公开(公告)号：DE69106615T2

公开(公告)日：1995-08-31

申请号：DE69106615

申请日：1991-07-05

Applicant: MOLEX INC

Inventor： REGNIER KENT ,  CALDWELL STACEY E

IPC: H01R13/648 ,  H01R12/50 ,  H01R12/70 ,  H01R12/82 ,  H01R13/514 ,  H01R13/6585 ,  H01R13/6594 ,  H01R24/00 ,  H01R23/68

Abstract: A socket assembly (94) is provided for receiving memory modules (10) such as single in-line memory modules (SIMMs). The socket assembly includes at least one lower tier SIMM socket (24a) that is mountable to a board (96). A carrier (62) is mounted to the board (96) in generally parallel spaced relationship to the lower tier SIMM socket (24a). At least one upper tier SIMM socket (24b) is mounted to the carrier (62) and may be supported in part by a lower tier SIMM socket (24a). The carrier (62) includes a ground shield (84) for preventing interference.

公开(公告)号：IE66396B1

公开(公告)日：1995-12-27

申请号：IE256591

申请日：1991-07-22

Applicant: MOLEX INC

Inventor： REGNIER KENT E ,  CALDWELL STACEY E

IPC: H01R13/648 ,  H01R12/50 ,  H01R12/70 ,  H01R12/82 ,  H01R13/514 ,  H01R13/6585 ,  H01R13/6594 ,  H01R24/00 ,  H01R23/68

Abstract: A socket assembly (94) is provided for receiving memory modules (10) such as single in-line memory modules (SIMMs). The socket assembly includes at least one lower tier SIMM socket (24a) that is mountable to a board (96). A carrier (62) is mounted to the board (96) in generally parallel spaced relationship to the lower tier SIMM socket (24a). At least one upper tier SIMM socket (24b) is mounted to the carrier (62) and may be supported in part by a lower tier SIMM socket (24a). The carrier (62) includes a ground shield (84) for preventing interference.

公开(公告)号：DE69106615D1

公开(公告)日：1995-02-23

申请号：DE69106615

申请日：1991-07-05

Applicant: MOLEX INC

Inventor： REGNIER KENT ,  CALDWELL STACEY E

IPC: H01R13/648 ,  H01R12/50 ,  H01R12/70 ,  H01R12/82 ,  H01R13/514 ,  H01R13/6585 ,  H01R13/6594 ,  H01R24/00 ,  H01R23/68

Abstract: A socket assembly (94) is provided for receiving memory modules (10) such as single in-line memory modules (SIMMs). The socket assembly includes at least one lower tier SIMM socket (24a) that is mountable to a board (96). A carrier (62) is mounted to the board (96) in generally parallel spaced relationship to the lower tier SIMM socket (24a). At least one upper tier SIMM socket (24b) is mounted to the carrier (62) and may be supported in part by a lower tier SIMM socket (24a). The carrier (62) includes a ground shield (84) for preventing interference.

公开(公告)号：IE912565A1

公开(公告)日：1992-01-29

申请号：IE256591

申请日：1991-07-22

Applicant: MOLEX INC

Inventor： REGNIER KENT E ,  CALDWELL STACEY E

IPC: H01R13/648 ,  H01R12/50 ,  H01R12/70 ,  H01R12/82 ,  H01R13/514 ,  H01R13/6585 ,  H01R13/6594 ,  H01R24/00 ,  H01R23/68

Abstract: A socket assembly (94) is provided for receiving memory modules (10) such as single in-line memory modules (SIMMs). The socket assembly includes at least one lower tier SIMM socket (24a) that is mountable to a board (96). A carrier (62) is mounted to the board (96) in generally parallel spaced relationship to the lower tier SIMM socket (24a). At least one upper tier SIMM socket (24b) is mounted to the carrier (62) and may be supported in part by a lower tier SIMM socket (24a). The carrier (62) includes a ground shield (84) for preventing interference.