公开(公告)号：WO2014089076A3

公开(公告)日：2014-10-30

申请号：PCT/US2013072869

申请日：2013-12-03

Applicant: MERCURY COMP SYSTEMS INC

Inventor： MCKENNEY DARRYL J ,  ZUIDEMA PAUL ,  BLANCHET DONALD ,  COOLIDGE DANIEL

IPC: H05K7/20 ,  G06F1/20 ,  H05K7/14

CPC classification number: G06F1/20 ,  H05K7/1452 ,  H05K7/20563 ,  H05K7/20572

Abstract: Various embodiments provide a circuit board module include a primary cover, a secondary cover and a circuit board sandwiched between the primary cover and the secondary cover. A first set of fins or channels may be provided on a surface of the primary cover. The first set of fins or channels guide cooling air flowing on the surface of the primary cover. A second set of fins or channels may be provided on a surface of the second cover. The second set of fins or channels guide the cooling air flowing on the surface of the secondary cover. The second set of fins or channels intermates with the first set of fins or channels to form a sealed casing enclosing the circuit board. The sealed casing forms a Faraday cage to protect the circuit board from electromagnetic interference.

Abstract translation: 各种实施例提供一种电路板模块，包括主盖，副盖和夹在主盖和次盖之间的电路板。 可以在主盖的表面上设置第一组翅片或通道。 第一组翅片或通道引导在主盖表面上流动的冷却空气。 可以在第二盖的表面上设置第二组翅片或通道。 第二组翅片或通道引导在二次盖的表面上流动的冷却空气。 第二组翅片或通道与第一组翅片或通道相互配合以形成封闭电路板的密封壳体。 密封外壳形成法拉第笼，以保护电路板免受电磁干扰。

公开(公告)号：CA2893488A1

公开(公告)日：2014-06-12

申请号：CA2893488

申请日：2013-12-03

Applicant: MERCURY COMP SYSTEMS INC

Inventor： MCKENNEY DARRYL J ,  ZUIDEMA PAUL ,  BLANCHET DONALD ,  COOLIDGE DANIEL

IPC: H05K7/20 ,  G06F1/20 ,  H05K7/14

Abstract: Various embodiments provide a circuit board module include a primary cover, a secondary cover and a circuit board sandwiched between the primary cover and the secondary cover. A first set of fins or channels may be provided on a surface of the primary cover. The first set of fins or channels guide cooling air flowing on the surface of the primary cover. A second set of fins or channels may be provided on a surface of the second cover. The second set of fins or channels guide the cooling air flowing on the surface of the secondary cover. The second set of fins or channels intermates with the first set of fins or channels to form a sealed casing enclosing the circuit board. The sealed casing forms a Faraday cage to protect the circuit board from electromagnetic interference.

公开(公告)号：AU2013356269A1

公开(公告)日：2015-07-16

申请号：AU2013356269

申请日：2013-12-03

Applicant: MERCURY COMP SYSTEMS INC

Inventor： MCKENNEY DARRYL J ,  ZUIDEMA PAUL ,  BLANCHET DONALD ,  COOLIDGE DANIEL

IPC: H05K7/20

Abstract: Various embodiments provide a circuit board module include a primary cover, a secondary cover and a circuit board sandwiched between the primary cover and the secondary cover. A first set of fins or channels may be provided on a surface of the primary cover. The first set of fins or channels guide cooling air flowing on the surface of the primary cover. A second set of fins or channels may be provided on a surface of the second cover. The second set of fins or channels guide the cooling air flowing on the surface of the secondary cover. The second set of fins or channels intermates with the first set of fins or channels to form a sealed casing enclosing the circuit board. The sealed casing forms a Faraday cage to protect the circuit board from electromagnetic interference.