Abstract:
A direct contact condenser (10) having a downward vapor flow chamber (18) and an upward flow vapor chamber (20), wherein each of the vapor chambers includes a plurality of cooling pipes (22, 24) and a vapor-liquid contact medium (28, 29), which may comprise a plurality of adjacent sheets, and which define a substantially straightforward vapor flow path, disposed thereunder. The upward flow chamber includes a second set of cooling liquid supply pipes (26) and pressure controlled valve means (54). The condenser further includes separate condensate collection wells (30, 32). A computational model may be used to perform calculations to predict the performance of the condenser.
Abstract:
A direct contact condenser (10) having a downward vapor flow chamber (18) and an upward flow vapor chamber (20), wherein each of the vapor chambers includes a plurality of cooling pipes (22, 24) and a vapor-liquid contact medium (28, 29), which may comprise a plurality of adjacent sheets, and which define a substantially straightforward vapor flow path, disposed thereunder. The upward flow chamber includes a second set of cooling liquid supply pipes (26) and pressure controlled valve means (54). The condenser further includes separate condensate collection wells (30, 32). A computational model may be used to perform calculations to predict the performance of the condenser.