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公开(公告)号：ES2408708T3
公开(公告)日：2013-06-21
申请号：ES07709589
申请日：2007-01-05
Applicant: MACDERMID INC
Inventor： HERDMAN RODERICK , PEARSON TREVOR
Abstract: Un baño de chapado de cobre para depositar una capa de cobre sobre un cilindro de impresión, comprendiendo elbaño de chapado de cobre: a) una fuente de iones de cobre; b) una fuente de iones metanosulfonato; c) una fuente de iones cloruro; d) un compuesto organosulfurado que tiene la fórmula R-S-R'-SO3 -X+ o X+-O3S-R'-S-R-S-R'-SO3 -X+, donde R es alquilo, hidroxialquilo o éter de alquilo, R' es un grupo alquilo C2-C4 y X+ es un catión; y e) un compuesto poliéter.
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公开(公告)号：WO2007120365A2
公开(公告)日：2007-10-25
申请号：PCT/US2007000395
申请日：2007-01-05
Applicant: MACDERMID INC
Inventor： HERDMAN RODERICK , PEARSON TREVOR
IPC: C25D3/38
Abstract: The present invention is directed to an improved copper plating bath for depositing a copper layer onto a printing cylinder, the copper plating bath comprising: (a) a source, of copper ions; (b) a source of methane sulphonate ions; (c) a source of chloride ions; (d)an organosulphur compound having the formula R-S-R' -SO 3 "X + or X + -O 3 S-R'S-R-S-R' -SO 3 - X + , wherein R is alkyl, hydroxyalkyl or alkyl ether, R' is a C 2 -C 4 alkyl group, and X + is a cation; and (e) a polyether compound and method of using the same. The copper plating bath produces a plating deposit that has a stable hardness and is free from self-annealing during high speed plating.
Abstract translation: 本发明涉及一种用于在印刷滚筒上沉积铜层的改进的镀铜浴，该镀铜浴包括：（a）铜离子源; （b）甲磺酸根离子的来源; （c）氯离子源; （d）具有式RSR'-SO 3“X + +或X + + < - > 3 > -C <4>烷基，并且X + +为阳离子;和（e）聚醚化合物及其使用方法，所述镀铜浴产生电镀沉积物 具有稳定的硬度并且在高速电镀期间不会自行退火。
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公开(公告)号：EP2004404A4
公开(公告)日：2012-06-27
申请号：EP07709589
申请日：2007-01-05
Applicant: MACDERMID INC
Inventor： HERDMAN RODERICK , PEARSON TREVOR
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