公开(公告)号：JP2002052500A

公开(公告)日：2002-02-19

申请号：JP2001143989

申请日：2001-05-14

Applicant: MEMSCAP ,  PLANHEAD SILMAG PHS

Inventor： CHARRIER CATHERINE ,  BOUCHON ERIC ,  CAMPO ALAIN ,  IMBERT GUY ,  VALENTIN FRANCOIS ,  BASTERES LAURENT

IPC: B81C1/00 ,  B81B3/00 ,  H01G5/16 ,  H01H1/00 ,  H01H11/00 ,  H01H13/52

Abstract: PROBLEM TO BE SOLVED: To provide a method for manufacturing an electronic micro component with a fixed plate and a deformable film facing each other under a room temperature. SOLUTION: This manufacturing method is characterized in having a stage of depositing a first metal layer to become the fixed plate on an oxide layer 2, a stage of depositing metal ribbons 10 and 11 acting as spacers between the fixed plate 1 and the deformable film 20 at least in a part of the circumferential edge of the fixed plate 1 in its both sides, a stage of depositing a sacrifice resin layer 15 on all over the fixed plate; a stage of forming a plurality of wells on the surface of the sacrifice resin layer by lithography, a stage of depositing, at least, a metal region which forms the deformable film 20 in the wells formed on the sacrifice resin layer 15 and extends between the metal ribbons disposed in both sides of the fixed plate; and a stage of removing the sacrifice layer.

公开(公告)号：FR2808919A1

公开(公告)日：2001-11-16

申请号：FR0006142

申请日：2000-05-15

Applicant: MEMSCAP

Inventor： CHARRIER CATHERINE ,  BOUCHON ERIC ,  CAMPO ALAIN ,  IMBERT GUY ,  VALENTIN FRANCOIS ,  BASTERES LAURENT

IPC: B81B3/00 ,  H01G5/16 ,  B81C1/00 ,  H01H1/00 ,  H01H11/00 ,  H01H13/52 ,  H01G7/06

Abstract: Process for fabricating electronic components, of the variable capacitor or microswitch type, comprising a fixed plate (1) and a deformable membrane (20) which are located opposite each other, which comprises the following steps, consisting in: depositing a first metal layer on an oxide layer (2), said first metal layer being intended to form the fixed plate; depositing a metal ribbon (10, 11) on at least part of the periphery and on each side of the fixed plate (1), said ribbon being intended to serve as a spacer between the fixed plate (1) and the deformable membrane (20); depositing a sacrificial resin layer (15) over at least the area of said fixed plate (1); generating, by lithography, a plurality of wells in the surface of said sacrificial resin layer; depositing, by electrolysis, inside the wells formed in the sacrificial resin (15), at least one metal region intended to form the deformable membrane (20), this metal region extending between sections of the metal ribbon (10, 11) which are located on each side of said fixed plate (1); removing the sacrificial resin layer (15).

公开(公告)号：CA2348107A1

公开(公告)日：2001-11-15

申请号：CA2348107

申请日：2001-05-15

Applicant: PLANHEAD SILMAG PHS ,  MEMSCAP

Inventor： BASTERES LAURENT ,  BOUCHON ERIC ,  CAMPO ALAIN ,  VALENTIN FRANCOIS ,  IMBERT GUY ,  CHARRIER CATHERINE

IPC: B81C1/00 ,  B81B3/00 ,  H01G5/16 ,  H01H1/00 ,  H01H11/00 ,  H01H13/52 ,  H01L49/00 ,  H01G7/00 ,  H01L47/00

Abstract: Procédé de fabrication de microcomposants électroniques, du type capaci té variable ou microswitch, comprenant une armature fixe (1) et une membrane (2 0) déformable situées en regard l'une de l'autre, caractérisé en ce qu'il comporte les étapes suivantes, consistant : ~ à déposer une première couche métallique sur une couche d'oxyde (2), ladite première couche métallique étant destinée à former l'armature fixe ; ~ à déposer un ruban métallique (10, 11) sur au moins une partie de la périphérie et de part et d'autre de l'armature fixe (1), ledit ruban étant destiné à servir d'espaceur entre l'armature fixe (1) et la membrane déformable (20) ; ~ à déposer une couche de résine sacrificielle (15) sur au moins la superfic ie de ladite armature fixe (1) ; ~ à générer par lithographie une pluralité de caissons, sur la surface de ladite couche de résine sacrificielle ; ~ à déposer par électrolyse, à l'intérieur des caissons formés sur la résine sacrificielle (15), au moins une zone métallique destinée à former la membrane déformable (20), cette zone métallique s'étendant entre des sections du ruban métallique (10, 11) situées de part et d'autre de ladite armature fixe (1) ; ~ à éliminer la couche de résine sacrificielle (15).

公开(公告)号：FR2808919B1

公开(公告)日：2002-07-19

申请号：FR0006142

申请日：2000-05-15

Applicant: MEMSCAP

Inventor： CHARRIER CATHERINE ,  BOUCHON ERIC ,  CAMPO ALAIN ,  IMBERT GUY ,  VALENTIN FRANCOIS ,  BASTERES LAURENT

IPC: B81B3/00 ,  H01G5/16 ,  B81C1/00 ,  H01H1/00 ,  H01H11/00 ,  H01H13/52 ,  H01G7/06

Abstract: Process for fabricating electronic components, of the variable capacitor or microswitch type, comprising a fixed plate (1) and a deformable membrane (20) which are located opposite each other, which comprises the following steps, consisting in: depositing a first metal layer on an oxide layer (2), said first metal layer being intended to form the fixed plate; depositing a metal ribbon (10, 11) on at least part of the periphery and on each side of the fixed plate (1), said ribbon being intended to serve as a spacer between the fixed plate (1) and the deformable membrane (20); depositing a sacrificial resin layer (15) over at least the area of said fixed plate (1); generating, by lithography, a plurality of wells in the surface of said sacrificial resin layer; depositing, by electrolysis, inside the wells formed in the sacrificial resin (15), at least one metal region intended to form the deformable membrane (20), this metal region extending between sections of the metal ribbon (10, 11) which are located on each side of said fixed plate (1); removing the sacrificial resin layer (15).