-
公开(公告)号：DE112017001206T5
公开(公告)日：2018-12-27
申请号：DE112017001206
申请日：2017-03-07
Applicant: MITSUI HIGH TEC , UNIV WASEDA
Inventor： TATSUMI KOHEI , UEDA KAZUTOSHI , SATO NOBUAKI , SHIMIZU KOJI
Abstract: [Problem] Es soll eine Elektrodenverbindungsstruktur und dergleichen geschaffen werden, in denen mehrere langgestreckte Leiter parallel angeordnet sind und eine Längsseitenfläche jedes Leiters durch eine Plattierungsbehandlung mit hoher Qualität mit einer Elektrode verbunden ist.[Lösung] Eine Elektrodenverbindungsstruktur, in der eine Elektrode eines Halbleiterchips 12 und/oder eine Substratelektrode durch Plattieren mit mehreren langgestreckten Leitern 11 eines Leiterrahmens 10 verbunden sind. Die mehreren langgestreckten Leiter 11 des Leiterrahmens 10 sind parallel angeordnet und eine Längsseitenfläche jedes Leiters 11 ist durch Plattieren mit der Elektrode des Halbleiterchips 12 und/oder mit der Substratelektrode verbunden. In einem Verbindungsabschnitt einer ersten Verbindungsfläche 13 der Elektrode des Halbleiterchips 12 und/oder der Substratelektrode, wobei die erste Verbindungsfläche 13 mit den Leitern 11 verbunden ist, und einer zweiten Verbindungsfläche 14 in der Längsseitenfläche jedes Leiters 11, wobei die zweite Verbindungsfläche 14 mit der ersten Verbindungsfläche 13 verbunden ist, nimmt ein Abstand zwischen der ersten Verbindungsfläche 13 und der zweiten Verbindungsfläche 14 von einem Kantenabschnitt 15 der zweiten Verbindungsfläche 14, wobei der Kantenabschnitt 15 mit der ersten Verbindungsfläche 13 in Kontakt steht, in Richtung eines Außenabschnitts 16 der zweiten Verbindungsfläche 14 kontinuierlich zu.
-
公开(公告)号：EP1921734A4
公开(公告)日：2010-04-07
申请号：EP06797325
申请日：2006-08-28
Applicant: TOYOTA MOTOR CO LTD , MITSUI HIGH TEC
Inventor： WATANABE ATSUSHI , AMANO KATSUMI , UEDA KAZUTOSHI , FUKUMOTO TAKASHI , TAKEUCHI TAKETO , FUKUMARU KENICHIRO , HARUNO KENTARO
IPC: H02K15/03
CPC classification number: H02K15/03 , H02K1/276 , Y10T29/49009 , Y10T29/49012 , Y10T29/53143
-
公开(公告)号：EP1972049A4
公开(公告)日：2012-10-17
申请号：EP06747142
申请日：2006-05-29
Applicant: MITSUI HIGH TEC
Inventor： AMANO KATSUMI , UEDA KAZUTOSHI
CPC classification number: H02K1/276 , B29C45/02 , B29C45/14778 , B29K2995/0008 , H01F41/0233 , H02K15/12 , Y10T29/49009 , Y10T29/49012 , Y10T29/49075 , Y10T29/49078
-
公开(公告)号：EP1983636A4
公开(公告)日：2010-04-07
申请号：EP07708332
申请日：2007-02-05
Applicant: TOYOTA MOTOR CO LTD , MITSUI HIGH TEC
Inventor： FUKUMARU KENICHIRO , AMANO KATSUMI , FUKUMOTO TAKASHI , UEDA KAZUTOSHI , HARUNO KENTARO , TAKEUCHI TAKETO , WATANABE ATSUSHI
CPC classification number: H02K15/03 , H02K1/2766 , H02K15/12 , H02K15/165 , Y10T29/49009 , Y10T29/49012 , Y10T29/53143
-
公开(公告)号：JP2007336718A
公开(公告)日：2007-12-27
申请号：JP2006166400
申请日：2006-06-15
Applicant: Mitsui High Tec Inc , 株式会社三井ハイテック
Inventor： AMANO KATSUMI , UEDA KAZUTOSHI
Abstract: PROBLEM TO BE SOLVED: To provide a rotor laminated core and a resin sealing method of the core by which an arrangement position of a resin accumulator installed in a mold and a degree of freedom on a shape of a resin passage can be secured, a resin member is efficiently charged into a magnet inserter, and a device structure of a manufacturing device of the rotator laminated core can easily be simplified.
SOLUTION: In the rotor laminated core 10, a plurality of core pieces 11 and 12 are laminated, a plurality of magnet inserters 14 formed around a center axial hole 13 are formed, permanent magnets 15 are inserted into the magnet inserters 14 and sandwiched by an upper mold 16 and a lower mold 17, and the magnet inserter 14 is charged with the resin member 19 from the resin accumulator 18 so as to be fixed. In the iron piece 11 abutted on the mold, a resin accumulator region 25 is secured with which the resin member 19 in the resin accumulator 18 is brought into contact; and resin charging openings 21 are formed for charging the magnet inserters 14 with the resin member 19 smaller than the magnet inserters 14 in a region overlapped with the magnet inserters 14 formed in the other laminated iron piece 12 in terms of a plane view.
COPYRIGHT: (C)2008,JPO&INPITAbstract translation: 要解决的问题：提供一种转子层叠铁心和芯的树脂密封方法，其中可以确保安装在模具中的树脂蓄电池的布置位置和树脂通道的形状的自由度 树脂构件被有效地充电到磁体插入器中，并且可以容易地简化转子叠片芯的制造装置的装置结构。 解决方案：在转子层叠铁芯10中，层叠多个芯片11和12，形成围绕中心轴孔13形成的多个磁体插入器14，永磁体15插入磁体插入器14和 被上模16和下模具17夹持，并且从树脂蓄能器18向树脂构件19填充磁体插入器14以被固定。 在与模具抵接的铁片11中，固定树脂蓄积器18中的树脂构件19与树脂蓄积区25接触的树脂蓄积区25。 并且形成树脂充电开口21，用于在与平面视图中形成在另一个层压铁件12中的磁体插入器14重叠的区域中使树脂构件19小于磁体插入器14的磁体插入器14充电。 版权所有（C）2008，JPO＆INPIT
-
Patent Agency Ranking
公开(公告)号：JP2007282358A
公开(公告)日：2007-10-25
申请号：JP2006104386
申请日：2006-04-05
Applicant: Mitsui High Tec Inc , 株式会社三井ハイテック
Inventor： UEDA KAZUTOSHI , AMANO KATSUMI
Abstract: PROBLEM TO BE SOLVED: To provide a rotor laminated core excellent in productivity, shape accuracy, and rotation efficiency; and to provide its manufacturing method.
SOLUTION: The rotor laminated core has a basic block core 17 which has a basic laminate 14 which is made by the lamination of core pieces 11 and is equipped with a shaft hole 12 at the center and a plurality of magnet insertion holes 13 around the shaft hole 12, permanent magnets 15 which are inserted into each of the magnet insertion holes 13 of the basic laminate 14 and are shorter than the depth of the magnet insertion holes 13, and resin members 16 which are filled on and around the permanent magnets 15 inserted into the magnet insertion holes 13 so as to integrate the basic laminates 14 and the permanent magnets 15. A plurality of basic blocks 17 are stacked, while substantially according the axes of the shaft holes 12 with one another, and the fellow basic block cores 17 are integrated with one another by coupling 27.
COPYRIGHT: (C)2008,JPO&INPITAbstract translation: 要解决的问题：提供生产率，形状精度和旋转效率优异的转子叠层铁芯; 并提供其制造方法。 解决方案：转子层叠铁芯具有基本块状芯17，其具有通过层叠芯片11制成的基本层压体14，并且在中心配备有轴孔12，并且具有多个磁体插入孔13 在轴孔12周围，插入到基本层叠体14的每个磁体插入孔13中并且比磁体插入孔13的深度短的永久磁铁15和填充在永久物上和周围的树脂构件16 磁体15插入到磁体插入孔13中，以便将基本层压体14和永磁体15整合。多个基本块17被堆叠，而基本上是根据轴孔12的轴线彼此相对的， 块芯17通过耦合27彼此集成。版权所有（C）2008，JPO＆INPIT
-
公开(公告)号：JP2006026735A
公开(公告)日：2006-02-02
申请号：JP2005051017
申请日：2005-02-25
Applicant: Mitsui High Tec Inc , 株式会社三井ハイテック
Inventor： NAKAMURA IZUMI , UEDA KAZUTOSHI , NAGATOSHI TSUTOMU , KOZONO TAKEAKI
Abstract: PROBLEM TO BE SOLVED: To provide a method and a device for manufacturing a laminated iron core obtaining sufficient caulking strength and preventing generation of defective parallelism and interlayer spaces of the laminated iron core even with a large iron core constituted of thin sheet iron core pieces.
SOLUTION: In the manufacturing method in which iron core pieces 14 punched by a punch 13 are successively caulked and laminated by using a press-retaining ring 15 to support the iron core pieces by pressing them from the periphery and a receiving block 16, when the iron core piece 14 is caulked and laminated on the preliminarily punched iron core piece 14, the caulking-lamination is performed by providing the force in the direction opposite to the pressing direction of the punch 13 to the iron core pieces 14 by an elastic member 23 arranged on a loading block 22 below a supporting plate 24 with the iron core pieces 14 stacked thereon, and the loading block 22 is lowered by the lowering amount of the supporting plate 24 before the punch 13 is elevated. The manufacturing device 10 has a control means to lower the loading block 22 according to the movement of the supporting plate 24 detected by a distance sensor 26.
COPYRIGHT: (C)2006,JPO&NCIPIAbstract translation: 要解决的问题：提供一种制造叠层铁芯的方法和装置，即使用由薄片铁构成的大铁芯也能获得足够的铆接强度并且防止层压铁芯的缺陷平行度和层间空间的产生 核心件。 解决方案：在由冲头13冲压的铁芯片14通过使用压紧环15相继地铆接并层压的方法中，以通过从周边压入铁芯片来支撑铁芯片和接收块16 当将铁芯片14铆接并层叠在预先冲压的铁芯片14上时，通过将与冲压件13的按压方向相反的方向的力向铁芯片14提供力，从而进行铆接层压 弹性构件23布置在其上堆叠有铁芯片14的支撑板24下方的装载块22上，并且在冲头13升高之前装载块22降低支撑板24的下降量。 制造装置10具有根据由距离传感器26检测到的支撑板24的移动来降低装载块22的控制装置。（C）2006年，JPO＆NCIPI
-
公开(公告)号：JP2003258006A
公开(公告)日：2003-09-12
申请号：JP2002060202
申请日：2002-03-06
Applicant: MITSUI HIGH TEC
Inventor： UEDA KAZUTOSHI , AMANO KATSUMI , HIGUCHI AKIKAZU , TAKEDA YUJI
IPC: H01L21/50
Abstract: PROBLEM TO BE SOLVED: To provide a conveying jig for semiconductor devices which surely fixes the semiconductor devices for performing operations such as slicing for individuating the semiconductor devices and cleaning, drying and the like of the semiconductor devices thereafter. SOLUTION: The semiconductor device conveying jig is provided with suction and mounting parts 36 on its top which are made of elastic members and to which the bottoms of the semiconductor devices are fixed, suction members 12 provided with grooves in which blades for separating the coupled semiconductor devices and vacuum spaces 32 which are coupled while mounting the suction members 12 and are communicated with corresponding suction and mounting parts 36 are set between adjacent suction and mounting parts 36 and a jig body 11 having at least two coupling joints 19-22 and 27 which are communicated with the vacuum spaces 32 and are provided with shut-off valves detachably mounted on the base joint on the side of the vacuum source. COPYRIGHT: (C)2003,JPO
-
公开(公告)号：JP2008042967A
公开(公告)日：2008-02-21
申请号：JP2006210110
申请日：2006-08-01
Applicant: Mitsui High Tec Inc , 株式会社三井ハイテック
Inventor： AMANO KATSUMI , UEDA KAZUTOSHI
Abstract: PROBLEM TO BE SOLVED: To provide a resin sealing method of a permanent magnet to the laminated core of a rotor in which the filling work of resin material can be done immediately without being influenced by preheating work of the laminated core of a rotor, and its work efficiency can be enhanced as compared with prior art by preventing the resin material from being left in the die.
SOLUTION: The resin sealing method of a permanent magnet to the laminated core of a rotor comprises a first step for placing the laminated core 13 of a rotor in a preheater 18 and preheating the laminated core 13 of a rotor, a second step for taking out the preheated laminated core 13 of a rotor from the preheater 18 and arranging it in a resin sealing device 29, a third step for pressing the laminated core 13 of a rotor by means of an upper die 14 and a lower die 15 and liquefying a resin material 17 in a resin sump pot 16 by heating, and a fourth step for pushing out the liquefied resin material 17 from the resin sump pot 16 by means of a plunger 32 inserted into the resin sump pot 16 to move up and down and filling a magnet insertion hole 12 with the resin material 17 and then thermosetting the resin material 17. With such an arrangement, resin sealing efficiency of the permanent 11 to the laminated core 13 of a rotor is enhanced.
COPYRIGHT: (C)2008,JPO&INPITAbstract translation: 要解决的问题：为了提供永久磁铁的树脂密封方法到转子的层叠铁芯，其中可以立即进行树脂材料的填充作业，而不受转子的层叠铁芯的预热作用的影响 ，与现有技术相比，通过防止树脂材料留在模具中，可以提高其工作效率。 解决方案：永磁体对转子的层叠铁心的树脂密封方法包括：第一步骤，将转子的层叠铁芯13放置在预热器18中，并预热转子的层叠铁心13;第二步骤 用于从预热器18取出转子的预热层叠铁芯13并将其布置在树脂密封装置29中，第三步骤，通过上模14和下模15压紧转子的层叠芯13， 通过加热液化树脂贮槽16中的树脂材料17，以及通过插入树脂贮槽16中的柱塞32将液化树脂材料17从树脂贮槽罐16推出的第四步骤，上下移动 并且用树脂材料17填充磁体插入孔12，然后使树脂材料17热固化。通过这样的布置，永磁体11与转子的叠层铁心13的树脂密封效率提高。 版权所有（C）2008，JPO＆INPIT
-
公开(公告)号：JP2003218141A
公开(公告)日：2003-07-31
申请号：JP2002010118
申请日：2002-01-18
Applicant: MITSUI HIGH TEC
Inventor： OBUCHI HIDEJI , UEDA KAZUTOSHI , AMANO KATSUMI , HIROSE TADAO
IPC: H01L21/56
Abstract: PROBLEM TO BE SOLVED: To provide a method and an apparatus for manufacturing semiconductor devices with high productivity, which are capable of cutting a semiconductor device aggregate where semiconductor packages are formed into the separate semiconductor devices with high accuracy in size and shape even if the semiconductor devices are reduced in size. SOLUTION: An apparatus 10 for manufacturing semiconductor devices 1 is equipped with a support means 10t where suction holes 10t2 communicating with a vacuuming pump are provided to suck up a semiconductor device aggregate 1St placed on it, a cutting means 10b which cuts the semiconductor device aggregate 1St along boundary lines s1 and s2 between regions corresponding to the semiconductor devices, a plurality of through-holes 10p1 which are provided as they are corresponding to the cutting lines (boundary lines) s1 and s2 of the semiconductor device aggregate 1St and where the cutting edges of the cutting means 10b are inserted, and a pressing means 10p which presses down the non-cutting part of the semiconductor device aggregate 1St. COPYRIGHT: (C)2003,JPO
-
-
-
-
-
-
-
-
-
Search Results
16
records
(took 0.063 seconds)
