公开(公告)号：DE69629080T2

公开(公告)日：2004-02-12

申请号：DE69629080

申请日：1996-08-30

Applicant: MATSUSHITA ELECTRIC IND CO LTD

Inventor： TAKAYAMA RYOICHI ,  KURAMASU KEIZABURO ,  SUGAWA TOSHIO

IPC: H03H3/08 ,  H03H9/02 ,  H03H9/145

Abstract: A SAW device comprising a piezoelectric substrate and at least one inter-digital transducer electrode provided on a surface of said piezoelectric substrate; said inter-digital transducer electrode comprising a plurality of films of a first material and a plurality of films of a second material deposited so as to form alternating layers, said films of the first material comprising aluminum, said films of the second material comprising a conductive material which has an elastic constant greater than the elastic constant of the films of the first material and said inter-digital transducer electrode comprising at least two of said films of the first material and at least two of the films of the second material, wherein each of the films of the first material has a thickness of 100 nm or less, and said each of the films of the second material has a thickness less than the thickness of the films of the first material, and in that said second material is one or a composition of materials selected from the group consisting of titanium, copper, palladium, chromium, molybdenum, tungsten, tantalum, niobium, zirconium, hafnium, vanadium, nickel and silver, wherein said inter-digital electrode comprises an outermost layer formed by one of said films of the second material.

公开(公告)号：DE69931212D1

公开(公告)日：2006-06-14

申请号：DE69931212

申请日：1999-05-12

Applicant: MATSUSHITA ELECTRIC IND CO LTD

Inventor： ANDOU DAIZOU ,  SUGAWA TOSHIO ,  NAKAMURA TADASHI ,  HIGASHITANI HIDEKI ,  TSUKAMOTO MASAHIDE

IPC: H05K3/40 ,  H01R12/04 ,  H05K3/00 ,  H05K3/20 ,  H05K3/38 ,  H05K3/46

Abstract: Through holes (104) formed in an electrical insulating substrate (102) having adhesive layers (101) on its both surfaces are filled with a conductor (105). Then, supporting bases (106) having wiring layers (107) with a predetermined pattern are laminated on both the surfaces of the electrical insulating substrate (102), which are then heated and pressurized. After that, the supporting bases (106) are removed, thus obtaining a circuit board in which the wiring layers (107) have been embedded in the adhesive layers (101). The conductor (105) within the through holes (104) are compressed sufficiently, thus forming minute via holes with high reliability.

公开(公告)号：DE60225508D1

公开(公告)日：2008-04-24

申请号：DE60225508

申请日：2002-01-11

Applicant: MATSUSHITA ELECTRIC IND CO LTD

Inventor： SUGAWA TOSHIO ,  MURAKAWA SATOSHI ,  HAYAMA MASAAKI ,  YASUHO TAKEO

IPC: B23K35/30 ,  H05K1/11 ,  H05K1/09 ,  H05K3/38 ,  H05K3/40

Abstract: A circuit board is manufactured by filling a via-hole formed in an insulating substrate with conductive material, disposing conductive layers on both sides of the insulating substrate, and forming alloy of component material of the conductive material with component material of the conductive layers. In the circuit board, therefore, the conductive material filled in the via-hole formed in the insulating substrate is securely connected electrically as well as mechanically to the conductive layers on both sides of the insulating substrate with high reliability.

公开(公告)号：MY116670A

公开(公告)日：2004-03-31

申请号：MYPI9603517

申请日：1996-08-24

Applicant: MATSUSHITA ELECTRIC IND CO LTD

Inventor： TAKAYAMA RYOICHI ,  KURAMASU KEIZABURO ,  SUGAWA TOSHIO

IPC: H03H9/25 ,  H03H3/08 ,  H03H9/02 ,  H03H9/145

Abstract: THE INVENTION IS INTENDED TO PRESENT A SAW DEVICE USING AN INTER-DIGITAL TRANSDUCER ELECTRODE CAPABLE OF WITHSTANDING APPLICATION OF A LARGE ELECTRIC POWER, AND PREVENTING INCREASE OF INSERTION LOSS. THE CONSTITUTION POSSESSES AN INTER-DIGITAL TRANSDUCER ELECTRODE (2) ALTERNATELY LAMINATING ALUMINUM FILMS (31 TO 45), AND FILMS OF CONDUCTIVE MATERIALS (51 TO 60) HAVING A LARGER ELASTIC CONSTANT THAN THE ALUMINUM FILMS, ON THE SURFACE OF A PIEZOELECTRIC SUBSTRATE (1). I

公开(公告)号：DE69629080D1

公开(公告)日：2003-08-21

申请号：DE69629080

申请日：1996-08-30

Applicant: MATSUSHITA ELECTRIC IND CO LTD

Inventor： TAKAYAMA RYOICHI ,  KURAMASU KEIZABURO ,  SUGAWA TOSHIO

IPC: H03H3/08 ,  H03H9/02 ,  H03H9/145

Abstract: A SAW device comprising a piezoelectric substrate and at least one inter-digital transducer electrode provided on a surface of said piezoelectric substrate; said inter-digital transducer electrode comprising a plurality of films of a first material and a plurality of films of a second material deposited so as to form alternating layers, said films of the first material comprising aluminum, said films of the second material comprising a conductive material which has an elastic constant greater than the elastic constant of the films of the first material and said inter-digital transducer electrode comprising at least two of said films of the first material and at least two of the films of the second material, wherein each of the films of the first material has a thickness of 100 nm or less, and said each of the films of the second material has a thickness less than the thickness of the films of the first material, and in that said second material is one or a composition of materials selected from the group consisting of titanium, copper, palladium, chromium, molybdenum, tungsten, tantalum, niobium, zirconium, hafnium, vanadium, nickel and silver, wherein said inter-digital electrode comprises an outermost layer formed by one of said films of the second material.

公开(公告)号：DE60225508T2

公开(公告)日：2008-06-19

申请号：DE60225508

申请日：2002-01-11

Applicant: MATSUSHITA ELECTRIC IND CO LTD

Inventor： SUGAWA TOSHIO ,  MURAKAWA SATOSHI ,  HAYAMA MASAAKI ,  YASUHO TAKEO

IPC: B23K35/30 ,  H05K1/11 ,  H05K1/09 ,  H05K3/38 ,  H05K3/40

Abstract: A circuit board is manufactured by filling a via-hole formed in an insulating substrate with conductive material, disposing conductive layers on both sides of the insulating substrate, and forming alloy of component material of the conductive material with component material of the conductive layers. In the circuit board, therefore, the conductive material filled in the via-hole formed in the insulating substrate is securely connected electrically as well as mechanically to the conductive layers on both sides of the insulating substrate with high reliability.

公开(公告)号：DE69931212T2

公开(公告)日：2007-03-01

申请号：DE69931212

申请日：1999-05-12

Applicant: MATSUSHITA ELECTRIC IND CO LTD

Inventor： ANDOU DAIZOU ,  SUGAWA TOSHIO ,  NAKAMURA TADASHI ,  HIGASHITANI HIDEKI ,  TSUKAMOTO MASAHIDE

IPC: H05K3/40 ,  H01R12/04 ,  H05K3/00 ,  H05K3/20 ,  H05K3/38 ,  H05K3/46

Abstract: Through holes (104) formed in an electrical insulating substrate (102) having adhesive layers (101) on its both surfaces are filled with a conductor (105). Then, supporting bases (106) having wiring layers (107) with a predetermined pattern are laminated on both the surfaces of the electrical insulating substrate (102), which are then heated and pressurized. After that, the supporting bases (106) are removed, thus obtaining a circuit board in which the wiring layers (107) have been embedded in the adhesive layers (101). The conductor (105) within the through holes (104) are compressed sufficiently, thus forming minute via holes with high reliability.

公开(公告)号：SG86345A1

公开(公告)日：2002-02-19

申请号：SG1999001999

申请日：1999-04-30

Applicant: MATSUSHITA ELECTRIC IND CO LTD

Inventor： ANDOU DAIZOU ,  SUGAWA TOSHIO ,  NAKAMURA TADASHI ,  HIGASHITANI HIDEKI ,  TSUKAMOTO MASAHIDE

IPC: H01R12/04 ,  H05K3/00 ,  H05K3/20 ,  H05K3/38 ,  H05K3/40 ,  H05K3/46 ,  H05K1/11

Abstract: Through holes (104) formed in an electrical insulating substrate (102) having adhesive layers (101) on its both surfaces are filled with a conductor (105). Then, supporting bases (106) having wiring layers (107) with a predetermined pattern are laminated on both the surfaces of the electrical insulating substrate (102), which are then heated and pressurized. After that, the supporting bases (106) are removed, thus obtaining a circuit board in which the wiring layers (107) have been embedded in the adhesive layers (101). The conductor (105) within the through holes (104) are compressed sufficiently, thus forming minute via holes with high reliability.

公开(公告)号：SG47173A1

公开(公告)日：1998-03-20

申请号：SG1996010543

申请日：1996-08-26

Applicant: MATSUSHITA ELECTRIC IND CO LTD

Inventor： TAKAYAMA RYOICHI ,  KURAMASU KEIZABURO ,  SUGAWA TOSHIO

IPC: H03H3/08 ,  H03H9/02 ,  H03H9/145 ,  H03H

Abstract: A SAW device comprising a piezoelectric substrate and at least one inter-digital transducer electrode provided on a surface of said piezoelectric substrate; said inter-digital transducer electrode comprising a plurality of films of a first material and a plurality of films of a second material deposited so as to form alternating layers, said films of the first material comprising aluminum, said films of the second material comprising a conductive material which has an elastic constant greater than the elastic constant of the films of the first material and said inter-digital transducer electrode comprising at least two of said films of the first material and at least two of the films of the second material, wherein each of the films of the first material has a thickness of 100 nm or less, and said each of the films of the second material has a thickness less than the thickness of the films of the first material, and in that said second material is one or a composition of materials selected from the group consisting of titanium, copper, palladium, chromium, molybdenum, tungsten, tantalum, niobium, zirconium, hafnium, vanadium, nickel and silver, wherein said inter-digital electrode comprises an outermost layer formed by one of said films of the second material.

公开(公告)号：EP1357775A4

公开(公告)日：2008-05-21

申请号：EP02775418

申请日：2002-10-30

Applicant: MATSUSHITA ELECTRIC IND CO LTD

Inventor： SUGAWA TOSHIO ,  TAKASE YOSHIHISA

IPC: H05K1/11 ,  H05K1/03 ,  H05K3/00 ,  H05K3/06 ,  H05K3/10 ,  H05K3/18 ,  H05K3/24 ,  H05K3/38 ,  H05K3/40 ,  H05K3/46

CPC classification number: H05K3/108 ,  H05K3/062 ,  H05K3/384 ,  H05K3/4069 ,  H05K3/4614 ,  H05K2201/0355 ,  H05K2203/0307 ,  H05K2203/0353 ,  H05K2203/0361 ,  H05K2203/072 ,  H05K2203/1461 ,  Y10T29/49126 ,  Y10T29/49155 ,  Y10T29/49156

Abstract: A circuit board which prevents not only a decrease in peeling strength but also an increase in connection resistance with a conductive material even in the case of a reduction in contact area when a copper foil is used for the circuit board. To realize this circuit board, an insulation base material (101) having through holes filled with a conductive material (104) is overlaid with a metal film (105) coating the through hole in at least one face of the insulation base material (101). The metal film (105) has a rugged layer (106) with a size of 5μm or more over the front surface. Another metal layer is formed over the opposite face of the rugged layer (106).