公开(公告)号：US5077099B1

公开(公告)日：1997-12-02

申请号：US49329690

申请日：1990-03-14

Applicant: MACDERMID INC

Inventor： KUKANSKIS PETER E ,  DONLON EDWARD T

IPC: C23C18/38 ,  C23C18/16 ,  H05K3/00 ,  H05K3/18 ,  H05K3/42 ,  C23C26/00

CPC classification number: H05K3/422 ,  C23C18/163 ,  C23C18/1669 ,  H05K3/0088 ,  H05K3/187 ,  H05K3/42 ,  H05K2203/0292

公开(公告)号：CA2029090A1

公开(公告)日：1991-09-15

申请号：CA2029090

申请日：1990-10-31

Applicant: MACDERMID INC

Inventor： KUKANSKIS PETER E ,  DONLON EDWARD T

IPC: C23C18/38 ,  C23C18/16 ,  H05K3/00 ,  H05K3/18 ,  H05K3/42

Abstract: An electroless metal plating process, particularly for use in plating through-holes in printed circuit substrates, (14) and more particularly for additively depositing copper metal on through-hole surfaces, in which the substrate is at least intermittently subjected to vibrating motion in contact with the electroless depositing bath, (12) and an electroless metal depositing apparatus for carrying out the process.

公开(公告)号：ES2057445T5

公开(公告)日：1998-02-16

申请号：ES90313187

申请日：1990-12-05

Applicant: MACDERMID INC

Inventor： KUKANSKIS PETER E ,  DONLON EDWARD T

IPC: C23C18/38 ,  C23C18/16 ,  H05K3/00 ,  H05K3/18 ,  H05K3/42

Abstract: An electroless metal plating process, particularly for use in plating through-holes in printed circuit substrates, (14) and more particularly for additively depositing copper metal on through-hole surfaces, in which the substrate is at least intermittently subjected to vibrating motion in contact with the electroless depositing bath, (12) and an electroless metal depositing apparatus for carrying out the process.

公开(公告)号：CA2042739A1

公开(公告)日：1992-02-01

申请号：CA2042739

申请日：1991-05-16

Applicant: MACDERMID INC

Inventor： DONLON EDWARD T

IPC: H05K3/42 ,  H05K3/10 ,  H05K3/24 ,  H05K3/38 ,  H05K3/46 ,  H01L23/532

Abstract: Multilayer printed circuits, and methods for their fabrication, are provided, characterized in that the conductive circuitry of the circuitry innerlayers is built up from electroless copper, and the surfaces of the electroless copper which confront the sandwiching pre-preg resin layers are provided with a tin coating to promote adhesion of the electroless copper to the pre-preg resin layers. The invention is particularly suitable for preparing multilayer circuits having buried through-holes.

公开(公告)号：DE69009978T3

公开(公告)日：1998-01-29

申请号：DE69009978

申请日：1990-12-05

Applicant: MACDERMID INC

Inventor： KUKANSKIS PETER E ,  DONLON EDWARD T

IPC: C23C18/38 ,  C23C18/16 ,  H05K3/00 ,  H05K3/18 ,  H05K3/42

Abstract: An electroless metal plating process, particularly for use in plating through-holes in printed circuit substrates, (14) and more particularly for additively depositing copper metal on through-hole surfaces, in which the substrate is at least intermittently subjected to vibrating motion in contact with the electroless depositing bath, (12) and an electroless metal depositing apparatus for carrying out the process.

公开(公告)号：DE69009978T2

公开(公告)日：1994-10-27

申请号：DE69009978

申请日：1990-12-05

Applicant: MACDERMID INC

Inventor： KUKANSKIS PETER E ,  DONLON EDWARD T

IPC: C23C18/38 ,  C23C18/16 ,  H05K3/00 ,  H05K3/18 ,  H05K3/42

Abstract: An electroless metal plating process, particularly for use in plating through-holes in printed circuit substrates, (14) and more particularly for additively depositing copper metal on through-hole surfaces, in which the substrate is at least intermittently subjected to vibrating motion in contact with the electroless depositing bath, (12) and an electroless metal depositing apparatus for carrying out the process.

公开(公告)号：CA2029090C

公开(公告)日：1998-04-14

申请号：CA2029090

申请日：1990-10-31

Applicant: MACDERMID INC

Inventor： KUKANSKIS PETER E ,  DONLON EDWARD T

IPC: C23C18/38 ,  C23C18/16 ,  H05K3/00 ,  H05K3/18 ,  H05K3/42 ,  C23C18/30

Abstract: An electroless metal plating process, particularly for use in plating through-holes in printed circuit substrates, and more particularly for additively depositing copper metal on through-hole surfaces, in which the substrate is at least intermittently subjected to vibrating motion in contact with the electroless depositing bath, and an electroless metal depositing apparatus for carrying out the process.

公开(公告)号：ES2057445T3

公开(公告)日：1994-10-16

申请号：ES90313187

申请日：1990-12-05

Applicant: MACDERMID INC

Inventor： KUKANSKIS PETER E ,  DONLON EDWARD T

IPC: C23C18/38 ,  C23C18/16 ,  H05K3/00 ,  H05K3/18 ,  H05K3/42

Abstract: An electroless metal plating process, particularly for use in plating through-holes in printed circuit substrates, (14) and more particularly for additively depositing copper metal on through-hole surfaces, in which the substrate is at least intermittently subjected to vibrating motion in contact with the electroless depositing bath, (12) and an electroless metal depositing apparatus for carrying out the process.

公开(公告)号：DE69009978D1

公开(公告)日：1994-07-21

申请号：DE69009978

申请日：1990-12-05

Applicant: MACDERMID INC

Inventor： KUKANSKIS PETER E ,  DONLON EDWARD T

IPC: C23C18/38 ,  C23C18/16 ,  H05K3/00 ,  H05K3/18 ,  H05K3/42

Abstract: An electroless metal plating process, particularly for use in plating through-holes in printed circuit substrates, (14) and more particularly for additively depositing copper metal on through-hole surfaces, in which the substrate is at least intermittently subjected to vibrating motion in contact with the electroless depositing bath, (12) and an electroless metal depositing apparatus for carrying out the process.