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公开(公告)号：JP2008251538A
公开(公告)日：2008-10-16
申请号：JP2008115679
申请日：2008-04-25
Applicant: Molex Inc , モレックス インコーポレーテッドMolex Incorporated
Inventor： BRUNKER DAVID L , DAWIEDCZYK DANIEL L , LOPATA JOHN E , DUTTA ARINDUM
IPC: H01B11/00 , H01P1/02 , H01P3/02 , H01R9/03 , H01R12/50 , H01R12/71 , H01R12/79 , H01R13/648 , H05K1/00 , H05K1/02 , H05K1/14 , H05K3/10 , H05K3/40
CPC classification number: H05K1/024 , H01P3/02 , H01R12/716 , H01R12/79 , H01R13/658 , H05K1/0284 , H05K1/145 , H05K3/107 , H05K3/403 , H05K2201/09036 , H05K2201/09118 , H05K2201/09236 , H05K2201/09645 , H05K2201/09981 , H05K2201/10189 , H05K2201/10893
Abstract: PROBLEM TO BE SOLVED: To construct a termination assembly used for terminating high-frequency data signal transmission lines. SOLUTION: This termination assembly includes a dielectric body, and a plurality of conductive elements disposed on a transmission line, and the plurality of conductive elements are arranged in pairs for differential signal transmission. The termination assembly, in one embodiment, includes a hollow end cap that is formed of a dielectric material and has one or more conductive contacts or plated surfaces disposed on or in the cavity so that they may frictionally mate with the conductive traces on the transmission line. In another embodiment, a connector housing 602 has a center slot 603 and a plurality of dual loop contacts 607 to provide redundant circuit paths and low inductance to the termination assembly. A coupling element may be utilized in the slot 606 to achieve a desired level of coupling between the terminal contacts 607. COPYRIGHT: (C)2009,JPO&INPIT
Abstract translation: 要解决的问题：构建用于终止高频数据信号传输线的终端组件。 解决方案：该终端组件包括介电体和布置在传输线上的多个导电元件，并且多个导电元件成对配置用于差分信号传输。 在一个实施例中，端接组件包括由电介质材料形成并具有一个或多个导电触点或设置在空腔中或导体中的电镀表面的中空端盖，使得它们可以与传输线上的导电迹线摩擦地配合 。 在另一个实施例中，连接器壳体602具有中心槽603和多个双环接触件607，以向终端组件提供冗余电路路径和低电感。 可以在槽606中使用耦合元件以实现端子触点607之间期望的耦合水平。版权所有：（C）2009，JPO和INPIT
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公开(公告)号：DE60204032T2
公开(公告)日：2006-01-26
申请号：DE60204032
申请日：2002-09-26
Applicant: MOLEX INC
Inventor： LOPATA D , PANELLA P , DUTTA ARINDUM , MCGRATH L
IPC: H01L23/12 , H01L23/32 , H01L23/36 , H01L23/498 , H01L23/50 , H01L23/52 , H01R13/66 , H01R33/76 , H01R33/945 , H05K7/10
Abstract: A system for delivering power to an integrated circuit includes a decoupling capacitance located in a connector that is formed as a socket, or frame for the IC. The power delivery system takes the form of a power reservoir that is integrated into a connector, thereby eliminating the need for complex and expensive power traces to be formed in or discrete capacitors mounted on a circuit board to which the IC is connected. The system includes a connector that takes the form of a cover member that fits over the IC and which contains a recess that accommodates a portion of the IC therein. The cover member includes at least a pair of spaced-apart capacitor plates that are disposed therewithin. Electricity is supplied to the plates so that they will become charged as a capacitor and the plates are formed with a plurality of terminals that extend into contact with the IC so that the plates may selectively discharge to the IC and thereby provide it with operating and surge currents.
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公开(公告)号：DE60201520D1
公开(公告)日：2004-11-11
申请号：DE60201520
申请日：2002-03-20
Applicant: MOLEX INC
Inventor： LOPATA E , MCGRATH L , DUTTA ARINDUM , MENZIN MARVIN , FISHER JR
Abstract: A land grid array connector is formed by attaching a reinforcing member to a frame and coating the reinforcing member with an elastomeric compound to form a reinforced, flexible body portion of the connector. Conductive wires are inserted in pairs in an array in the fabric extent. Free ends of the wires extend past the elastomeric compound to provide contacts of the connector. The pairs of wires provide redundancy for the contacts to ensure a reliable connection.
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公开(公告)号：AU2002367407A1
公开(公告)日：2003-07-24
申请号：AU2002367407
申请日：2002-12-30
Applicant: MOLEX INC
Inventor： BRUNKER DAVID , DAWIEDCZYK DANIEL L , LOPATA JOHN E , DUTTA ARINDUM
IPC: H01B11/00 , H01P1/02 , H01P3/02 , H01R9/03 , H01R12/50 , H01R12/71 , H01R12/79 , H01R13/648 , H05K1/00 , H05K1/02 , H05K1/14 , H05K3/10 , H05K3/40
Abstract: Termination assemblies for terminating high-frequency data signal transmission lines include housings with one or more cavities that receive ends of the transmission line therein. The transmission line typically includes a dielectric body and a plurality of conductive elements disposed thereon, with the plurality of conductive elements being arranged in pairs for differential signal transmission. The termination assemblies, in one embodiment include hollow end caps that are formed from a dielectric and which have one or more conductive contacts or plated surfaces disposed on or within the cavity so that they will frictionally mate with the conductive traces on the transmission line. In another embodiment, a connector housing is provided with a center slot and a plurality of dual loop contacts to provide redundant circuit paths and low inductance to the termination assembly. A coupling element may be utilized in the slot to achieve a desired level of coupling between the termination contacts.
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公开(公告)号：WO03058750B1
公开(公告)日：2004-05-21
申请号：PCT/US0241792
申请日：2002-12-30
Applicant: MOLEX INC
Inventor： BRUNKER DAVID , DAWIEDCZYK DANIEL L , LOPATA JOHN E , DUTTA ARINDUM
IPC: H01B11/00 , H01P1/02 , H01P3/02 , H01R9/03 , H01R12/50 , H01R12/71 , H01R12/79 , H01R13/648 , H05K1/00 , H05K1/02 , H05K1/14 , H05K3/10 , H05K3/40 , H01P3/00
CPC classification number: H05K1/024 , H01P3/02 , H01R12/716 , H01R12/79 , H01R13/658 , H05K1/0284 , H05K1/145 , H05K3/107 , H05K3/403 , H05K2201/09036 , H05K2201/09118 , H05K2201/09236 , H05K2201/09645 , H05K2201/09981 , H05K2201/10189 , H05K2201/10893
Abstract: An engineered transmission line for transmitting high-frequency data signals between two points of connection includes a dielectric body and a plurality of conductive elements disposed thereon, with the plurality of conductive elements being arranged in pairs for differential signal transmission. In one embodiment, the dielectric body is solid and has its conductive elements supported on its exterior surface. In another embodiment, the dielectric body is extruded and has grooves or raised lands formed therein. The grooves or lands support conductive elements formed thereon by a suitable plating process. A ground plane may be provided as a base layer of the dielectric body.
Abstract translation: 用于在两个连接点之间传输高频数据信号的工程传输线包括绝缘体和设置在其上的多个导电元件，其中多个导电元件成对配置用于差分信号传输。 在一个实施例中，电介质体是固体并且其导电元件被支撑在其外表面上。 在另一个实施例中，电介质体被挤出并且在其中形成有凹槽或凸起的焊盘。 凹槽或平台通过合适的电镀工艺支撑在其上形成的导电元件。 可以提供接地平面作为电介质体的基层。
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Patent Agency Ranking
公开(公告)号：WO03034799B1
公开(公告)日：2003-10-16
申请号：PCT/US0230589
申请日：2002-09-26
Applicant: MOLEX INC
Inventor： LOPATA JOHN D , PANELLA AGUSTO P , DUTTA ARINDUM , MCGRATH JAMES L
IPC: H01L23/12 , H01L23/32 , H01L23/36 , H01L23/498 , H01L23/50 , H01L23/52 , H01R13/66 , H01R33/76 , H01R33/945 , H05K7/10
CPC classification number: H01L23/49805 , H01L23/50 , H01L24/48 , H01L2224/05599 , H01L2224/16 , H01L2224/45099 , H01L2224/48091 , H01L2224/48227 , H01L2224/85399 , H01L2924/00014 , H01L2924/01004 , H01L2924/01019 , H01L2924/01021 , H01L2924/01077 , H01L2924/01078 , H01L2924/09701 , H01L2924/12041 , H01L2924/14 , H01L2924/15174 , H01L2924/15192 , H01L2924/15331 , H01L2924/16152 , H01L2924/16195 , H01L2924/181 , H01L2924/19041 , H01L2924/30107 , H01L2924/3011 , H01L2924/3025 , H01R13/6625 , H05K7/1092 , H01L2924/00 , H01L2224/45015 , H01L2924/207
Abstract: A system for delivering power to an integrated circuit includes a decoupling capacitance located in a connector that is formed as a socket, or frame for the IC. The power delivery system takes the form of a power reservoir that is integrated into a connector, thereby eliminating the need for complex and expensive power traces to be formed in or discrete capacitors mounted on a circuit board to which the IC is connected. The system includes a connector that takes the form of a cover member that fits over the IC and which contains a recess that accommodates a portion of the IC therein. The cover member includes at least a pair of spaced-apart capacitor plates that are disposed therewithin. Electricity is supplied to the plates so that they will become charged as a capacitor and the plates are formed with a plurality of terminals that extend into contact with the IC so that the plates may selectively discharge to the IC and thereby provide it with operating and surge currents.
Abstract translation: 用于向集成电路递送电力的系统包括位于形成为IC的插座或框架的连接器中的去耦电容。 电力输送系统采用集成到连接器中的电力储存器的形式，从而不需要在安装在IC连接到的电路板上的分立电容器中形成复杂且昂贵的电力迹线。 该系统包括连接器，该连接器采用装配在IC上的盖构件的形式，并且其包含容纳IC的一部分的凹部。 盖构件包括设置在其中的至少一对间隔开的电容器板。 向板提供电，使其成为电容器，并且板形成有与IC接触的多个端子，使得板可以选择性地放电到IC，从而为其提供操作和浪涌 电流。
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公开(公告)号：AU2003217883A1
公开(公告)日：2003-09-09
申请号：AU2003217883
申请日：2003-02-25
Applicant: MOLEX INC
Inventor： LOPATA JOHN E , MCGRATH JAMES L , DUTTA ARINDUM , PANELLA AUGUSTO P
Abstract: A processor mounted to a circuit board is provided with regulated voltage through lower-inductance circuit board traces by mounting a voltage regulator module for the processor, on the side of the circuit opposite to the processor. Current from the voltage regulator is provided to the processor by way of one or more conductors between the regulator and processor that extend through the circuit board from one side to the other. Inductance attributable to lead length is reduced by locating the voltage regulator close to its load. Circuit board space on the processor side of the circuit board is increased by moving the voltage regulator to the opposite side.
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公开(公告)号：DE60219071T2
公开(公告)日：2007-12-06
申请号：DE60219071
申请日：2002-12-30
Applicant: MOLEX INC
Inventor： BRUNKER DAVID L , DAWIEDCZYK DANIEL L , LOPATA JOHN E , DUTTA ARINDUM
IPC: H01B11/00 , H01P3/02 , H01P1/02 , H01R9/03 , H01R12/50 , H01R12/71 , H01R12/79 , H01R13/648 , H05K1/00 , H05K1/02 , H05K1/14 , H05K3/10 , H05K3/40
Abstract: Termination assemblies for terminating high-frequency data signal transmission lines include housings with one or more cavities that receive ends of the transmission line therein. The transmission line typically includes a dielectric body and a plurality of conductive elements disposed thereon, with the plurality of conductive elements being arranged in pairs for differential signal transmission. The termination assemblies, in one embodiment include hollow end caps that are formed from a dielectric and which have one or more conductive contacts or plated surfaces disposed on or within the cavity so that they will frictionally mate with the conductive traces on the transmission line. In another embodiment, a connector housing is provided with a center slot and a plurality of dual loop contacts to provide redundant circuit paths and low inductance to the termination assembly. A coupling element may be utilized in the slot to achieve a desired level of coupling between the termination contacts.
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公开(公告)号：CZ20032879A3
公开(公告)日：2004-12-15
申请号：CZ20032879
申请日：2002-03-20
Applicant: MOLEX INC
Inventor： LOPATA JOHN E , MCGRATH JAMES L , DUTTA ARINDUM , MENZIN MARVIN , FISHER DANIEL JR
Abstract: A land grid array connector is formed by attaching a reinforcing member to a frame and coating the reinforcing member with an elastomeric compound to form a reinforced, flexible body portion of the connector. Conductive wires are inserted in pairs in an array in the fabric extent. Free ends of the wires extend past the elastomeric compound to provide contacts of the connector. The pairs of wires provide redundancy for the contacts to ensure a reliable connection.
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公开(公告)号：SK13112003A3
公开(公告)日：2004-10-05
申请号：SK13112003
申请日：2002-03-20
Applicant: MOLEX INC
Inventor： LOPATA JOHN E , MCGRATH JAMES L , DUTTA ARINDUM , MENZIN MARVIN , FISHER DANIEL JR
Abstract: A land grid array connector is formed by attaching a reinforcing member to a frame and coating the reinforcing member with an elastomeric compound to form a reinforced, flexible body portion of the connector. Conductive wires are inserted in pairs in an array in the fabric extent. Free ends of the wires extend past the elastomeric compound to provide contacts of the connector. The pairs of wires provide redundancy for the contacts to ensure a reliable connection.
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