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公开(公告)号:JPS61294778A
公开(公告)日:1986-12-25
申请号:JP14597786
申请日:1986-06-20
Applicant: METCAL INC
Inventor: KENT HAROLD B
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公开(公告)号:AT84928T
公开(公告)日:1993-02-15
申请号:AT86304393
申请日:1986-06-09
Applicant: METCAL INC
Inventor: KENT HAROLD B
Abstract: A flexible circuit which may be a strap or a board or the like has a plurality of conductors exposed on one surface in a predetermined array and a heater disposed on the opposed surface so as to heat the exposed conductors. The exposed conductors may have solder or the heat activated conductive bonding material applied thereto so that the flexible circuit may be directly connected to a component, a printed circuit board, a connector or the like. If a reusable bonding material, such as solder, is employed the heater may be utilized to both connect and disconnect the flexible circuit.
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公开(公告)号:CA1264378A
公开(公告)日:1990-01-09
申请号:CA574541
申请日:1988-08-11
Applicant: METCAL INC
Inventor: KENT HAROLD B
IPC: H05B3/58
Abstract: 27 A flexible circuit which may be a strap or a board or the like has a plurality of conductors exposed on one surface in a predetermined array and a heater disposed on the opposed surface so as to heat the exposed conductors. The exposed conductors may have solder or the heat activated conductive bonding material applied thereto so that the flexible circuit may be directly connected to a component, a printed circuit board, a connector or the like. If a reusable bonding material, such as solder, is employed the heater may be utilized to both connect and disconnect the flexible circuit.
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公开(公告)号:CA1255012A
公开(公告)日:1989-05-30
申请号:CA510002
申请日:1986-05-26
Applicant: METCAL INC
Inventor: KENT HAROLD B
Abstract: A flexible circuit which may be a strap or a board or the like has a plurality of conductors exposed on one surface in a predetermined array and a heater disposed on the opposed surface so as to heat the exposed conductors. The exposed conductors may have solder or the heat activated conductive bonding material applied thereto so that the flexible circuit may be directly connected to a component, a printed circuit board, a connector or the like. If a reusable bonding material, such as solder, is employed the heater may be utilized to both connect and disconnect the flexible circuit.
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公开(公告)号:DE3687546D1
公开(公告)日:1993-03-04
申请号:DE3687546
申请日:1986-06-09
Applicant: METCAL INC
Inventor: KENT HAROLD B
Abstract: A flexible circuit which may be a strap or a board or the like has a plurality of conductors exposed on one surface in a predetermined array and a heater disposed on the opposed surface so as to heat the exposed conductors. The exposed conductors may have solder or the heat activated conductive bonding material applied thereto so that the flexible circuit may be directly connected to a component, a printed circuit board, a connector or the like. If a reusable bonding material, such as solder, is employed the heater may be utilized to both connect and disconnect the flexible circuit.
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公开(公告)号:DE3687546T2
公开(公告)日:1993-06-03
申请号:DE3687546
申请日:1986-06-09
Applicant: METCAL INC
Inventor: KENT HAROLD B
Abstract: A flexible circuit which may be a strap or a board or the like has a plurality of conductors exposed on one surface in a predetermined array and a heater disposed on the opposed surface so as to heat the exposed conductors. The exposed conductors may have solder or the heat activated conductive bonding material applied thereto so that the flexible circuit may be directly connected to a component, a printed circuit board, a connector or the like. If a reusable bonding material, such as solder, is employed the heater may be utilized to both connect and disconnect the flexible circuit.
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公开(公告)号:EP0206619A2
公开(公告)日:1986-12-30
申请号:EP86304393
申请日:1986-06-09
Applicant: METCAL INC
Inventor: KENT HAROLD B
CPC classification number: H05K3/363 , H05K1/0212 , H05K1/0242 , H05K3/28 , H05K3/3494 , H05K3/36 , H05K2201/049 , H05K2201/056 , H05K2201/083 , H05K2201/10727 , H05K2203/1115 , H05K2203/1581
Abstract: A flexible circuit which may be a strap or a board or the like has a plurality of conductors exposed on one surface in a predetermined array and a heater disposed on the opposed surface so as to heat the exposed conductors. The exposed conductors may have solder or the heat activated conductive bonding material applied thereto so that the flexible circuit may be directly connected to a component, a printed circuit board, a connector or the like. If a reusable bonding material, such as solder, is employed the heater may be utilized to both connect and disconnect the flexible circuit.
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