公开(公告)号：WO2013177445A1

公开(公告)日：2013-11-28

申请号：PCT/US2013/042501

申请日：2013-05-23

Applicant: MASSACHUSETTS INSTITUTE OF TECHNOLOGY

Inventor： TOLPIN, Dmitry ,  KELLY, James, H. ,  MAURAIS, Roger, M.

IPC: H05K1/11 ,  H01L23/00 ,  H05K3/34

CPC classification number: H05K3/301 ,  H01L2224/16225 ,  H01L2924/10253 ,  H01L2924/351 ,  H01L2924/381 ,  H05K1/111 ,  H05K1/18 ,  H05K1/181 ,  H05K3/30 ,  H05K3/303 ,  H05K3/3436 ,  H05K2201/068 ,  H05K2201/094 ,  H05K2201/09418 ,  H05K2201/09427 ,  H05K2201/10242 ,  Y02P70/611 ,  Y10T29/4913 ,  Y10T29/49133 ,  H01L2924/00

Abstract: Reliability is improved for the mechanical electrical connection formed between a grid array device, such as a pin grid array device (PGA) or a column grid array device (CGA), and a substrate such as a printed circuit board (PCB). Between adjacent PCB pads, a spacing pattern increases toward the periphery of the CGA, creating a misalignment between pads and columns. As part of the assembly method, columns align with the pads, resulting in column tilt that increases from the center to the periphery of the CGA. An advantage of this tilt is that it reduces the amount of contractions and expansions of columns during thermal cycling, thereby increasing the projected life of CGA. Another advantage of the method is that it reduces shear stress, further increasing the projected life of the CGA.

Abstract translation: 对于栅格阵列器件（PGA）或列格栅阵列器件（CGA）之类的栅格阵列器件和诸如印刷电路板（PCB）的衬底之间形成的机械电连接，可靠性得到改善。 在相邻PCB焊盘之间，间隔图案朝向CGA的周边增加，从而产生焊盘和柱之间的未对准。 作为组装方法的一部分，列与焊盘对准，导致从CGA的中心到外围增加的柱倾斜。 这种倾斜的一个优点是它减少了热循环过程中柱的收缩和膨胀量，从而增加了CGA的预计使用寿命。 该方法的另一个优点是降低了剪切应力，进一步提高了CGA的寿命。