公开(公告)号：WO2005109974A2

公开(公告)日：2005-11-17

申请号：PCT/US2005005007

申请日：2005-02-17

Applicant: MERRIMAC IND INC

Inventor： LAURIELLO PHILIP J

IPC: H05K1/03 ,  H05K3/32 ,  H05K3/36 ,  H05K3/40 ,  H05K3/46 ,  H05K7/06

CPC classification number: H05K3/4092 ,  H05K3/328 ,  H05K3/4611 ,  H05K2201/0129 ,  H05K2201/015 ,  H05K2201/09145 ,  H05K2201/0919 ,  H05K2201/09754 ,  H05K2201/1034 ,  Y10T29/49126

Abstract: A signal processing module can be manufactured from a plurality of composite substrate layers, each substrate layer includes elements of multiple individual processing modules. Surfaces of the layers are selectively metalicized to form signal processing elements when the substrate layers are fusion bonded in a stacked arrangement. Prior to bonding, the substrate layers are milled to form gaps located at regions between the processing modules. Prior to bonding, the leads are positioned such that they extend from signal coupling points on said metalicized surfaces into the gap regions. The substrate layers are then fusion bonded to each other such that the plurality of substrate layers form signal processing modules with leads that extend from an interior of the modules into the gap areas. The individual modules may then be separated by milling the substrate layers to de-panel the modules.

Abstract translation: 信号处理模块可以由多个复合衬底层制造，每个衬底层包括多个单独的处理模块的元件。 当衬底层以堆叠布置融合时，这些层的表面被选择性地金属化以形成信号处理元件。 在接合之前，将衬底层研磨以形成位于处理模块之间的区域的间隙。 在接合之前，引线定位成使得它们从所述金属化表面上的信号耦合点延伸到间隙区域中。 然后将衬底层彼此熔合，使得多个衬底层形成具有从模块内部延伸到间隙区域中的引线的信号处理模块。 然后可以通过研磨衬底层来分离各个模块以使模块脱模。

公开(公告)号：CA2564714A1

公开(公告)日：2005-11-17

申请号：CA2564714

申请日：2005-02-17

Applicant: MERRIMAC IND INC

Inventor： LAURIELLO PHILIP J

IPC: H05K1/03 ,  H05K3/32 ,  H05K3/36 ,  H05K3/40 ,  H05K3/46 ,  H05K7/06

Abstract: A signal processing module can be manufactured from a plurality of composite substrate layers, each substrate layer includes elements of multiple individual processing modules. Surfaces of the layers are selectively metalicized to form signal processing elements when the substrate layers are fusion bonded in a stacked arrangement. Prior to bonding, the substrate layers are milled to form gaps located at regions between the processing modules. Prior to bonding, the leads are positioned such that they extend from signal coupling points on said metalicized surfaces into the gap regions. The substrate layers are then fusion bonded to each other such that the plurality of substrate layers form signal processing modules with leads that extend from an interior of the modules into the gap areas. The individual modules may then be separated by milling the substrate layers to de-panel the modules.

公开(公告)号：EP1741323A4

公开(公告)日：2007-06-20

申请号：EP05713705

申请日：2005-02-17

Applicant: MERRIMAC IND INC

Inventor： LAURIELLO PHILIP J

IPC: H05K3/40 ,  H05K1/03 ,  H05K3/32 ,  H05K3/36 ,  H05K3/46 ,  H05K7/06

CPC classification number: H05K3/4092 ,  H05K3/328 ,  H05K3/4611 ,  H05K2201/0129 ,  H05K2201/015 ,  H05K2201/09145 ,  H05K2201/0919 ,  H05K2201/09754 ,  H05K2201/1034 ,  Y10T29/49126

Abstract: A signal processing module (100) can be manufactured from a plurality of composite substrate layers (104-106), each substrate layer includes elements of multiple individual processing modules. Surfaces of the layers are selectively metalicized to form signal processing elements when the substrate layers (104-406) are fusion bonded in a stacked arrangement. Prior to bonding, the substrate layers are milled to form gaps located at regions between the processing modules. Prior to bonding, the leads (110) are positioned such that they extend from signal coupling points on said metalicized surfaces into the gap regions. The substrate layers (104-106) are then fusion bonded to each other such that the plurality of substrate layers (104-106) form signal processing modules (100) with leads (110) that extend from an interior of the modules into the gap areas. The individual modules (100) may then be separated by milling the substrate layers to de-panel the modules.

Abstract translation: 信号处理模块（100）可以由多个复合衬底层（104-106）制造，每个衬底层包括多个单独处理模块的元件。 当衬底层（104-406）以层叠布置熔接时，层的表面被选择性地金属化以形成信号处理元件。 在结合之前，研磨衬底层以形成位于处理模块之间区域的间隙。 在键合之前，引线（110）被定位成使得它们从所述金属化表面上的信号耦合点延伸到间隙区域中。 然后将衬底层（104-106）彼此熔接，使得多个衬底层（104-106）形成具有引线（110）的信号处理模块（100），引线（110）从模块的内部延伸到间隙 区域。 然后可以通过研磨衬底层来分离各个模块（100）以去除模块的面板。