印刷滚筒，尤其是凹版印刷滚筒。 电镀组合物通常包含铜离子，抗衡离子，氯离子，聚亚烷基二醇和溶于水的二价硫化合物。 其优点包括电镀在电镀品上的铜的厚度分布得到改善，金属废物减少，电镀时间缩短，生产能力提高。

    NICKEL ELECTROPLATING BATH DESIGNED TO REPLACE MONOVALENT COPPER STRIKE SOLUTIONS
    4.
    发明申请
    NICKEL ELECTROPLATING BATH DESIGNED TO REPLACE MONOVALENT COPPER STRIKE SOLUTIONS 审中-公开
    镍电镀浴设计用于取代一次性铜制解决方案

    公开(公告)号：WO2006052310A3

    公开(公告)日：2006-12-21

    申请号：PCT/US2005028628

    申请日：2005-08-10

    Applicant: MACDERMID INC

    Inventor： BUNCE SIONA ,  ROWAN ANTHONY ,  LONG ERNEST

    IPC: C23C16/00 ,  C25D3/12

    CPC classification number: C25D3/12 ,  C25D5/12

    Abstract: A nickel electroplating bath is disclosed which is suitable for plating, a base layer of nickel over zinc or zinc alloy parts. Subsequent plating onto this base layer can be achieved with copper, chromium or bright nickel with good adhesion and appearance. The nickel electroplating solution proposed comprises an additive package comprising (i) sulphonic acid or sulphonic acid salts, (ii) sulfonated alkoxylate and (iii) organic acid selected from the group consisting of tolylacetic acid, salicylic acid, hydroxy-benzoic acid, benzyloxyacetone and mixtures of the foregoing.

    Abstract translation: 公开了适用于电镀的镍电镀浴，锌或锌合金部件上的镍基底层。 用铜，铬或光亮镍具有良好的附着力和外观，可以在此基层上进行后续电镀。 所提出的电镀镍溶液包含添加剂包，其包含（i）磺酸或磺酸盐，（ii）磺化烷氧基化物和（iii）选自甲基乙酸，水杨酸，羟基苯甲酸，苄氧基丙酮和 前述的混合物。

    PROCEDIMIENTO DE PASIVACION SIN CROMO PARA CINC Y ALEACIONES DE CINC.
    5.
    发明专利
    PROCEDIMIENTO DE PASIVACION SIN CROMO PARA CINC Y ALEACIONES DE CINC. 未知

    公开(公告)号：ES2306764T3

    公开(公告)日：2008-11-16

    申请号：ES02723998

    申请日：2002-05-01

    Applicant: MACDERMID INC

    Inventor： BARTLETT IAN ,  LONG ERNEST ,  ROWAN ANTHONY

    IPC: C23C22/34 ,  C23C22/46 ,  C23C22/83 ,  C23C28/00

    Abstract: Un procedimiento para mejorar la resistencia a la corrosión de una superficie que comprende cinc o aleaciones de cinc, comprendiendo dicho procedimiento poner en contacto dicha superficie con una composición que comprende: a) un material seleccionado del grupo consistente en fuentes de iones titanio, titanatos, y mezclas de los anteriores; b) un oxidante seleccionado del grupo consistente en peróxido de hidrógeno, persulfatos, nitratos y mezclas de los anteriores; c) un agente complejante seleccionado del grupo consistente en fluoruros, borofluoruros, bifluoruros, fluoroboratos, fluorosilicatos, y combinaciones de los anteriores; y d) un compuesto seleccionado del grupo consistente en compuestos de metales del grupo II; en el que dicha composición está sustancialmente exenta de silicatos y de dióxido de silicio.

    6.
    发明专利
    未知

    公开(公告)号：DE60227675D1

    公开(公告)日：2008-08-28

    申请号：DE60227675

    申请日：2002-05-01

    Applicant: MACDERMID INC

    Inventor： BARTLETT IAN ,  LONG ERNEST ,  ROWAN ANTHONY

    IPC: C23C22/00 ,  C23C22/34 ,  C23C22/46 ,  C23C22/83 ,  C23C28/00

    Abstract: A non-chrome containing composition and process are disclosed for enhancing the corrosion resistance of zinc or zinc alloy surfaces. The composition comprises a source of titanium ions or titanates, an oxidant and fluorides or complex fluorides. The composition also preferably comprises an organic acid and/or a Group II metal compound, preferably a Group II metal chloride.

    CONTROLLING THE HARDNESS OF ELECTRODEPOSITED COPPER COATINGS BY VARIATION OF CURRENT PROFILE
    7.
    发明申请
    CONTROLLING THE HARDNESS OF ELECTRODEPOSITED COPPER COATINGS BY VARIATION OF CURRENT PROFILE 审中-公开
    通过电流剖面变化控制电沉积铜涂层的硬度

    公开(公告)号：WO2006036252A3

    公开(公告)日：2008-01-24

    申请号：PCT/US2005024184

    申请日：2005-07-11

    Applicant: MACDERMID INC

    Inventor： HERDMAN RODERICK D ,  PEARSON TREVOR ,  LONG ERNEST ,  GARDNER ALAN

    IPC: C25D3/38 ,  C25D5/18

    CPC classification number: C25D5/38 ,  C25D5/18

    Abstract: Pulse reverse electrolysis of acid copper solutions is used for applying copper deposits of a controlled hardness for applications such as producing printing cylinders. The benefits include improved production capacity. Hardness of the deposit is controlled by varying at least one factor selected from the group consisting of (i) cathodic pulse time, (ii) anodic pulse time, (iii) cathodic pulse current density, and (iv) anodic pulse current density. Preferably the ratio of cathodic pulse time to anodic pulse tim is varied. The figure illustrates variation of deposit hardness with reverse (anodic) pulse time.

    Abstract translation: 酸性铜溶液的脉冲反向电解用于施加可控硬度的铜沉积物，用于生产印刷滚筒等应用。 其优点包括提高生产能力。 通过改变至少一个选自（i）阴极脉冲时间，（ii）阳极脉冲时间，（iii）阴极脉冲电流密度和（iv）阳极脉冲电流密度）的因素来控制沉积物的硬度。 优选地，阴极脉冲时间与阳极脉冲tim的比率是变化的。 该图示出了反向（阳极）脉冲时间的沉积硬度的变化。

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