公开(公告)号：SG10201803860QA

公开(公告)日：2018-12-28

申请号：SG10201803860Q

申请日：2018-05-08

Applicant: MITSUI HIGH TEC

Inventor： SHIBATA OSAYA ,  NISHI RYUTARO ,  TAKEDA YUJI

Abstract: At a plating step, position determination for a lead frame is more reliably performed. A lead frame manufacturing method includes a conveyance step, a position determination step, and a plating step. At the conveyance step, a band-shaped lead frame with a predetermined pattern formed thereon is conveyed in a long-side direction at a predetermined pitch. At the position determination step, the position of the lead frame conveyed at the predetermined pitch is determined by a first image sensor. At the plating step, a plating film is formed on each region of the lead frame, the each region corresponding to the predetermined pitch. METHOD AND DEVICE FOR MANUFACTURING LEAD FRAME [FIG. 3]

公开(公告)号：DE102021121034A1

公开(公告)日：2022-02-24

申请号：DE102021121034

申请日：2021-08-12

Applicant: MITSUI HIGH TEC

Inventor： TAKEDA YUJI ,  AMANO KATSUMI ,  FUKUMOTO TAKASHI

IPC: H02K15/12 ,  H02K15/03

Abstract: Es wird eine Kerneinheit-Herstellvorrichtung und ein Kerneinheit-Herstellverfahren vorgesehen, umfassend: eine Formvorrichtung (20), die ein Harz in einen Zwischenraum in einem Kernkörper (11) einfüllt; eine Harzübertragungseinheit (30), die ein Harzmaterial zur Formvorrichtung (20) überträgt, um das Harzmaterial dorthin zuzuführen; und eine Kernübertragungseinheit (40), die den Kernkörper (11) in ein Teil zwischen einem Paar von Formwerkzeugen (21, 22) der Formvorrichtung (20) einführt und aus diesem herausführt. Die Harzübertragungseinheit (30) und die Kernübertragungseinheit (40) sind angeordnet, sodass: die Harzübertragungseinheit (30) das Harz der Formvorrichtung (20) von einer Seitenposition der Seitenflächen der Formvorrichtung (20) zuführt; und die Kernübertragungseinheit (40) den Kernkörper (11) in die Formvorrichtung (20) von der anderen Seitenposition der Seitenflächen der Formvorrichtung (20) einführt und aus dieser herausführt, wobei sich die andere Seitenposition von der einen Seitenposition unterscheidet.

公开(公告)号：JP2003218064A

公开(公告)日：2003-07-31

申请号：JP2002016966

申请日：2002-01-25

Applicant: MITSUI HIGH TEC

Inventor： ISHIDA KEN ,  UEDA KAZUTOSHI ,  AMANO KATSUMI ,  HIGUCHI AKIKAZU ,  TAKEDA YUJI ,  TASHIRO KEI

IPC: H01L23/12 ,  H01L21/301 ,  H01L21/56

Abstract: PROBLEM TO BE SOLVED: To provide a manufacturing apparatus of semiconductor device of high productivity which can accurately cut out the shape of a semiconductor device to a uniform size. SOLUTION: In the manufacturing apparatus 10 of a semiconductor device, a semiconductor device aggregate 1S, where a semiconductor package 4t is formed is cut by a cutting means 10b and then divided among semiconductor devices 1. In the device 10, the cutting means 10b has a pressing means 10o, having a pressing part 10p pressing a non-cut place of the semiconductor device aggregate 1S and load-adjusting parts 11l, 12l which freely adjust the pressing load to the semiconductor aggregate 1S of the pressing part 10p. COPYRIGHT: (C)2003,JPO

公开(公告)号：JP2003273142A

公开(公告)日：2003-09-26

申请号：JP2002068396

申请日：2002-03-13

Applicant: Mitsui High Tec Inc ,  株式会社三井ハイテック

Inventor： UEDA KAZUTOSHI ,  AMANO KATSUMI ,  HIGUCHI AKIKAZU ,  TAKEDA YUJI

IPC: B08B3/02 ,  H01L21/56

Abstract: PROBLEM TO BE SOLVED: To provide a washing method of a semiconductor device and a device therefor wherein the semiconductor device is turned at a high speed to wash the same with the comparatively small amount of washing liquid and, further, to dry the same with the comparatively small amount of gas.
SOLUTION: A conveyance jig 2, by which the semiconductor device 3 is retained, is inserted into a washing tank 5, and a first nozzle 79 is arranged above the semiconductor device 3 to eject washing liquid out of the first nozzle 79 and wash the semiconductor devices 3 while turning the same at a high speed by turning the conveyance jig 2 at a high speed. Further, gas is ejected out of the first nozzle 79 to dry the semiconductor device 3. Subsequently, the semiconductor device 3 mounted on the conveyance jig 2 is adsorbed and retained simultaneously at an upper position in the washing tank 5, and the washing liquid is ejected out of a second nozzle 80 arranged at the lower position of the semiconductor device 3 to wash the rear surface of the semiconductor device 3. Next, air is ejected out of the second nozzle 80 to dry the semiconductor device 3.
COPYRIGHT: (C)2003,JPO

Abstract translation: 要解决的问题：为了提供半导体器件的清洗方法及其装置，其中半导体器件高速转动以用相对少量的洗涤液洗涤半导体器件，并且还将干燥 与较少量的天然气相同。 解决方案：将保持半导体器件3的输送夹具2插入清洗槽5中，并且第一喷嘴79布置在半导体器件3上方以将洗涤液喷射出第一喷嘴79， 通过高速转动输送夹具2来清洗半导体器件3，同时高速转动半导体器件3。 此外，将气体从第一喷嘴79喷出以干燥半导体装置3.随后，安装在输送夹具2上的半导体装置3同时吸附并保持在清洗槽5中的上部位置，并且洗涤液为 从布置在半导体器件3的下部位置的第二喷嘴80喷出以清洗半导体器件3的后表面。接下来，将空气从第二喷嘴80喷出以干燥半导体器件3。 （C）2003，JPO

公开(公告)号：JP2003258006A

公开(公告)日：2003-09-12

申请号：JP2002060202

申请日：2002-03-06

Applicant: MITSUI HIGH TEC

Inventor： UEDA KAZUTOSHI ,  AMANO KATSUMI ,  HIGUCHI AKIKAZU ,  TAKEDA YUJI

IPC: H01L21/50

Abstract: PROBLEM TO BE SOLVED: To provide a conveying jig for semiconductor devices which surely fixes the semiconductor devices for performing operations such as slicing for individuating the semiconductor devices and cleaning, drying and the like of the semiconductor devices thereafter. SOLUTION: The semiconductor device conveying jig is provided with suction and mounting parts 36 on its top which are made of elastic members and to which the bottoms of the semiconductor devices are fixed, suction members 12 provided with grooves in which blades for separating the coupled semiconductor devices and vacuum spaces 32 which are coupled while mounting the suction members 12 and are communicated with corresponding suction and mounting parts 36 are set between adjacent suction and mounting parts 36 and a jig body 11 having at least two coupling joints 19-22 and 27 which are communicated with the vacuum spaces 32 and are provided with shut-off valves detachably mounted on the base joint on the side of the vacuum source. COPYRIGHT: (C)2003,JPO