公开(公告)号：WO1995022172A1

公开(公告)日：1995-08-17

申请号：PCT/US1995002109

申请日：1995-02-13

Applicant: MICROELECTRONICS AND COMPUTER TECHNOLOGY CORPORATION

Inventor： MICROELECTRONICS AND COMPUTER TECHNOLOGY CORPORATION ,  NOLAN, Ernest, R. ,  DUANE, Diana, Carter ,  HERDER, Todd, H. ,  BISHOP, Thomas, A. ,  TRAN, Kimcuc, T. ,  FROEHLICH, Robert, W. ,  GERMAN, Randy, L. ,  NELSON, Richard, D. ,  LEE, Chung, J. ,  BREEN, Mark, R. ,  KESWICK, Kathryn, V.

IPC: H01L21/44

CPC classification number: H01L24/12 ,  H01L21/563 ,  H01L23/49811 ,  H01L24/03 ,  H01L24/05 ,  H01L24/11 ,  H01L24/16 ,  H01L24/48 ,  H01L2224/0231 ,  H01L2224/03912 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05554 ,  H01L2224/05599 ,  H01L2224/0603 ,  H01L2224/114 ,  H01L2224/1147 ,  H01L2224/116 ,  H01L2224/11902 ,  H01L2224/13099 ,  H01L2224/1319 ,  H01L2224/48091 ,  H01L2224/48465 ,  H01L2224/73203 ,  H01L2224/85444 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01056 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/19042 ,  Y10S438/903 ,  H01L2224/45099 ,  H01L2924/00 ,  H01L2224/85399

Abstract: Compliant electrically conductive connection bumps (10) for an adhesive flip chip (12) integrated circuit device and various methods for forming the bumps include the steps of forming polymer bumps (24) on a substrate (12) or an integrated circuit die and coating the polymer bumps with a metallization layer (26). The polymer bump forming step includes the steps of coating a polymer material on a substrate, curing the polymer, and etching the bump pattern from the polymer material. The overcoating step includes electrolessly plating a ductile metal such as gold on the polymer bump.

Abstract translation: 用于粘合倒装芯片（12）集成电路器件的合适的导电连接凸块（10）和用于形成凸块的各种方法包括以下步骤：在基底（12）或集成电路晶片上形成聚合物凸块（24） 具有金属化层（26）的聚合物凸块。 聚合物凸块形成步骤包括以下步骤：在基材上涂覆聚合物材料，固化聚合物，以及从聚合物材料蚀刻凸块图案。 外涂步骤包括在聚合物凸块上无电镀电镀金属如金。

公开(公告)号：EP0745270A1

公开(公告)日：1996-12-04

申请号：EP95910308.0

申请日：1995-02-13

Applicant: MICROELECTRONICS AND COMPUTER TECHNOLOGY CORPORATION

Inventor： NOLAN, Ernest, R. ,  DUANE, Diana, Carter ,  HERDER, Todd, H. ,  BISHOP, Thomas, A. ,  TRAN, Kimcuc, T. ,  FROEHLICH, Robert, W. ,  GERMAN, Randy, L. ,  NELSON, Richard, D. ,  LEE, Chung, J. ,  BREEN, Mark, R. ,  KESWICK, Kathryn, V.

IPC: H01L23 ,  H01L21

CPC classification number: H01L24/12 ,  H01L21/563 ,  H01L23/49811 ,  H01L24/03 ,  H01L24/05 ,  H01L24/11 ,  H01L24/16 ,  H01L24/48 ,  H01L2224/0231 ,  H01L2224/03912 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05554 ,  H01L2224/05599 ,  H01L2224/0603 ,  H01L2224/114 ,  H01L2224/1147 ,  H01L2224/116 ,  H01L2224/11902 ,  H01L2224/13099 ,  H01L2224/1319 ,  H01L2224/48091 ,  H01L2224/48465 ,  H01L2224/73203 ,  H01L2224/85444 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01056 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/19042 ,  Y10S438/903 ,  H01L2224/45099 ,  H01L2924/00 ,  H01L2224/85399

Abstract: Compliant electrically conductive connection bumps (10) for an adhesive flip chip (12) integrated circuit device and various methods for forming the bumps include the steps of forming polymer bumps (24) on a substrate (12) or an integrated circuit die and coating the polymer bumps with a metallization layer (26). The polymer bump forming step includes the steps of coating a polymer material on a substrate, curing the polymer, and etching the bump pattern from the polymer material. The overcoating step includes electrolessly plating a ductile metal such as gold on the polymer bump.