公开(公告)号：DE3772370D1

公开(公告)日：1991-09-26

申请号：DE3772370

申请日：1987-06-25

Applicant: MACDERMID INC

Inventor： KUKANSKIS E ,  RHODENIZER HAROLD

IPC: C25D7/00 ,  B05D1/32 ,  C23C18/28 ,  C23C28/00 ,  C25D5/02 ,  H05K3/06 ,  H05K3/10 ,  H05K3/18 ,  H05K3/42 ,  H05K3/46

公开(公告)号：AU7752287A

公开(公告)日：1988-02-24

申请号：AU7752287

申请日：1987-06-25

Applicant: MACDERMID INC

Inventor： KUKANSKIS PETER E ,  RHODENIZER HAROLD

IPC: C25D7/00 ,  B05D1/32 ,  C23C18/28 ,  C23C28/00 ,  C25D5/02 ,  H05K3/06 ,  H05K3/10 ,  H05K3/18 ,  H05K3/42 ,  H05K3/46

公开(公告)号：AT66498T

公开(公告)日：1991-09-15

申请号：AT87905030

申请日：1987-06-25

Applicant: MACDERMID INC

Inventor： KUKANSKIS PETER E ,  RHODENIZER HAROLD

IPC: C25D7/00 ,  B05D1/32 ,  C23C18/28 ,  C23C28/00 ,  C25D5/02 ,  H05K3/06 ,  H05K3/10 ,  H05K3/18 ,  H05K3/42 ,  H05K3/46

公开(公告)号：CA1278877C

公开(公告)日：1991-01-08

申请号：CA541745

申请日：1987-07-09

Applicant: MACDERMID INC

Inventor： KUKANSKIS PETER E ,  RHODENIZER HAROLD

IPC: C25D7/00 ,  B05D1/32 ,  C23C18/28 ,  C23C28/00 ,  C25D5/02 ,  H05K3/06 ,  H05K3/10 ,  H05K3/18 ,  H05K3/42 ,  H05K3/46

Abstract: Printed circuit boards containing thru-holes requiring metallization are manufactured by first applying to the board material an alkaline strippable resist in a predetermined desired pattern, thereafter applying material catalytic to subsequent metallization, thereafter treating the board with an aqueous alkaline solution to remove catalytic material from resist surfaces without adversely affecting the catalyst at non-resist areas, and then metallizing the non-resist areas. The ability to preliminarily apply the resist pattern before catalyst application, metallization, etc., yet prevent metallization of the resist, enables the manufacturing process to proceed straight through the activation, metallization, etc. steps without need for interruption for resist application.

公开(公告)号：EP0276276A4

公开(公告)日：1989-03-29

申请号：EP87905030

申请日：1987-06-25

Applicant: MACDERMID INC

Inventor： KUKANSKIS PETER E ,  RHODENIZER HAROLD

IPC: C25D7/00 ,  B05D1/32 ,  C23C18/28 ,  C23C28/00 ,  C25D5/02 ,  H05K3/06 ,  H05K3/10 ,  H05K3/18 ,  H05K3/42 ,  H05K3/46

CPC classification number: C25D5/56 ,  H05K3/062 ,  H05K3/108 ,  H05K3/181 ,  H05K3/184 ,  H05K3/427 ,  H05K2203/0706 ,  H05K2203/072 ,  H05K2203/0769 ,  H05K2203/0793 ,  H05K2203/1415 ,  H05K2203/1476 ,  Y10S205/926

Abstract: Printed circuit boards containing through-holes (140) requiring metallization are manufactured by first applying to a circuit board which comprises insulating substrate (100) and metal foil (120) an alkaline strippable resist (180) in a predetermined desired pattern, thereafter applying material catalytic to subsequent metallization, thereafter treating the board with an aqueous alkaline solution to remove catalytic material from resist surfaces without adversely affecting catalyst at the non-resist areas, and then metallizing the non-resist areas to form a metal layer (160). The ability to preliminarily apply the resist pattern before catalyst application, metallization, et cetera, yet prevent metallization of the resist, enables the manufacturing process to proceed straight through the activation, metallization, et cetera steps without need for interruption for resist application.