公开(公告)号：DE69222864T2

公开(公告)日：1998-03-26

申请号：DE69222864

申请日：1992-03-24

Applicant: MOTOROLA INC

Inventor： MENY KEITH ,  MCGOVERN PATRICK ,  COTTINGHAM DAVID ,  KAZAK FRANK

IPC: H01R13/46 ,  B60R16/02 ,  B60R16/023 ,  H05K1/00 ,  H05K1/02 ,  H05K1/05 ,  H05K1/18 ,  H05K3/00 ,  H05K5/00 ,  H05K7/14 ,  H05K7/20

公开(公告)号：DE69222864D1

公开(公告)日：1997-11-27

申请号：DE69222864

申请日：1992-03-24

Applicant: MOTOROLA INC

Inventor： MENY KEITH ,  MCGOVERN PATRICK ,  COTTINGHAM DAVID ,  KAZAK FRANK

IPC: H01R13/46 ,  B60R16/02 ,  B60R16/023 ,  H05K1/00 ,  H05K1/02 ,  H05K1/05 ,  H05K1/18 ,  H05K3/00 ,  H05K5/00 ,  H05K7/14 ,  H05K7/20

公开(公告)号：EP0615679A4

公开(公告)日：1995-01-04

申请号：EP92915709

申请日：1992-03-24

Applicant: MOTOROLA INC

Inventor： MENY KEITH A ,  MCGOVERN PATRICK A ,  COTTINGHAM DAVID ,  KAZAK FRANK E

IPC: H01R13/46 ,  B60R16/02 ,  B60R16/023 ,  H05K1/00 ,  H05K1/02 ,  H05K1/05 ,  H05K1/18 ,  H05K3/00 ,  H05K5/00 ,  H05K7/14 ,  H05K7/20

CPC classification number: B60R16/0239 ,  H05K1/028 ,  H05K1/05 ,  H05K1/189 ,  H05K3/0061 ,  H05K5/0043 ,  H05K2201/09063 ,  H05K2201/09109 ,  H05K2201/10189 ,  H05K2201/2009

Abstract: A method of forming an electronic module assembly is disclosed, plus two such assemblies formed thereby. One module assembly (50) has a bendable base plate (52) upon which circuit components (76) are mounted. A module enclosure device (56) mates with the base plate and has an integrally formed, non-removable support arm (96). During assembly, the base plate (52) is bent around the support arm (96) in a 'C' shape. Thus formed, the base plate (52) and the module enclosure device (56) form an internal cavity that holds the circuit components (76).