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    Method for fabricating printed circuits
    3.
    发明公开
    Method for fabricating printed circuits 失效
    制造印刷电路的方法

    公开(公告)号：EP0475567A3

    公开(公告)日：1994-12-21

    申请号：EP91306486.1

    申请日：1991-07-17

    Applicant: MACDERMID INCORPORATED

    Inventor： Bengston, Jon E. ,  Larson, Gary B.

    IPC: H05K1/09

    CPC classification number: H05K3/244 ,  Y10T29/4921

    Abstract: Conductive copper areas of printed circuits, such as through-holes, pads and lands, to which electronic components can thereafter be electrically connected by, e.g., wave soldering, are provided with a coating of nickel or cobalt, such as by electroless deposition from nickel- or cobalt-boron and nickel-or cobalt-phosphorous plating baths, or entirely or partly electrolytically, followed by a coating of a protective material which protects the nickel or cobalt coating from oxidation prior to the subsequent solder connection operation, is wettable by solder in the subsequent solder connection operation, and substantially dissolves in the solder in the subsequent solder connection operation without adverse effect on the solder joint between the electronic component and the through-hole, pad or land. A particular preferred protective material is gold, such as applied by deposition from immersion or electroless gold plating baths. The invention renders the so-treated areas readily susceptible to the soldering of components thereat, thereby avoiding the need for hot air solder levelling.

    Abstract translation: 印刷电路的导电铜区域（例如通孔，焊盘和焊盘）随后可以通过例如波焊与电子元件电连接，所述导电铜区域例如通过来自镍的无电沉积而提供镍或钴的涂层 - 或钴 - 硼和镍 - 或钴 - 磷电镀浴，或完全或部分电解电解，随后在随后的焊接连接操作之前保护镍或钴涂层免于氧化的保护材料的涂层可被焊料润湿 在随后的焊料连接操作中，并且在随后的焊料连接操作中基本溶解在焊料中，而不会对电子元件与通孔，焊盘或焊盘之间的焊料接合产生不利影响。 特别优选的保护性材料是金，例如通过浸渍或无电镀金浴沉积而施加。 本发明使得这样处理的区域易于在那里焊接组件，从而避免了热空气焊料整平的需要。

    Process for the manufacture of printed circuits using electrophoretically deposited organic resists
    4.
    发明公开
    Process for the manufacture of printed circuits using electrophoretically deposited organic resists 失效
    一种使用电泳沉积的有机保护层的制造印刷电路板的过程。

    公开(公告)号：EP0517400A1

    公开(公告)日：1992-12-09

    申请号：EP92304614.8

    申请日：1992-05-21

    Applicant: MACDERMID INCORPORATED

    Inventor： Johnson, James A. ,  Jobson, Brian ,  Larson, Gary B.

    IPC: H05K3/00 ,  C25D13/20

    CPC classification number: C25D13/20 ,  H05K3/0079 ,  H05K3/064 ,  H05K3/385 ,  H05K2203/0315 ,  H05K2203/135

    Abstract: Copper surfaces upon which organic resins are electrophoretically deposited to serve as, e.g., plating or etch resists in the course of manufacturing printed circuits, are preliminarily provided with a uniformizing/passivating passivating coating layer, such as a layer of copper oxide or phosphate conversion coating, over which the organic resin is electrophoretically deposited, resulting in the organic resin being deposited with substantial uniformity in thickness and properties.

    Abstract translation: 在其上的有机树脂的铜表面是电泳沉积到充当，例如，电镀或蚀刻在制造印刷电路的过程中抗蚀剂，预先设置有均匀化/负债婷负债婷涂层，检查作为氧化铜或磷酸盐转化涂层的层 ，在其上的有机树脂电泳沉积，在有机树脂与得到的厚度和性质基本上均匀沉积。

    Process for manufacturing printed circuit employing selective provision of solderable coating
    6.
    发明公开
    Process for manufacturing printed circuit employing selective provision of solderable coating 失效
    一种用于使用与焊接涂层选择性预知制造电路板的工艺。

    公开(公告)号：EP0517399A1

    公开(公告)日：1992-12-09

    申请号：EP92304613.0

    申请日：1992-05-21

    Applicant: MACDERMID INCORPORATED

    Inventor： Larson, Gary B.

    IPC: H05K3/24 ,  H05K3/10

    CPC classification number: H05K3/243 ,  H05K3/064 ,  H05K3/108 ,  H05K3/28 ,  H05K3/3473 ,  H05K3/427 ,  H05K2203/0582 ,  H05K2203/0796 ,  H05K2203/135 ,  Y10T29/49165

    Abstract: The areas of a printed circuit where electrical components are to be solder connected, such as through-holes (H), surrounding pads (P) and surface mount areas (SMT), are selectively provided with a metal coating (22) (e.g., tin-lead) which preserves and promotes solderability thereat, by a process in which a photoimageable electrophoretically deposited organic resin (20) is used to provide, on an already patterned surface, an additional resist pattern which selectively exposes areas on which the solderable metal coating is to be provided and in which the resist serves also as an etch resist for metal areas over which it is arranged.

    Abstract translation: 的印刷电路，其中的电气元件将被焊料连接，：如通孔（H）周围焊盘（P）表面的区域，和安装区域（SMT），选择性地设置有金属涂层（22）（例如， 锡 - 铅）其保留并在此促进焊性，通过在一光可成像电泳沉积的有机树脂（20的处理）被用于提供，在已图案化额外的表面的抗蚀剂图案，其选择性地暴露区域在其上可焊金属涂层 要被提供，并且其中抗蚀剂供应以便蚀刻抗蚀剂在其被布置的金属区域。

    Method for fabricating printed circuits
    9.
    发明公开
    Method for fabricating printed circuits 失效
    韦尔法罕zur Herstellung von gedruckten Schaltungen。

    公开(公告)号：EP0475567A2

    公开(公告)日：1992-03-18

    申请号：EP91306486.1

    申请日：1991-07-17

    Applicant: MACDERMID INCORPORATED

    Inventor： Bengston, Jon E. ,  Larson, Gary B.

    IPC: H05K1/09

    CPC classification number: H05K3/244 ,  Y10T29/4921

    Abstract: Conductive copper areas of printed circuits, such as through-holes, pads and lands, to which electronic components can thereafter be electrically connected by, e.g., wave soldering, are provided with a coating of nickel or cobalt, such as by electroless deposition from nickel- or cobalt-boron and nickel-or cobalt-phosphorous plating baths, or entirely or partly electrolytically, followed by a coating of a protective material which protects the nickel or cobalt coating from oxidation prior to the subsequent solder connection operation, is wettable by solder in the subsequent solder connection operation, and substantially dissolves in the solder in the subsequent solder connection operation without adverse effect on the solder joint between the electronic component and the through-hole, pad or land. A particular preferred protective material is gold, such as applied by deposition from immersion or electroless gold plating baths. The invention renders the so-treated areas readily susceptible to the soldering of components thereat, thereby avoiding the need for hot air solder levelling.

    Abstract translation: 诸如通孔，焊盘和焊盘的印刷电路的导电铜区域，其中电子部件之后可以通过例如波峰焊接电连接，提供有镍或钴的涂层，例如通过镍的无电沉积 - 或钴 - 硼和镍 - 或钴 - 磷电镀浴，或完全或部分电解，然后涂覆保护材料，保护镍或钴涂层在随后的焊接连接操作之前免受氧化，可被焊料润湿 在随后的焊接连接操作中，并且在随后的焊接连接操作中基本上溶解在焊料中，而不会对电子部件和通孔，焊盘或焊盘之间的焊接接头产生不利影响。 特别优选的保护材料是金，例如通过从浸没或无电镀金浴沉积而施加的。 本发明使如此处理的区域易于在其上焊接部件，从而避免了热空气焊料平整的需要。

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