MULTILAYER PRINTED WIRING BOARD AND ITS MANUFACTURING METHOD
    10.
    发明公开
    MULTILAYER PRINTED WIRING BOARD AND ITS MANUFACTURING METHOD 审中-公开
    MEHRSCHICHTIGE LEITERPLATTE UND HERSTELLUNGSVERFAHRENDAFÜR

    公开(公告)号:EP1814373A4

    公开(公告)日:2007-11-07

    申请号:EP06812008

    申请日:2006-10-19

    Abstract: Conventionally, in order to join films used as insulating layers of a multilayer circuit board, an adhesive is used, and this adhesive might adversely influence the thinning of the multilayer circuit board. In the invention, double-sided boards using films are bonded through paste connection layers produced by filling through holes formed in prepreg with a conductive paste and by curing the conductive paste, and second wirings are electrically interconnected through the conductive paste in through holes previously formed in the paste connection layers. Thus, a multilayer board can be produced without using any adhesive, and the multilayer circuit board can be thinned as a whole.

    Abstract translation: 通常,为了接合用作多层电路板的绝缘层的膜,使用粘合剂,并且该粘合剂可能不利地影响多层电路板的变薄。 在本发明中,使用薄膜的双面电路板通过通过填充通过在预浸料坯中形成的通孔与导电浆料并固化导电浆料而制成的浆料连接层来接合,并且第二布线通过预先形成的通孔中的导电浆料电互连 在粘贴连接层。 因此,可以在不使用任何粘合剂的情况下制造多层板,并且多层电路板可以整体变薄。

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