公开(公告)号：AU2695202A

公开(公告)日：2002-06-18

申请号：AU2695202

申请日：2001-11-14

Applicant: MACDERMID INC

Inventor： DURSO FRANCIS ,  CASTALDI STEVEN ,  SAWOSKA DAVID

IPC: C23C18/16 ,  H05K3/18

Abstract: A process for the selective activation and plating of a substrate is disclosed. The process involves the application of an activator composition to a substrate in a predetermined pattern by means of a print head wherein the print head moves across the surface of the substrate and selectively deposits the activator composition in said predetermined pattern upon the substrate. The selectively activated substrate is then subjected to electroless plating.

公开(公告)号：WO0247446A3

公开(公告)日：2002-10-10

申请号：PCT/US0143865

申请日：2001-11-14

Applicant: MACDERMID INC

Inventor： DURSO FRANCIS ,  CASTALDI STEVEN ,  SAWOSKA DAVID

IPC: C23C18/16 ,  H05K3/18 ,  B05D5/12

CPC classification number: H05K3/182 ,  C23C18/1608 ,  C23C18/30

Abstract: A process for the selective activation and plating of a substrate is disclosed. The process involves the application of an activator composition to a substrate in a predetermined pattern by means of a print head wherein the print head moves across the surface of the substrate and selectively deposits the activator composition in said predetermined pattern upon the substrate. The selectively activated substrate is then subjected to electroless plating.

Abstract translation: 公开了一种选择性激活和电镀衬底的方法。 该方法涉及通过印刷头以预定图案将活化剂组合物施加到基材上，其中印刷头在基材表面上移动并且选择性地将活化剂组合物以所述预定图案沉积在基材上。 然后对选择性活化的基材进行无电镀。