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公开(公告)号：MY173261A
公开(公告)日：2020-01-09
申请号：MYUI20072075
申请日：2007-11-22
Applicant: MIMOS BERHAD
Inventor： KHAIRIL MAZWAN MOHD ZAINI , WAN IDRUS , ANIFAH ZAKARIA
Abstract: A method for removing photoresist using Wafer Edge Exclusion (WEE) from the water coding area is disclosed herein. WEE is used at metal-1 layer and metal-2 layers in order to reduce the topographical defects around the water coding area. Figure 2
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