Cooling arrangement for magnetron
    1.
    发明授权
    Cooling arrangement for magnetron 失效
    冷却装置为MAGNETRON

    公开(公告)号:US3575632A

    公开(公告)日:1971-04-20

    申请号:US3575632D

    申请日:1968-09-06

    CPC classification number: H01J23/005 H01J19/36 H01J2893/0027

    Abstract: A magnetron device composed by improving the medium or large size magnetron device having an output power of the order of 500 watts in ultrahigh frequency, which comprises as cooling means an assembly of a natural air-cooled type radiator formed of aluminum or alloy thereof and which, accordingly, does not necessitate the cooling means like blowers provided to conventional devices. Said device has such advantages that noise is eliminated during operation and that it is light and compact and therefore it is particularly suitable for a domestic-use microwave range.

    MAGNETRON ASSEMBLY
    4.
    发明专利

    公开(公告)号:GB1256125A

    公开(公告)日:1971-12-08

    申请号:GB1254969

    申请日:1969-03-10

    Abstract: 1,256,125. Magnetrons. MATSUSHITA ELECTRONICS CORP. 10 March, 1969 [8 March, 1968], No. 12549/69. Heading H1D. A magnetron assembly includes a heat conducting body 12, which body has a bore 13 for the receipt of the anode 11 of the magnetron 10, has recesses-as shown, in surfaces 16 and 17- for accommodating magnetic members forming part of the means for operating the magnetic field of the magnetron, and has heat dissipating finned webs 24, 25 mechanically and thermally engaged therewith. As shown, the webs 24, 25 are secured to the aluminium body 12 by bolts 20, 21, and permanent magnets 30 and 31 are mounted between pole plates 32 and 33, the recesses in surfaces 16 and 17 permitting minimum spacing there between and the outer portions 40, 41 of the recesses being asymptotic to planes 43, 44 which are tangential to the bore 13.

    6.
    发明专利
    未知

    公开(公告)号:DE1491373A1

    公开(公告)日:1969-05-22

    申请号:DE1491373

    申请日:1964-07-10

    Abstract: 1,067,464. Travelling wave tubes. MATSUSHITA ELECTRONICS CORPORATION. July 10, 1964 [July 12, 1963; Sept. 26, 1963; Nov. 1, 1963], No. 28662/64. Heading HID. An extremely high frequency travelling wave tube has a comb-type delay line k-a-b having lateral slots formed in the ridge of a ridge waveguide extending between an electron gun 12 at one end and a collector 11 at the other, wherein a ridge waveguide c-d provided at the electrongun end of the comb-type delay line has a ridge of lateral width the same as the comb and in continuation with the latter in a direction perpendicular to the electron beam axis, and wherein a longitudinal waveguide forms a continuation of the perpendicular ridge waveguide and extends towards the collector. The slots of the delay line are the same width as the teeth, and the electron beam passes through longitudinal slots formed in the ridge. The output longitudinal waveguide has a matching taper ridge section e-f, the energy being transmitted through a dielectric disc 33 which forms a seal for the electron tube. The slots are formed by a rotating cutting tool which may cut up to eight delay line simultaneously. The tube may operate as a backward wave oscillator, as shown, a thin film of resistive material 15 being provided on the surface of a port provided at the collector end of the delay line. Alternatively, the tube may operate as a forward wave amplifier. Specific dimensions of the waveguide and delay line are given.

    7.
    发明专利
    未知

    公开(公告)号:DE1791059B1

    公开(公告)日:1972-02-03

    申请号:DE1791059

    申请日:1968-09-05

    Abstract: 1,225,855. Magnetrons. MATSUSHITA ELECTRONICS CORP. 26 Aug., 1968 [7 Sept., 1967], No. 40721/68. Heading HID In a magnetron assembly which dispenses with forced cooling, Figs. 1 and 2, the anode block 2 of the magnetron 1 is mounted through an aluminium slab 3 having arrays of aluminium cooling fins 8 clamped to each end, the upper surface of the block supporting the solenoid or permanent magnet 5 and yoke 6. The fin arrays rise above the top of the magnetic system, to protect the latter; the anode block may be secured within block 3 by soldering or by the use of a thermally conductive resin. Dimension and weight data are included.

    PRESSURE-SENSITIVE SOLID-STATE DEVICE

    公开(公告)号:GB1261340A

    公开(公告)日:1972-01-26

    申请号:GB2088670

    申请日:1970-04-30

    Abstract: 1,261,340. Semi-conductor devices. MATSUSHITA ELECTRONICS CORP. 30 April, 1970 [7 May, 1969], No. 20886/70. Heading H1K. Pressure is applied to a pressure-sensitive device by means of a pressure member which is influenced by the magnetic flux generated by a permanent magnet so that displacement of the permanent magnet changes the pressure applied to the device. As shown, a stylus 3 is supported in contact with a semi-conductor device 1 by means of a diaphragm or beam 5 and carries an iron member 4. A permanent magnet 7 is suspended above the stylus, movement of the magnet by knob 10 against the force of a return spring 11 decreasing the magnetic attraction and thus increasing the stylus pressure. The semi-conductor device may be a Mo or W Schottky barrier on a Si substrate, or a PN junction device containing deep level impurities. The semi-conductor device, the stylus and its mounting may be enclosed in a gas-tight housing of glass, ceramic, or non-magnetic metal. The stylus may be of sapphire or may be of ferrite, the iron member 4 being omitted.

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