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公开(公告)号：DE60226111D1
公开(公告)日：2008-05-29
申请号：DE60226111
申请日：2002-02-26
Applicant: MATSUSHITA ELECTRIC IND CO LTD
Inventor： MAEKAWA TOMOYA , SUGAYA YASUHIRO , YAMADA TORU , ISHIZAKI TOSHIO
Abstract: A dielectric filter includes resonator electrodes, an inter-stage coupling capacitor electrode, and an input/output coupling capacitor electrode on dielectric substrates, respectively. The resonator electrodes are electro-magnetically coupled to each other to form a tri-plate structure, are made of a metallic foil embedded in a resonator dielectric substrate. Another dielectric filter includes an upper shield electrode dielectric substrate, an inter-stage coupling capacitor dielectric substrate, a resonator dielectric substrate, and an input/output coupling capacitor dielectric substrate which are made of a composite dielectric material including a high-dielectric-constant material and a low-dielectric-constant material. The above described arrangement provides the dielectric filter with an improved Q factor of a resonator, a low loss, and a high attenuation.
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公开(公告)号：GB2437465A
公开(公告)日：2007-10-24
申请号：GB0714966
申请日：2006-02-01
Applicant: MATSUSHITA ELECTRIC IND CO LTD
Inventor： SUGAYA YASUHIRO , YAMAMOTO YOSHIYUKI , ASAHI TOSHIYUKI , MIKI KATSUMASA , KATSUMATA MASAAKI , SAITOU YOSHIYUKI , NAKAYAMA TAKESHI
IPC: H05K1/18 , H01L23/31 , H01L23/498
Abstract: A multilayer wiring board is provided with a plurality of wiring boards which include a plurality of wiring layers including a pounding layer and a power supply layer a solid electrolytic capacitor wherein an insulating oxide film layer, an electrolyte layer and a conductive layer are successively formed on one plane or both planes of a foil-like metal base body; and a conductive member penetrating in a thickness direction of the wiring boards. The solid electrolytic capacitor is arranged to be sandwiched between the wiring boards, the conductive layer is connected to a grounding electrode formed on the grounding layer, and the foil-like metal base body is connected to a power supply electrode formed on the power supply layer.
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公开(公告)号：DE69031250D1
公开(公告)日：1997-09-18
申请号：DE69031250
申请日：1990-06-07
Applicant: MATSUSHITA ELECTRIC IND CO LTD
Inventor： KUGIMIYA KOICHI , SUGAYA YASUHIRO , INOUE OSAMU , HIROTA KEN , SATOMI MITSUO
Abstract: A magnetic material is provided which includes a discrete phase including grains made of a first substance which comprises a magnetic metal; and a continuous phase including a thin coating film made of a second substance which comprises a dielectric or insulating substance. The thin coating film is formed on the surface of the grains and has a mean thickness smaller than the mean particle size of the grains. The grains are separated substantially from each other by the thin coating film.
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4.发明公开MODULE WITH BUILT-IN ELECTRONIC ELEMENTS AND METHOD OF MANUFACTURE THEREOF 审中-公开模块麻省理工ELEKTRONISCHEN ELEMENTEN UND IHRE HERSTELLUNG
公开(公告)号：EP1189272A4
公开(公告)日：2005-03-02
申请号：EP01912364
申请日：2001-03-14
Applicant: MATSUSHITA ELECTRIC IND CO LTD
Inventor： NAKATANI SEIICHI , BESSHO YOSHIHIRO , SUGAYA YASUHIRO , ONISHI KEIJI
CPC classification number: H01L21/568 , H01L21/561 , H01L23/3107 , H01L24/96 , H01L24/97 , H01L2224/05568 , H01L2224/05573 , H01L2224/16225 , H01L2224/16245 , H01L2224/45144 , H01L2224/81005 , H01L2224/97 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/01027 , H01L2924/01029 , H01L2924/0103 , H01L2924/01032 , H01L2924/01033 , H01L2924/01039 , H01L2924/01047 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/10329 , H01L2924/12041 , H01L2924/12042 , H01L2924/15787 , H01L2924/16195 , H01L2924/16235 , H01L2924/181 , H01L2924/18161 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H05K1/187 , H05K3/20 , H05K3/4069 , H05K3/4614 , H05K3/4652 , H05K2201/10378 , Y10T29/4913 , Y10T29/49135 , Y10T29/49146 , Y10T29/53174 , Y10T29/53178 , H01L2224/81 , H01L2924/00 , H01L2924/00012 , H01L2224/05624 , H01L2924/00014
Abstract: Two or more electric elements (203), such as semiconductor chip and surface acoustic wave elements, are mounted on a wiring pattern (201), and molded with thermosetting resin (204). ?The upper surface of the electric elements (203) and the upper surface of a thermosetting resin (204) are ground so that their top surfaces may substantially level with each other. The grinding of the molded electric elements (203) can provide a mechanically rigid, thin module with built-in electric elements without causing damage the electric elements (203), while keeping contaminants or abrasives away from the electric elements (203) and the wiring pattern (201).
Abstract translation: 至少两个电子元件（203）如半导体芯片或声表面波器件安装在布线图案（201）上，电气元件（203）用热固性树脂组合物（204）密封。 所述至少两个电气元件（203）的上表面和所述热固性树脂组合物（204）的上表面同时被磨损，从而形成彼此基本齐平的表面。 由于在用热固性树脂组合物（204）密封的同时磨损，因此可以减小厚度而不损坏电子元件（203）。 此外，可以防止电气元件（203）和布线图案（201）被研磨液体污染。 以这种方式，可以获得能够在保持其机械强度的同时减小其厚度的电子元件内置模块。
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公开(公告)号：DE69028360T2
公开(公告)日：1997-01-23
申请号：DE69028360
申请日：1990-06-07
Applicant: MATSUSHITA ELECTRIC IND CO LTD
Inventor： KUGIMIYA KOICHI , SUGAYA YASUHIRO , INOUE OSAMU , SATOMI MITSUO , HIROTA KEN
IPC: C22C32/00 , B22F1/02 , B22F3/00 , B22F3/14 , C04B35/74 , C22C1/04 , C22C1/10 , C22C33/02 , C22C38/00 , H01F1/24 , C04B35/00 , H01F1/33
Abstract: A composite material is provided which includes a discrete phase including grains made of a first substance; and a continuous phase including a thin coating film made of a second substance and formed on the surface of each of the grains. The thin coating film has a mean thickness smaller than the mean particle size of the grains. The grains are separated substantially from each other by the thin coating film. The porosity of the composite material is 5% or less.
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Patent Agency Ranking
公开(公告)号：DE69028360D1
公开(公告)日：1996-10-10
申请号：DE69028360
申请日：1990-06-07
Applicant: MATSUSHITA ELECTRIC IND CO LTD
Inventor： KUGIMIYA KOICHI , SUGAYA YASUHIRO , INOUE OSAMU , SATOMI MITSUO , HIROTA KEN
IPC: C22C32/00 , B22F1/02 , B22F3/00 , B22F3/14 , C04B35/74 , C22C1/04 , C22C1/10 , C22C33/02 , C22C38/00 , H01F1/24 , C04B35/00 , H01F1/33
Abstract: A composite material is provided which includes a discrete phase including grains made of a first substance; and a continuous phase including a thin coating film made of a second substance and formed on the surface of each of the grains. The thin coating film has a mean thickness smaller than the mean particle size of the grains. The grains are separated substantially from each other by the thin coating film. The porosity of the composite material is 5% or less.
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公开(公告)号：GB2437465B
公开(公告)日：2010-11-17
申请号：GB0714966
申请日：2006-02-01
Applicant: MATSUSHITA ELECTRIC IND CO LTD , PANASONIC CORP
Inventor： SUGAYA YASUHIRO , YAMAMOTO YOSHIYUKI , ASAHI TOSHIYUKI , MIKI KATSUMASA , KATSUMATA MASAAKI , SAITOU YOSHIYUKI , NAKAYAMA TAKESHI
IPC: H05K1/18 , H01L23/31 , H01L23/498
Abstract: A multilayered substrate includes a plurality of circuit boards including a plurality of wiring layers including a grounding layer and a power layer, a solid electrolytic capacitor having an insulative oxide film layer, an electrolytic layer, and a conductor layer sequentially formed on one surface or both surfaces of a foil-like metal substrate, and a conductive substance passing through the circuit board across a thickness thereof. The solid electrolytic capacitor is disposed to be held between the plurality of circuit boards. The conductor layer is connected to a grounding electrode formed on the grounding layer, the foil-like metal substrate being connected to a power electrode formed on the power layer.
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公开(公告)号：DE69031250T2
公开(公告)日：1997-12-04
申请号：DE69031250
申请日：1990-06-07
Applicant: MATSUSHITA ELECTRIC IND CO LTD
Inventor： KUGIMIYA KOICHI , SUGAYA YASUHIRO , INOUE OSAMU , HIROTA KEN , SATOMI MITSUO
Abstract: A magnetic material is provided which includes a discrete phase including grains made of a first substance which comprises a magnetic metal; and a continuous phase including a thin coating film made of a second substance which comprises a dielectric or insulating substance. The thin coating film is formed on the surface of the grains and has a mean thickness smaller than the mean particle size of the grains. The grains are separated substantially from each other by the thin coating film.
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9.发明专利Compound wiring board and its manufacturing method, mounted shape of electronic component, and manufacturing method 审中-公开复合导线板及其制造方法，电子元器件的安装形状及制造方法
公开(公告)号：JP2007194516A
公开(公告)日：2007-08-02
申请号：JP2006013376
申请日：2006-01-23
Applicant: Matsushita Electric Ind Co Ltd , 松下電器産業株式会社
Inventor： SASAKI TOMOE , SUGAYA YASUHIRO , ASAHI TOSHIYUKI
IPC: H05K3/46
CPC classification number: H01L24/73 , H01L2224/16225 , H01L2224/32145 , H01L2224/32225 , H01L2224/73204 , H01L2224/73253 , H01L2224/73265 , H01L2924/15153 , H01L2924/19105 , H01L2924/00012 , H01L2224/48227
Abstract: PROBLEM TO BE SOLVED: To provide a compound wiring board which is flexibly adaptive to design alterations by easily making a substrate multi-layered at an arbitrary position, and to provide a compound wiring board having a cavity structure where circuit components can be arranged in three dimensions. SOLUTION: The compound wiring board comprises a first wiring board which has a first electric insulating base material and a wiring pattern formed on the first electric insulating base material; a second wiring board which has a second electric insulating base material and a wiring pattern formed on the second electric insulating base material, and in a part of which a cavity is formed in at least a portion of it; and a third electric insulating base material which has a conductor unit electrically connecting the wiring pattern of the first wiring board and the wiring pattern of the second wiring board, while the first wiring board and the second wiring board are bonded together along the thickness, and in a part of which a cavity is formed in at least a portion of it. COPYRIGHT: (C)2007,JPO&INPIT
Abstract translation: 要解决的问题：提供一种通过在任意位置容易地使基板多层化而灵活地适应设计变更的复合布线板，并且提供具有空腔结构的复合布线板，其中电路部件可以是 三维排列。 解决方案：复合布线板包括第一布线板，其具有第一电绝缘基材和形成在第一电绝缘基材上的布线图案; 第二布线板，其具有形成在所述第二电绝缘基材上的第二电绝缘基材和布线图案，并且其一部分中的空腔形成在所述第二布线基板的至少一部分中; 以及第三电绝缘基材，其具有导电单元，所述导体单元将所述第一布线板的布线图案与所述第二布线板的布线图案电连接，同时沿着所述厚度将所述第一布线板和所述第二布线板接合在一起;以及 在其一部分中，在其一部分中形成空腔。 版权所有（C）2007，JPO＆INPIT
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10.发明专利Circuit board with built-in solid electrolytic capacitor and method of manufacturing same 审中-公开具有内置固体电解电容器的电路板及其制造方法
公开(公告)号：JP2007073787A
公开(公告)日：2007-03-22
申请号：JP2005260120
申请日：2005-09-08
Applicant: Matsushita Electric Ind Co Ltd , 松下電器産業株式会社
Inventor： YAMAMOTO YOSHIYUKI , MIKI KATSUMASA , SUGAYA YASUHIRO
Abstract: PROBLEM TO BE SOLVED: To provide a circuit board with a thin and high capacitance built-in solid electrolytic capacitor having highly reliable insulation. SOLUTION: In the circuit board with the built-in solid electrolytic capacitor and a built-in valve metal sheet 1 having a porous portion, the solid electrolytic capacitor is formed in a portion of the valve metal sheet 1, and the porous portion 2 in the region of the valve metal sheet 1 wherein the solid electrolytic capacitor is not formed is filled with an insulating layer 3 consisting of a cured material of a liquid resin, and the solid electrolytic capacitor and the wiring pattern 4 of the circuit board are electrically connected together. COPYRIGHT: (C)2007,JPO&INPIT
Abstract translation: 要解决的问题：为电路板提供具有高可靠绝缘性的薄而高电容的内置固体电解电容器。
解决方案：在具有内置固体电解电容器的电路板和具有多孔部分的内置阀金属片1中，固体电解电容器形成在阀金属片1的一部分中，并且多孔 在没有形成固体电解电容器的阀金属片1的区域中填充有由液体树脂的固化物构成的绝缘层3，并且固体电解电容器和电路板的布线图案4 电连接在一起。 版权所有（C）2007，JPO＆INPIT
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