-
1.
公开(公告)号:WO2019103769A1
公开(公告)日:2019-05-31
申请号:PCT/US2018/044434
申请日:2018-07-30
Applicant: MICRON TECHNOLOGY, INC.
Inventor: HOWE, Gary , STAVE, Eric, J. , KINSLEY, Thomas, H. , PRATHER, Matthew, A.
Abstract: Methods, systems, and apparatuses related to memory operation with on- die termination (ODT) are provided. A memory device may be configured to provide ODT at a first portion (e.g., rank) during multiple communications at a second portion ( e.g. , rank). For example, a memory device may receive a first command instructing a first portion to perform a first communication and instructing a second portion to enter an ODT mode. The device may perform, with the first portion, the first communication with a host while the second portion is in the ODT mode. The device may receive a second command instructing the first portion to perform a second communication, and the device may perform, with the first portion, the second communication while the second portion remains in the ODT mode. The second portion may persist in the ODT mode for an indicated number of communications, or until instructed to exit the ODT mode.
-
公开(公告)号:WO2019045795A1
公开(公告)日:2019-03-07
申请号:PCT/US2018/029143
申请日:2018-04-24
Applicant: MICRON TECHNOLOGY, INC
Inventor: MAI, Thanh K. , HOWE, Gary
Abstract: A semiconductor device may include a plurality of memory banks, a plurality of mode registers that may control an operational mode associated with each of the plurality of memory banks, and a set of global wiring lines coupled to each of the plurality of mode registers. The set of global wiring lines may include a first global wiring line to transmit data to each of the plurality of mode registers, a second global wiring line to transmit an address signal to each of the plurality of mode registers, a third global wiring line to transmit a read command signal to each of the plurality of mode registers, and a fourth global wiring line to transmit a write command signal to each of the plurality of mode registers.
-
公开(公告)号:WO2023287593A1
公开(公告)日:2023-01-19
申请号:PCT/US2022/035809
申请日:2022-06-30
Applicant: MICRON TECHNOLOGY, INC.
Inventor: FUJIWARA, Yoshinori , GADAMSETTY, Harish V. , HOWE, Gary , MONTIERTH, Dennis G. , SHORE, Michael A. , JOHNSON, Jason M.
IPC: G06F3/06
Abstract: Apparatuses, systems, and methods for refresh address masking. A memory device may refresh word lines as part of refresh operation by cycling through the word lines in a sequence. However, it may be desirable to avoid activating certain word lines (e.g., because they are defective). Refresh masking logic for each bank may include a fuse latch which stores a selected address associated with a word line to avoid. When a refresh address is generated it may be compared to the selected address. If there is a match, a refresh stop signal may be activated, which may prevent refreshing of the word line(s).
-
公开(公告)号:WO2019045792A1
公开(公告)日:2019-03-07
申请号:PCT/US2018/028892
申请日:2018-04-23
Applicant: MICRON TECHNOLOGY, INC
Inventor: HOWE, Gary
IPC: G11C7/10
Abstract: A memory device (10) may include one or more memory banks (12) that store data and one or more input buffers (50). The input buffers (50) may receive command address signals to access the one or more memory banks (12). The memory device (10) may operate in one of a first mode of operation or a second mode of operation. The one or more input buffers (50) may operate under a first bias current when the memory device (10) is in the first mode of operation or a second bias current when the memory device (10) is in the second mode of operation, and the first bias current may be greater than the second bias current.
-
5.
公开(公告)号:EP4446899A3
公开(公告)日:2024-12-11
申请号:EP24198261.0
申请日:2018-07-30
Applicant: Micron Technology, Inc.
Inventor: HOWE, Gary , STAVE, Eric, J. , KINSLEY, Thomas, H. , PRATHER, Matthew, A.
IPC: G06F13/40
Abstract: Methods, systems, and apparatuses related to memory operation with on-die termination (ODT) are provided. A memory device may be configured to provide ODT at a first portion (e.g., rank) during multiple communications at a second portion (e.g., rank). For example, a memory device may receive a first command instructing a first portion to perform a first communication and instructing a second portion to enter an ODT mode. The device may perform, with the first portion, the first communication with a host while the second portion is in the ODT mode. The device may receive a second command instructing the first portion to perform a second communication, and the device may perform, with the first portion, the second communication while the second portion remains in the ODT mode. The second portion may persist in the ODT mode for an indicated number of communications, or until instructed to exit the ODT mode.
-
公开(公告)号:EP3701531A1
公开(公告)日:2020-09-02
申请号:EP18869605.8
申请日:2018-06-27
Applicant: Micron Technology, Inc.
Inventor: ALZHEIMER, Joshua E. , HOWE, Gary , VENKATA, Harish N.
IPC: G11C7/10
-
7.
公开(公告)号:EP4446899A2
公开(公告)日:2024-10-16
申请号:EP24198261.0
申请日:2018-07-30
Applicant: Micron Technology, Inc.
Inventor: HOWE, Gary , STAVE, Eric, J. , KINSLEY, Thomas, H. , PRATHER, Matthew, A.
IPC: G06F13/40
Abstract: Methods, systems, and apparatuses related to memory operation with on-die termination (ODT) are provided. A memory device may be configured to provide ODT at a first portion (e.g., rank) during multiple communications at a second portion (e.g., rank). For example, a memory device may receive a first command instructing a first portion to perform a first communication and instructing a second portion to enter an ODT mode. The device may perform, with the first portion, the first communication with a host while the second portion is in the ODT mode. The device may receive a second command instructing the first portion to perform a second communication, and the device may perform, with the first portion, the second communication while the second portion remains in the ODT mode. The second portion may persist in the ODT mode for an indicated number of communications, or until instructed to exit the ODT mode.
-
8.
公开(公告)号:EP3714456A1
公开(公告)日:2020-09-30
申请号:EP18880990.9
申请日:2018-07-30
Applicant: Micron Technology, Inc.
Inventor: HOWE, Gary , STAVE, Eric, J. , KINSLEY, Thomas, H. , PRATHER, Matthew, A.
-
公开(公告)号:EP3625799A1
公开(公告)日:2020-03-25
申请号:EP18850106.8
申请日:2018-04-23
Applicant: Micron Technology, Inc.
Inventor: HOWE, Gary
IPC: G11C7/10
-
-
-
-
-
-
-
-