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1.发明公开Process for the manufacture of printed circuits using electrophoretically deposited organic resists 失效一种使用电泳沉积的有机保护层的制造印刷电路板的过程。
公开(公告)号：EP0517400A1
公开(公告)日：1992-12-09
申请号：EP92304614.8
申请日：1992-05-21
Applicant: MACDERMID INCORPORATED
Inventor： Johnson, James A. , Jobson, Brian , Larson, Gary B.
CPC classification number: C25D13/20 , H05K3/0079 , H05K3/064 , H05K3/385 , H05K2203/0315 , H05K2203/135
Abstract: Copper surfaces upon which organic resins are electrophoretically deposited to serve as, e.g., plating or etch resists in the course of manufacturing printed circuits, are preliminarily provided with a uniformizing/passivating passivating coating layer, such as a layer of copper oxide or phosphate conversion coating, over which the organic resin is electrophoretically deposited, resulting in the organic resin being deposited with substantial uniformity in thickness and properties.
Abstract translation: 在其上的有机树脂的铜表面是电泳沉积到充当，例如，电镀或蚀刻在制造印刷电路的过程中抗蚀剂，预先设置有均匀化/负债婷负债婷涂层，检查作为氧化铜或磷酸盐转化涂层的层 ，在其上的有机树脂电泳沉积，在有机树脂与得到的厚度和性质基本上均匀沉积。
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2.发明授权Process for the manufacture of printed circuits using electrophoretically deposited organic resists 失效一种使用电泳沉积的有机保护层的制造印刷电路板的过程
公开(公告)号：EP0517400B1
公开(公告)日：1996-05-08
申请号：EP92304614.8
申请日：1992-05-21
Applicant: MACDERMID INCORPORATED
Inventor： Johnson, James A. , Jobson, Brian , Larson, Gary B.
CPC classification number: C25D13/20 , H05K3/0079 , H05K3/064 , H05K3/385 , H05K2203/0315 , H05K2203/135
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