公开(公告)号：MY172121A

公开(公告)日：2019-11-14

申请号：MYUI2013001818

申请日：2013-05-17

Applicant: MIMOS BERHAD

Inventor： LEE WAI YEE ,  DANIEL BIEN CHIA SHENG ,  MOHSEN NABIPOOR ,  SURAYA BINTI SULAIMAN

IPC: G01N27/22

Abstract: The present invention relates to a capacitive humidity sensor (100) comprising: a semiconductor substrate (101); an insulating layer (103) rests on the semiconductor substrate (101); a sensing membrane (105); a plurality of interdigitated electrodes (107); and a plurality of electrode contacts (109); characterised in that the present invention having ground plane connections (111) and the interdigitated electrodes (107) are sandwiched by the sensing membrane (105). The ground plane connections (111) and the sandwiching sensing membrane (105) are configured to eliminate stray capacitance and to provide optimal utilisation of fringing field effect respectively.

公开(公告)号：MY191097A

公开(公告)日：2022-05-30

申请号：MYPI2017001435

申请日：2017-09-29

Applicant: MIMOS BERHAD

Inventor： LEE MAI WOON ,  SURAYA BINTI SULAIMAN ,  DR LEE WAI YEE

IPC: B41J2/01 ,  H05K3/12

Abstract: The present invention relates to a method of fabricating a printed device using a consumer home office inkjet printer to reduce and overcome the 'coffee ring' and other printing imperfections. The method comprises the steps of preparing a circuit design for printing by the inkjet printer onto a flexible substrate (100) including dividing the same into a number of divisional designs, printing a first divisional design onto the flexible substrate at a predefined ink opacity (101) determined based on the number of divisional designs thereof, printing a second divisional design at the said predefined ink opacity with an overlap on the first divisional design printed thereof (102), printing a subsequent divisional design at the said predefined ink opacity with an overlap either on the first or the second divisional design, or on every printed divisional design thereon (103) and printing an overall blanket of the circuit design overlaying onto the said printed divisional designs at the said predefined ink opacity (104). (Figure 1)

公开(公告)号：MY176767A

公开(公告)日：2020-08-21

申请号：MYPI2015702215

申请日：2015-07-07

Applicant: MIMOS BERHAD

Inventor： LEE WAI YEE ,  DANIEL BIEN CHIA SHENG ,  SURAYA BINTI SULAIMAN ,  KHAIRUL ANUAR BIN ABDUL WAHID ,  LEE HING WAH

Abstract: The present invention disclosed a thin-film resistance temperature detector (RTD) device with a single RTD structure, dual interconnecting RTD structures, and dual interconnecting RTD structures paired to a plurality of sensor electrodes (60). A method for fabricating the thin-film RTD device with the single RTD structure, dual interconnecting RTD structures, and dual interconnecting RTD structures paired to the plurality of sensor electrodes (60) are also disclosed herein. The RTD pattern (10) (20) is connected in series, while the dual RTD structures are connected via a concentric square pad (30) in a stacking and parallel manner. Further, the RTD pattern (10) (20) is arranged in a continuous array and provides a localised and user-selectable point resistance value via a plurality of contact pads (50A) (50B) and a secondary busbar connection line (40) which allows the RTD device to continue operating even when any of the RTD patterns or the RTD structures are broken.