公开(公告)号：MY155587A

公开(公告)日：2015-11-03

申请号：MYPI2010005685

申请日：2010-11-30

Applicant: MIMOS BERHAD

Inventor： SHENG DANIEL BIEN CHIA ,  SAMAN RAHIMAH MOHD ,  BUYONG MUHAMAD RAMDZAN ,  BADARUDDIN SITI AISHAH MOHAMAD

IPC: H01L21/20

Abstract: THE PRESENT INVENTION RELATES TO A METHOD OF TRANSFERRING SILICON BASED LAYER 101 ONTO POLYMER FILM 103 IN FLEXIBLE POLYMER TYPE DEVICES THAT APPLIES IN THE AREA TAGGING, BIOMEDICAL AND WEARABLE SENSORS AND DEVICES. THE METHOD OF THE PRESENT INVENTION IS COMPATIBLE WITH WAFER FABRICATION OR STANDARD IC PROCESSING. THE TUNGSTEN PLUG PROCESS IS THE CORE ENABLER TO ALLOW SUCCESSFUL TRANSFER OF SILICON STRUCTURES TO THE POLYMER. MOST ILLUSTRATIVE