公开(公告)号：WO9900826A3

公开(公告)日：1999-05-27

申请号：PCT/JP9802544

申请日：1998-06-08

Applicant: MATSUSHITA ELECTRONICS CORP ,  MINAMIO MASANORI ,  KONISHI SATORU ,  MORISHITA YOSHIHIKO ,  YAMADA YUICHIRO ,  ITOH FUMITO

Inventor： MINAMIO MASANORI ,  KONISHI SATORU ,  MORISHITA YOSHIHIKO ,  YAMADA YUICHIRO ,  ITOH FUMITO

IPC: H01L23/28 ,  H01L23/31 ,  H01L23/495 ,  H01L23/50

CPC classification number: H01L23/49541 ,  H01L23/3107 ,  H01L23/49548 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/451 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2924/00014 ,  H01L2924/01057 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A resin molded type semiconductor device has: a semiconductor chip (12) which is mounted on a die pad portion (11) of a lead frame (9); thin metal wires (14) which connect terminals of the semiconductor chip (12) to inner lead portions (13) of the lead frame (9); and a sealing resin (15), and the lead frame (9) is subjected to an upsetting process so that a supporting portion (11) is located at a position higher than the inner lead portions (13). Since the sealing resin of a thickness corresponding to the step difference of the upsetting exists below the supporting portion, the adhesiveness between the lead frame and the sealing resin can be improved, and high reliability and thinning are realized. Since at least one groove portion is disposed in the surface of each of the inner lead portions (13), the anchoring effect to the sealing resin (15), stress acting on a lead portion of a product, and stress to the thin metal wires (14) can be relaxed, and leads and the thin metal wires can be prevented from peeling off.

Abstract translation: 一种树脂模制型半导体器件具有：安装在引线框（9）的芯片焊盘部分（11）上的半导体芯片（12）; 将半导体芯片12的端子与引线框9的内引线部13连接的细金属线14; 和密封树脂（15），并且引线框架（9）经受镦粗处理，使得支撑部分（11）位于比内引线部分（13）更高的位置处。 由于在支撑部的下方存在与镦锻的台阶差对应的厚度的密封树脂，所以能够提高引线框与密封树脂的密合性，实现高可靠性和薄型化。 由于在各内引线部（13）的表面配置有至少一个槽部，因此对密封树脂（15）的固定作用，作用于产品的引线部的应力以及对金属细线 （14）可以松弛，并且引线和细金属线可以防止剥落。

公开(公告)号：JPH11195742A

公开(公告)日：1999-07-21

申请号：JP15298

申请日：1998-01-05

Applicant: MATSUSHITA ELECTRONICS CORP

Inventor： MORISHITA YOSHIHIKO ,  NANO MASANORI ,  ADACHI OSAMU

IPC: H01L23/12 ,  H01L21/48 ,  H01L23/36 ,  H01L23/50

Abstract: PROBLEM TO BE SOLVED: To provide a semiconductor device for a simplified structure and improve assembly work efficiency. SOLUTION: A manufacturing witched of a semiconductor device comprises the steps of a process to form a lead frame, having bonding pads 2a and electrodes 2b for mounting by plating both surfaces of a metal plate 1 in a required pattern, a process for bonding a semiconductor chip 4 to the lead frame and connect electrodes of the semiconductor chip 4 to the wire bonding pads 2a of the lead frame using bonding wires, a process for sealing the semiconductor chip 4 and bonding wires 3 and etching to remove the unplated part of a metal plate 7 after the sealing process. Consequently, assembly work efficiency is improved. Tince the number of parts is small, the tructure is simplified, and the production cost is lowered. Also since the wire light and the number of connection points can be reduced, reliability is improved and the package can be miniaturized and accommodate multiple pin.

公开(公告)号：JPH11186467A

公开(公告)日：1999-07-09

申请号：JP35740897

申请日：1997-12-25

Applicant: MATSUSHITA ELECTRONICS CORP

Inventor： MORISHITA YOSHIHIKO ,  NANO MASANORI ,  ADACHI OSAMU

IPC: H01L23/28 ,  H01L23/12 ,  H01L23/50 ,  H05K3/34

Abstract: PROBLEM TO BE SOLVED: To provide a semiconductor device on which visual inspections can be carried out easily, a lead frame which is used at the time of manufacturing the device, and a method for manufacturing the lead frame. SOLUTION: A semiconductor device is provided with a semiconductor element 4, a resin package 5 sealing the element 4. step sections 11 which are formed to the rear surface of the package 5 from the mounting-side end faces of the package 5, metallic films 2 which are provided along the step sections 11, and connecting means which electrically connect electrode pads on the element 4 to the metallic films 2. Therefore, visual inspections can be carried out easily on the semiconductor device, because the metallic films 2 are exposed on the side faces of the package 5, and solder junctions which connect the metallic films 2 to the terminals on a substrate do not hide behind the rear surface of the package 5 when the semiconductor device is mounted on the substrate. A lead frame used at the time of manufacturing the semiconductor device is provided with a substrate 1 having step sections 7 and metallic films 2 formed on the surfaces of the step sections 7. A method for manufacturing the lead frame, in addition, includes a metallic film forming process for forming the metallic films 2 and a press working process for forming the step sections 7.

公开(公告)号：JPH01248510A

公开(公告)日：1989-10-04

申请号：JP7757588

申请日：1988-03-29

Applicant: MATSUSHITA ELECTRONICS CORP

Inventor： MORISHITA YOSHIHIKO

IPC: H01L21/02 ,  H01L23/28 ,  H01L29/06

Abstract: PURPOSE:To prevent resin mold crack from developing by providing a groove around a semiconductor chip. CONSTITUTION:A semiconductor chip 1 is mounted to a die attachment part 3 of a lead frame 2 with an adhesive material such as Au-Si eutectic or Ag paste. And a recessed groove 4 is formed on the upper surface around this semiconductor chip 1. Thus, a protruding part 7 is formed at molded resin 6 so that it bites into the groove 4 of the semiconductor chip 1. It prevents relative deviation between the semiconductor chip 1 and the resin 6 due to difference in coefficient of thermal expansion from being generated. Thus, it prevents crack at the resin mold part, pattern shift of semiconductor chip, and wire burnout from occurring.

公开(公告)号：JPH11251505A

公开(公告)日：1999-09-17

申请号：JP5208698

申请日：1998-03-04

Applicant: MATSUSHITA ELECTRONICS CORP

Inventor： MORISHITA YOSHIHIKO ,  NANO MASANORI

IPC: H01L23/50

Abstract: PROBLEM TO BE SOLVED: To improve reliability of a semiconductor device by preventing a lead from peeling off from the encapsulating resin. SOLUTION: This semiconductor device comprises a semiconductor chip 10, a lead metal film 30 connected to an electrode of the chip 10 via a bonding wire 20, a lead 40 whose entire upper surface is connected to the film 30, a columnar terminal 50 integrally projecting from the lower surface of the lead 40, a columnar terminal metal film 60 which is formed over the entire lower surface of the terminal 50, and an encapsulating resin 80 formed by encapsulating the chip 10, the wire 20, the film 30, and the lead 40. Consequently, since the lead 40 formed integrally with the terminal 50 is buried in the resin 80, the adhesive strength of the lead 40 is increased.

公开(公告)号：JPH11186465A

公开(公告)日：1999-07-09

申请号：JP35740997

申请日：1997-12-25

Applicant: MATSUSHITA ELECTRONICS CORP

Inventor： MORISHITA YOSHIHIKO ,  NANO MASANORI ,  ADACHI OSAMU

IPC: H01L23/28

Abstract: PROBLEM TO BE SOLVED: To mount a semiconductor device on a printed board with high reliability so that no problem may be raised. SOLUTION: A semiconductor device is provided with a metallic substrate 8 composed of a metallic plate 5, an insulating film 6 coating the surface of the plate 5, and a conductor pattern 7 formed on the film 6, a semiconductor chip 2 die-bonded to the substrate 8, gold wires 9 respectively wire-bonded to electrodes on the chip 2 and electrodes on the conductor pattern 7, and a resin 3 sealing the chip 2 and the wires 9. The conductor pattern 7 is arranged on the flat part of the substrate 8, and a groove 1 is provided on the side face of the sealing resin 3 corresponding to an external electrode 4 exposed from the pattern 7. Therefore, the reliability of the semiconductor device is improved, because no bending stress occurs in the pattern 7. In addition, the semiconductor device can be mounted surely on a printed board at the time of mounting the device on the board, because solder is sucked up through the groove 1 by a capillary phenomenon.

公开(公告)号：JPH08306724A

公开(公告)日：1996-11-22

申请号：JP10549095

申请日：1995-04-28

Applicant: MATSUSHITA ELECTRONICS CORP

Inventor： MORISHITA YOSHIHIKO ,  OIDA SHIGEJI

IPC: H01L21/60 ,  H01L25/065 ,  H01L25/07 ,  H01L25/18

Abstract: PURPOSE: To provide a multifunction ultrastructure semiconductor device in which simple mounting structure and reduced mounting area can be realized while reducing the labor by making an etching hole reaching the rear surface of a semiconductor chip in the electrode pad region and providing an outer terminal connected with the etching hole on the rear surface of the semiconductor chip. CONSTITUTION: An etching hole 12, reaching the rear surface of a semiconductor chip 10, is made in the electrode pad region on the surface of the semiconductor chip 10 where a circuit pattern is formed. An outer terminal 14, connected electrically with the etching hole 12, is provided on the rear surface of the semiconductor chip where the circuit pattern is not formed. For example, the etching hole 12 is made in an electrode pad 11 provided on the surface of the semiconductor chip 10 where a circuit pattern is formed or the vicinity. The outer terminal 14 is provided in the form of an ordinary gold bump or a conductive resin bump and connected with the etching hole 12 through a conductive material 13, e.g. a conductive adhesive or metal plating.

公开(公告)号：JPH07215390A

公开(公告)日：1995-08-15

申请号：JP1026294

申请日：1994-02-01

Applicant: MATSUSHITA ELECTRONICS CORP

Inventor： MORISHITA YOSHIHIKO

IPC: B65D73/02 ,  B65D85/86

Abstract: PURPOSE:To prevent a semiconductor device from moving even if it is subjected to slight vibration or impact during transportation for preventing a lead from deforming by fixing the semiconductor device to an emboss tape by a locking protrusion of a recess provided on the emboss tape. CONSTITUTION:Recesses 15 for housing semiconductor devices are provided with predetermined intervals on an emboss tape 15, while an opening 17 is formed at each corner of a seat-like bottom 15a of the recess 15 by cutting a part of the bottom 15a. In addition, along a side of the recess 15 with a lead 16 of a semiconductor device 13, a protrusion 14 is formed in a shape protruding from the bottom of the recess 15 at each corner. At the time of transporting the semiconductor device 13, after the semiconductor device 13 is mounted and housed inside the protrusion 14, an upper face of the recess 15 is covered by a top tape 12. Thus with the semiconductor device 13 put inside the recess 15, a lateral direction is regulated by the protrusion 14, while a vertical direction is regulated by the top tape 12 and the bottom of the recess 15.

公开(公告)号：JPH03133783A

公开(公告)日：1991-06-06

申请号：JP26918089

申请日：1989-10-18

Applicant: MATSUSHITA ELECTRONICS CORP

Inventor： MORISHITA YOSHIHIKO

IPC: B65D85/86 ,  B65D85/38 ,  H01L21/66 ,  H05K13/02

Abstract: PURPOSE:To protect electronic components and at the same time, make it possible to store a large quantity by a method wherein a long sized protective tubal body in which a plurality of electronic components are stored in the longitudinal direction is formed into a scroll shape. CONSTITUTION:A protective tubal body 1 is made of a synthetic resin, and a long sized tubal body is wound into a scroll shape by extrusion molding, and a reel 2 is fitted to manufacture the protective tubal body 1. Also, in the protective tubal body 1, a synthetic resin embossed carrier tape 5 on which a plurality of recessed parts 5a to store an electronic component 4 are formed is inserted. When an electronic component is used, a stopper 3 is removed from the opening of the protective tubal body 1, and the electronic component 4 is taken out from this opening.

公开(公告)号：JPH11297870A

公开(公告)日：1999-10-29

申请号：JP9733698

申请日：1998-04-09

Applicant: MATSUSHITA ELECTRONICS CORP

Inventor： MORISHITA YOSHIHIKO ,  NANO MASANORI

IPC: H01L23/12

Abstract: PROBLEM TO BE SOLVED: To manufacture a leadless, surface-mounting, and resin-sealed semiconductor device provided with an outer electrode formed on its underside. SOLUTION: Resist films 21A and 21B are each formed on both the sides of a metal board 20, openings 22A and 22B are formed overlapping with each other in a cross section, the metal board 20 is half etched to form holes 23A and 23B which penetrate through a part where the openings 22A and 22B overlap with each other. Then, a metal film 24 is formed on the etched surface and the holes 23A and 23B, the resist films 21A and 21B are removed to finish the formation of a lead frame 30. Then, a semiconductor chip 10 is placed on the lead frame 30, the electrode of the semiconductor chip 10 is connected to a pad 13 with a wire 11, and the semiconductor chip 10, the metal film 24 which comprises the pad 13, the inner lead 14 extending in a lateral direction from the pad 13, and the cylindrical outer electrode 15 extending downward from the inner lead 14, and the inside the cylindrical outer electrode 15 are sealed up with a sealing resin 12.