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1.发明专利Resin composition for fine porous support membrane, fine porous support membrane using the same, and composite semipermeable membrane 审中-公开用于精细多孔支撑膜的树脂组合物，使用其的多孔支撑膜和复合可切割膜
公开(公告)号：JP2014000533A
公开(公告)日：2014-01-09
申请号：JP2012137949
申请日：2012-06-19
Applicant: Mitsui Chemicals Inc , 三井化学株式会社 , National Univ Of Singapore , ナショナル ユニヴァーシティー オブ シンガポール
Inventor： NISHIURA KATSUNORI , TORIIDA MASAHIRO , TAMAI MASAJI , CHUNG TAI-SHUNG , HAN GANG
IPC: B01D71/68 , B01D69/10 , B01D69/12 , B01D71/52 , B01D71/56 , C08J9/28 , C08K5/053 , C08L71/10 , C08L81/06
Abstract: PROBLEM TO BE SOLVED: To provide a fine porous support membrane for a composite semipermeable membrane being high in the salt checking ratio and excellent in water permeability and a resin composition for forming the fine porous support membrane.SOLUTION: A resin composition for a fine porous support membrane of the present invention includes aromatic polysulfone and aromatic polyether having a proton acid group. The present invention can provide a resin composition for a fine porous support membrane capable of providing a composite semipermeable membrane that can reveal higher water permeable performance than a composite semipermeable membrane using a conventional fine porous support membrane composed of a polysulfone single body, while maintaining the salt checking ratio and suitable for forming a fine porous support membrane constituting the composite semipermeable membrane; a fine porous support membrane formed by using the resin composition for the fine porous support membrane; and a composite semipermeable membrane having a fine porous support membrane layer.
Abstract translation: 要解决的问题：提供一种复合半透膜，其具有高的盐检率和优异的透水性，以及用于形成微细多孔支撑膜的树脂组合物。解决方案：一种用于细多孔 本发明的支撑膜包括具有质子酸基团的芳族聚砜和芳香族聚醚。 本发明可以提供一种微细多孔支撑膜的树脂组合物，其能够提供复合半透膜，该复合半透膜可以比使用由聚砜单体组成的传统的微孔支撑膜来复合半透膜更高的透水性，同时保持 盐检查率，适用于形成构成复合半透膜的细多孔支撑膜; 通过使用该微细多孔支撑膜用树脂组合物而形成的细多孔支撑膜; 和具有细多孔支撑膜层的复合半透膜。
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2.发明专利Resin composition, polyimide metal laminate using the same, and electronic circuit substrate 有权树脂组合物，使用其的聚酰亚胺金属层压板和电子电路基板
公开(公告)号：JP2013018806A
公开(公告)日：2013-01-31
申请号：JP2011150944
申请日：2011-07-07
Applicant: Mitsui Chemicals Inc , 三井化学株式会社 , Agency For Science Technology & Research , エージェンシー フォー サイエンス,テクノロジー アンド リサーチ
Inventor： NISHIURA KATSUNORI , TORIIDA MASAHIRO , TAKAGI TOSHIHIKO , TAMAI MASAJI , HE CHAO-BIN , MYA KHINE YI , YANG SHAO , LI XU
IPC: C08L79/08 , B32B15/088 , B32B27/18 , C08K5/5435 , H05K1/03
Abstract: PROBLEM TO BE SOLVED: To provide a resin composition having low dielectric dissipation factor and high surface smoothness; and a metal laminate using the resin composition.SOLUTION: The resin composition includes: (a) an aromatic polyimide prepared by reacting a diamine compound including an aromatic diamine compound with a tetracarboxylic dianhydride including an aromatic tetracarboxylic dianhydride; and (b) a cage type silsesquioxane partial cleavage structure having a silanol group and a phenyl group and having a dielectric loss tangent lower than that of the aromatic polyimide (a). In the aromatic polyimide, a ratio of the total of the aromatic diamine compound and the aromatic tetracarboxylic dianhydride to the total of the diamine compound and the tetracarboxylic dianhydride is ≥70 mol%, and when two or more aromatic rings are connected mutually in the molecule in the aromatic diamine compound or the aromatic tetracarboxylic dianhydride, aromatic rings are connected mutually via a single bond.
Abstract translation: 要解决的问题：提供具有低介电损耗因数和高表面平滑度的树脂组合物; 和使用该树脂组合物的金属层压体。 解决方案：树脂组合物包括：（a）通过使包含芳族二胺化合物的二胺化合物与包含芳族四羧酸二酐的四羧酸二酐反应制备的芳族聚酰亚胺; 和（b）具有硅烷醇基和苯基并且具有低于芳族聚酰亚胺（a）的介电损耗角正切的笼型倍半硅氧烷部分裂解结构。 在芳族聚酰亚胺中，芳族二胺化合物和芳香族四羧酸二酐的总量与二胺化合物和四羧酸二酐的总量的比例为≥70摩尔％，当分子中相互连接两个以上的芳香环时 在芳族二胺化合物或芳族四羧酸二酐中，芳环通过单键相互连接。 版权所有（C）2013，JPO＆INPIT
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公开(公告)号：JP2011025113A
公开(公告)日：2011-02-10
申请号：JP2009171024
申请日：2009-07-22
Applicant: Mitsui Chemicals Inc , National Univ Of Singapore , ナショナル ユニヴァーシティー オブ シンガポール , 三井化学株式会社
Inventor： TORIIDA MASAHIRO , TAMAI MASAJI , YOUCHANG XIAO , CHNG MEI LIN , CHUNG TAI-SHUNG
Abstract: PROBLEM TO BE SOLVED: To provide a novel carbon film and the like having outstanding gas separation performance. SOLUTION: The carbon film is obtained by thermally decomposing a film formed from aromatic polyether having a proton acid group. COPYRIGHT: (C)2011,JPO&INPIT
Abstract translation: 要解决的问题：提供具有优异气体分离性能的新型碳膜等。 解决方案：通过热分解由具有质子酸基团的芳族聚醚形成的膜来获得碳膜。 版权所有（C）2011，JPO＆INPIT
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4.发明专利
公开(公告)号：JP2005255917A
公开(公告)日：2005-09-22
申请号：JP2004071870
申请日：2004-03-15
Applicant: Mitsui Chemicals Inc , 三井化学株式会社
Inventor： GOTO KENICHI , HASEGAWA AKIRA , TAMAI MASAJI
Abstract: PROBLEM TO BE SOLVED: To obtain a resin composition having a low dielectric constant, a low dielectric tangent, heat resistance, and adhesion to conductive materials, and to provide a laminate for high-frequency circuits using the resin composition.
SOLUTION: The resin composition is composed of 3-72 pts.wt. of (I) a polymer selected from 4-methyl-1-pentene-based polymers and/or cycloolefin-based copolymers containing at least a monomer component expressed by formula (1) which takes a structure expressed by formula (2) in the polymer, 0.5-50 pts.wt. of (II) a modified poly-α-olefinic polymer having 0.01-10 wt.% of a portion graft-modified with an unsaturated carboxylic acid and/or its derivatives, and 25-90 pts.wt. of (III) an inorganic filler with an average particle diameter of 0.1-100 μm, provided that the total of (I), (II), and (III) is 100 pts.wt.
COPYRIGHT: (C)2005,JPO&NCIPIAbstract translation: 要解决的问题：为了获得具有低介电常数，低介电切线，耐热性和对导电材料的粘合性的树脂组合物，并提供使用该树脂组合物的高频电路层压体。 解决方案：树脂组合物由3-72重量份 选自（I）选自4-甲基-1-戊烯基聚合物和/或至少含有由式（1）表示的单体组分的环烯烃基共聚物的聚合物，其在聚合物中具有由式（2）表示的结构 ，0.5-50重量份 （II）具有0.01-10重量％的用不饱和羧酸和/或其衍生物接枝改性的部分的改性聚-α-烯烃聚合物和25-90重量份的 （III）的平均粒径为0.1-100μm的无机填料，条件是（I），（II）和（III）的总量为100重量份。 版权所有（C）2005，JPO＆NCIPI
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公开(公告)号：JP2004281713A
公开(公告)日：2004-10-07
申请号：JP2003071102
申请日：2003-03-17
Applicant: Mitsui Chemicals Inc , 三井化学株式会社
Inventor： GOTO KENICHI , KAMATA JUN , TAMAI MASAJI
Abstract: PROBLEM TO BE SOLVED: To provide a circuit board for a microwave module which is provided with an insulation film that has an excellent dielectric characteristic corresponding to high-frequency communication and superior properties such as hygroscopicity resistance, mechanical property or heat resistance, etc. through stable and efficient formation by photo processing.
SOLUTION: The circuit board for a microwave module is provided with an insulation film made of polyether-based resin with a repetitive unit expressed by a general formula (I). In the formula, A represents a bivalent alkylene group of carbon numbers 1-10, -SO
2 -, -SO-, -S-, -O-, or -CO-. a and b are independent integers of 0 to 4, m is an integer of 0 or 1, n is an integer of 1 t 3. R
1 to R
6 independently represent either of hydrogen atom, alkyl group of carbon numbers 1-8, and halogen atom, and at least one of R
1 to R
4 is a group other than hydrogen atom.
COPYRIGHT: (C)2005,JPO&NCIPIAbstract translation: 解决的问题：为了提供一种具有绝缘膜的微波模块电路板，所述绝缘膜具有对应于高频连接的优异的介电特性以及诸如吸湿性，机械性能或耐热性等优异的性能， 等等，通过照片处理的稳定和有效的形成。 解决方案：用于微波模块的电路板设置有由聚醚基树脂制成的绝缘膜，其具有由通式（I）表示的重复单元。 在该式中，A表示碳原子数为1-10，-SO - ， - S - ， - O-或-CO-的二价亚烷基。 a和b是0〜4的独立整数，m为0或1的整数，n为1〜3的整数。R
1 至R SB为独立代表 氢原子，碳原子数为1-8的烷基和卤素原子，R SB 1至R 4中的至少一个为除氢原子以外的基团。 版权所有（C）2005，JPO＆NCIPI -
Patent Agency Ranking
公开(公告)号：JP2002202423A
公开(公告)日：2002-07-19
申请号：JP2000399901
申请日：2000-12-28
Applicant: MITSUI CHEMICALS INC
Inventor： ONO TAKASHI , KUROKI TAKASHI , SHIODA TAKASHI , TAMAI MASAJI
Abstract: PROBLEM TO BE SOLVED: To provide a polymer optical waveguide integrally having low light loss with =300 deg.C heat resistance. SOLUTION: The polymer optical waveguide of a single mode or of a multi mode is characterized by using a polyimide having a formula (1) in the principal chain skeleton and having a cross-linking group in a part of or all of its molecular terminals expressed by a formula (2), as an optical core and/or an optical cladding.
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公开(公告)号：JP2002202422A
公开(公告)日：2002-07-19
申请号：JP2000399900
申请日：2000-12-28
Applicant: MITSUI CHEMICALS INC
Inventor： ONO TAKASHI , KUROKI TAKASHI , SHIODA TAKASHI , TAMAI MASAJI
Abstract: PROBLEM TO BE SOLVED: To provide a polymer optical waveguide integrally having low light loss with =300 deg.C heat resistance (2), high optical isotropy with
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公开(公告)号：JP2002201277A
公开(公告)日：2002-07-19
申请号：JP2000399902
申请日：2000-12-28
Applicant: MITSUI CHEMICALS INC
Inventor： ONO TAKASHI , KUROKI TAKASHI , TAMAI MASAJI
Abstract: PROBLEM TO BE SOLVED: To provide a polycarbonate resin having (1) a low dispersibility with an Abbe's number of >=40, (2) a high refractive index of >=1.58, (3) a heat resistance represented by a glass transition temperature of >=100 deg.C, (4) a transparency represented by a light transmittance of >=85% and (5) a melt-processibility. SOLUTION: The polycarbonate resin has units of formula (1) and formula (2) [wherein R is represented by formula (3); and X1, X2 and X3 are each represented by formula (4)] in its main chain.
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公开(公告)号：JP2002201276A
公开(公告)日：2002-07-19
申请号：JP2000399898
申请日：2000-12-28
Applicant: MITSUI CHEMICALS INC
Inventor： ONO TAKASHI , KUROKI TAKASHI , TAMAI MASAJI
Abstract: PROBLEM TO BE SOLVED: To provide a polyester resin having (1) a low dispersibility with an Abbe's number of >=40, (2) a high refractive index of >=1.58, (3) a heat resistance represented by a glass transition temperature of >=100 deg.C, (4) a transparency represented by a light transmittance of >=85% and (5) a melt-processibility. SOLUTION: The polyester resin has a unit of formula (1) [wherein R is represented by formula (2); and X1, X2 and X3 are each represented by formula (3)] in its main chain.
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公开(公告)号：JP2002045781A
公开(公告)日：2002-02-12
申请号：JP2000236403
申请日：2000-08-04
Applicant: MITSUI CHEMICALS INC
Inventor： HAYASHI TOMONAO , TAMAI MASAJI , IMON SHUHEI
Abstract: PROBLEM TO BE SOLVED: To provide a heat-resistant and low reflective surface and a method for forming the heat-resistant and low reflective surface by flocking carbon fibers in the surface of thermoplastic polyimide material on a heated metal plate by an electrostatic flocking method. SOLUTION: The heat-resistant and low reflective surface is formed by flocking the carbon fibers, which have a diameter of 3-15 μm and a length of 20-500 μm and characterized by that the ratio of the length to the diameter is 3-50, in the surface of the thermoplastic polyimide material on the heated metal plate by an electrostatic flocking method.
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