公开(公告)号：WO2013033698A3

公开(公告)日：2013-06-20

申请号：PCT/US2012053647

申请日：2012-09-04

Applicant: MERCURY COMP SYSTEMS INC ,  MCKENNEY DARRYL J ,  TOOHEY DANIEL ,  MARIANI STEPHEN ,  GUST MICHAEL ,  METHRATTA ABSU ,  FLEURY TIMOTHY ,  IMPERALLI STEVEN

Inventor： MCKENNEY DARRYL J ,  TOOHEY DANIEL ,  MARIANI STEPHEN ,  GUST MICHAEL ,  METHRATTA ABSU ,  FLEURY TIMOTHY ,  IMPERALLI STEVEN

IPC: G06F1/18 ,  H01R12/73

CPC classification number: G06F1/185 ,  B23C2220/36 ,  H01R12/52 ,  H05K1/11 ,  H05K3/34 ,  H05K3/366 ,  H05K3/403 ,  H05K2201/09036 ,  H05K2201/09181 ,  H05K2201/09645 ,  H05K2201/10159 ,  H05K2203/0228 ,  Y10T29/49124 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T409/303752

Abstract: According to exemplary embodiments, a controlled-depth slot extending into a circuit board is provided. The controlled depth slot may be milled, and may comprise ½ radial plated through-holes to generate a solderable "D" interconnect feature. The slot may include interconnect features on one to five sides. According to another exemplary embodiment, a circuit board having a depth-controlled interconnect slot is provided in conjunction with one or more solderable technology modules. The one or more solderable technology modules may include memory devices, power devices such as Point of Load Supplies (POLS), security devices and anti-tamper devices, capacitance devices, and other types of chips such as Field Programmable Gate Arrays (FPGAs). The solderable technology modules may be soldered into the slot to secure the modules in the slot and connect the modules to interconnects on the circuit board.

Abstract translation: 根据示例性实施例，提供了一种延伸到电路板中的受控深度槽。 受控的深度槽可以被铣削，并且可以包括1/2个径向镀通孔以产生可焊接的“D”互连特征。 插槽可以包括一至五个侧面上的互连特征。 根据另一个示例性实施例，结合一个或多个可焊接技术模块来提供具有深度控制互连槽的电路板。 一个或多个可焊接技术模块可以包括存储器设备，诸如负载点供应（POLS），安全设备和防篡改设备，电容设备以及诸如现场可编程门阵列（FPGA）之类的其他类型的芯片的功率设备。 可焊接技术模块可以焊接到插槽中以将模块固定在插槽中并将模块连接到电路板上的互连。

公开(公告)号：WO2014089076A3

公开(公告)日：2014-10-30

申请号：PCT/US2013072869

申请日：2013-12-03

Applicant: MERCURY COMP SYSTEMS INC

Inventor： MCKENNEY DARRYL J ,  ZUIDEMA PAUL ,  BLANCHET DONALD ,  COOLIDGE DANIEL

IPC: H05K7/20 ,  G06F1/20 ,  H05K7/14

CPC classification number: G06F1/20 ,  H05K7/1452 ,  H05K7/20563 ,  H05K7/20572

Abstract: Various embodiments provide a circuit board module include a primary cover, a secondary cover and a circuit board sandwiched between the primary cover and the secondary cover. A first set of fins or channels may be provided on a surface of the primary cover. The first set of fins or channels guide cooling air flowing on the surface of the primary cover. A second set of fins or channels may be provided on a surface of the second cover. The second set of fins or channels guide the cooling air flowing on the surface of the secondary cover. The second set of fins or channels intermates with the first set of fins or channels to form a sealed casing enclosing the circuit board. The sealed casing forms a Faraday cage to protect the circuit board from electromagnetic interference.

Abstract translation: 各种实施例提供一种电路板模块，包括主盖，副盖和夹在主盖和次盖之间的电路板。 可以在主盖的表面上设置第一组翅片或通道。 第一组翅片或通道引导在主盖表面上流动的冷却空气。 可以在第二盖的表面上设置第二组翅片或通道。 第二组翅片或通道引导在二次盖的表面上流动的冷却空气。 第二组翅片或通道与第一组翅片或通道相互配合以形成封闭电路板的密封壳体。 密封外壳形成法拉第笼，以保护电路板免受电磁干扰。

公开(公告)号：CA2893488A1

公开(公告)日：2014-06-12

申请号：CA2893488

申请日：2013-12-03

Applicant: MERCURY COMP SYSTEMS INC

Inventor： MCKENNEY DARRYL J ,  ZUIDEMA PAUL ,  BLANCHET DONALD ,  COOLIDGE DANIEL

IPC: H05K7/20 ,  G06F1/20 ,  H05K7/14

Abstract: Various embodiments provide a circuit board module include a primary cover, a secondary cover and a circuit board sandwiched between the primary cover and the secondary cover. A first set of fins or channels may be provided on a surface of the primary cover. The first set of fins or channels guide cooling air flowing on the surface of the primary cover. A second set of fins or channels may be provided on a surface of the second cover. The second set of fins or channels guide the cooling air flowing on the surface of the secondary cover. The second set of fins or channels intermates with the first set of fins or channels to form a sealed casing enclosing the circuit board. The sealed casing forms a Faraday cage to protect the circuit board from electromagnetic interference.

公开(公告)号：CA2847400A1

公开(公告)日：2013-03-07

申请号：CA2847400

申请日：2012-09-04

Applicant: MERCURY COMP SYSTEMS INC

Inventor： MCKENNEY DARRYL J ,  TOOHEY DANIEL ,  MARIANI STEPHEN ,  GUST MICHAEL ,  METHRATTA ABSU ,  FLEURY TIMOTHY ,  IMPERALLI STEVEN

IPC: G06F1/18 ,  H01R12/73

Abstract: According to exemplary embodiments, a controlled-depth slot extending into a circuit board is provided. The controlled depth slot may be milled, and may comprise ½ radial plated through-holes to generate a solderable "D" interconnect feature. The slot may include interconnect features on one to five sides. According to another exemplary embodiment, a circuit board having a depth-controlled interconnect slot is provided in conjunction with one or more solderable technology modules. The one or more solderable technology modules may include memory devices, power devices such as Point of Load Supplies (POLS), security devices and anti-tamper devices, capacitance devices, and other types of chips such as Field Programmable Gate Arrays (FPGAs). The solderable technology modules may be soldered into the slot to secure the modules in the slot and connect the modules to interconnects on the circuit board.

公开(公告)号：AU2013356269A1

公开(公告)日：2015-07-16

申请号：AU2013356269

申请日：2013-12-03

Applicant: MERCURY COMP SYSTEMS INC

Inventor： MCKENNEY DARRYL J ,  ZUIDEMA PAUL ,  BLANCHET DONALD ,  COOLIDGE DANIEL

IPC: H05K7/20

Abstract: Various embodiments provide a circuit board module include a primary cover, a secondary cover and a circuit board sandwiched between the primary cover and the secondary cover. A first set of fins or channels may be provided on a surface of the primary cover. The first set of fins or channels guide cooling air flowing on the surface of the primary cover. A second set of fins or channels may be provided on a surface of the second cover. The second set of fins or channels guide the cooling air flowing on the surface of the secondary cover. The second set of fins or channels intermates with the first set of fins or channels to form a sealed casing enclosing the circuit board. The sealed casing forms a Faraday cage to protect the circuit board from electromagnetic interference.