公开(公告)号：US5077099B1

公开(公告)日：1997-12-02

申请号：US49329690

申请日：1990-03-14

Applicant: MACDERMID INC

Inventor： KUKANSKIS PETER E ,  DONLON EDWARD T

IPC: C23C18/38 ,  C23C18/16 ,  H05K3/00 ,  H05K3/18 ,  H05K3/42 ,  C23C26/00

CPC classification number: H05K3/422 ,  C23C18/163 ,  C23C18/1669 ,  H05K3/0088 ,  H05K3/187 ,  H05K3/42 ,  H05K2203/0292

公开(公告)号：DE69701944D1

公开(公告)日：2000-06-15

申请号：DE69701944

申请日：1997-06-19

Applicant: MACDERMID INC

Inventor： KUKANSKIS PETER E ,  YOCIS KATHLEEN ,  LARSON CHRISTOPHER

IPC: C25D5/54 ,  H05K3/42 ,  C25D5/56

Abstract: A conductive metal layer is electroplated onto a substrate comprising both non-conductive and metallic surfaces by: (a) contacting the substrate with a solution of a compound which forms a sacrificial layer on the metallic surfaces only, the sacrificial layer being insoluble in alkaline and neutral media but soluble in acid media; (b) contacting the substrate with a liquid carbon dispersion to deposit a layer of carbon; (c) contacting the substrate with an acidic solution to dissolve the sacrificial layer; and (d) electroplating a conductive metal layer over at least the non-conductive surfaces.

公开(公告)号：ES2057445T5

公开(公告)日：1998-02-16

申请号：ES90313187

申请日：1990-12-05

Applicant: MACDERMID INC

Inventor： KUKANSKIS PETER E ,  DONLON EDWARD T

IPC: C23C18/38 ,  C23C18/16 ,  H05K3/00 ,  H05K3/18 ,  H05K3/42

Abstract: An electroless metal plating process, particularly for use in plating through-holes in printed circuit substrates, (14) and more particularly for additively depositing copper metal on through-hole surfaces, in which the substrate is at least intermittently subjected to vibrating motion in contact with the electroless depositing bath, (12) and an electroless metal depositing apparatus for carrying out the process.

公开(公告)号：CA2031422A1

公开(公告)日：1991-11-02

申请号：CA2031422

申请日：1990-12-04

Applicant: MACDERMID INC

Inventor： RETALLICK RICHARD C ,  LETIZE RAYMOND A ,  KUKANSKIS PETER E

IPC: H05K3/26 ,  C23C18/22 ,  H05K3/00 ,  H05K3/38 ,  H05K3/46 ,  C23C18/20 ,  C23C18/28 ,  C23C18/38

Abstract: The adhesion between surfaces of polyimide, particularly the through hole surfaces of polyimide-based multilayer laminates used in the fabrication of multilayer printed circuits, is improved by pretreatment of the surfaces with an essentially non-alkaline aqueous permanganate solution.

公开(公告)号：CA2029444A1

公开(公告)日：1991-09-22

申请号：CA2029444

申请日：1990-11-07

Applicant: MACDERMID INC

Inventor： LETIZE RAYMOND A ,  GIGAS BERND ,  KUKANSKIS PETER E

IPC: C23F1/34 ,  C23F1/46 ,  H05K3/26

Abstract: A process and related system is disclosed for etching copper with, and regenerating, a working alkaline ammoniacal etchant solution, the regeneration involving withdrawal of a portion of the working solution as spent etchant solution and electrolytic removal therefrom of at least a portion of the etched copper therein so as to produce a fresh etchant solution which is returned to the working solution; accumulation vessels upstream and downstream of the electrolytic process; and supply to the working solution and/or the fresh etchant solution of sufficient oxygen and ammonia to maintain the desired cupric ion content and pH in the working solution.

公开(公告)号：CA2026794A1

公开(公告)日：1991-08-14

申请号：CA2026794

申请日：1990-10-03

Applicant: MACDERMID INC

Inventor： KUKANSKIS PETER E

IPC: B05D1/28 ,  B05D1/36 ,  G03F7/16 ,  H05K3/00 ,  H05K3/06

Abstract: Planar substrate surfaces used in the fabrication of printed circuit boards are provided with a substantially uniform and defect-free coating of liquid photoresist by roller coating in a process in which a first coating roller is used to provide a first layer of liquid photoresist on the substrate surface in less than the ultimately desired thickness, and the thus-treated substrate, without any change in planar orientation, is then provided with additional photoresist, to the ultimately desired thickness, using a distinct (i.e., separate) second coating roller.

公开(公告)号：AU7641087A

公开(公告)日：1988-01-12

申请号：AU7641087

申请日：1987-06-17

Applicant: MACDERMID INC

Inventor： KUKANSKIS PETER E

IPC: H05K3/28 ,  C25D7/00 ,  H05K3/06 ,  H05K3/10 ,  H05K3/24 ,  H05K3/38 ,  H05K3/42 ,  C25D5/02

公开(公告)号：CA1202734A

公开(公告)日：1986-04-01

申请号：CA455904

申请日：1984-06-05

Applicant: MACDERMID INC

Inventor： KUKANSKIS PETER E ,  RHODENIZER HAROLD L

IPC: H05K3/40 ,  C03C20060101 ,  C23C20060101 ,  H05K20060101 ,  H05K3/42

Abstract: Multilayer printed circuit boards typically made of epoxy glass resin with copper innerlayers having drilled thru-holes are well known. The present invention relates to preparing these drilled holes for the application of the conductive metal, usually electrolessly plated copper, and more specifically, relates to chemically treating the surface of the thru-holes to increase its effective surface area to provide improved coverage of the metal deposited on the surface.

公开(公告)号：ZA8403703B

公开(公告)日：1985-09-25

申请号：ZA8403703

申请日：1984-05-16

Applicant: MACDERMID INC

Inventor： KUKANSKIS PETER E ,  RHODENIZER HAROLD L

IPC: H05K3/40 ,  C03C20060101 ,  C23C20060101 ,  H05K20060101 ,  H05K3/42 ,  C03C ,  C23C ,  H05K

公开(公告)号：ES2147967T3

公开(公告)日：2000-10-01

申请号：ES97304322

申请日：1997-06-19

Applicant: MACDERMID INC

Inventor： KUKANSKIS PETER E ,  YOCIS KATHLEEN ,  LARSON CHRISTOPHER

IPC: C25D5/54 ,  H05K3/42 ,  C25D5/56

Abstract: A conductive metal layer is electroplated onto a substrate comprising both non-conductive and metallic surfaces by: (a) contacting the substrate with a solution of a compound which forms a sacrificial layer on the metallic surfaces only, the sacrificial layer being insoluble in alkaline and neutral media but soluble in acid media; (b) contacting the substrate with a liquid carbon dispersion to deposit a layer of carbon; (c) contacting the substrate with an acidic solution to dissolve the sacrificial layer; and (d) electroplating a conductive metal layer over at least the non-conductive surfaces.