公开(公告)号：ES2212278T3

公开(公告)日：2004-07-16

申请号：ES98911994

申请日：1998-03-25

Applicant: MOTOROLA INC

Inventor： CHEN CHIU CHIK ,  HOYLE CHRISTOPHER J ,  KOSBERG ROBERT C ,  MENY KEITH A ,  POGLITSCH LAWRENCE R ,  NOWICKI JAMES JR

IPC: B60R16/02 ,  B60R16/023 ,  G01L9/00 ,  H05K5/00 ,  B60R16/00 ,  G01D11/24

Abstract: An electrical device (10) includes a package body (12) having a device mounting region (14) and an electrical connection region (16). A cavity (18) resides in the package body (12) intermediate to the device mounting region (14) and to the electrical connection region (16). A leadframe (20) is positioned within the package body (12) and includes a plurality of individual leads (34) traversing the cavity (18). An electronic component (24) is electrically attached to the individual leads (34) within the cavity (18). In addition to accommodating the attachment of the electronic component (24), the cavity (18) is configured to permit access to the individual leads (34) by a bonding tool (40).

公开(公告)号：WO9853657A3

公开(公告)日：1999-03-04

申请号：PCT/US9805751

申请日：1998-03-25

Applicant: MOTOROLA INC

Inventor： CHEN CHIU CHIK ,  HOYLE CHRISTOPHER J ,  KOSBERG ROBERT C ,  MENY KEITH A ,  POGLITSCH LAWRENCE R ,  NOWICKI JAMES JR

IPC: B60R16/02 ,  B60R16/023 ,  G01L9/00 ,  H05K5/00

CPC classification number: B60R16/0239 ,  G01L19/003 ,  G01L19/0084 ,  G01L19/143 ,  G01L19/147 ,  G01L19/148 ,  H05K5/0078

Abstract: An electrical device (10) includes a package body (12) having a device mounting region (14) and an electrical connection region (16). A cavity (18) resides in the package body (12) intermediate to the device mounting region (14) and to the electrical connection region (16). A leadframe (20) is positioned within the package body (12) and includes a plurality of individual leads (34) traversing the cavity (18). An electronic component (24) is electrically attached to the individual leads (34) within the cavity (18). In addition to accommodating the attachment of the electronic component (24), the cavity (18) is configured to permit access to the individual leads (34) by a bonding tool (40).

公开(公告)号：EP0615679A4

公开(公告)日：1995-01-04

申请号：EP92915709

申请日：1992-03-24

Applicant: MOTOROLA INC

Inventor： MENY KEITH A ,  MCGOVERN PATRICK A ,  COTTINGHAM DAVID ,  KAZAK FRANK E

IPC: H01R13/46 ,  B60R16/02 ,  B60R16/023 ,  H05K1/00 ,  H05K1/02 ,  H05K1/05 ,  H05K1/18 ,  H05K3/00 ,  H05K5/00 ,  H05K7/14 ,  H05K7/20

CPC classification number: B60R16/0239 ,  H05K1/028 ,  H05K1/05 ,  H05K1/189 ,  H05K3/0061 ,  H05K5/0043 ,  H05K2201/09063 ,  H05K2201/09109 ,  H05K2201/10189 ,  H05K2201/2009

Abstract: A method of forming an electronic module assembly is disclosed, plus two such assemblies formed thereby. One module assembly (50) has a bendable base plate (52) upon which circuit components (76) are mounted. A module enclosure device (56) mates with the base plate and has an integrally formed, non-removable support arm (96). During assembly, the base plate (52) is bent around the support arm (96) in a 'C' shape. Thus formed, the base plate (52) and the module enclosure device (56) form an internal cavity that holds the circuit components (76).

公开(公告)号：EP0920388A4

公开(公告)日：2000-08-09

申请号：EP98911994

申请日：1998-03-25

Applicant: MOTOROLA INC

Inventor： CHEN CHIU CHIK ,  HOYLE CHRISTOPHER J ,  KOSBERG ROBERT C ,  MENY KEITH A ,  POGLITSCH LAWRENCE R ,  NOWICKI JAMES JR

IPC: B60R16/02 ,  B60R16/023 ,  G01L9/00 ,  H05K5/00 ,  B60R16/00 ,  G01D11/24

CPC classification number: B60R16/0239 ,  G01L19/003 ,  G01L19/0084 ,  G01L19/143 ,  G01L19/147 ,  G01L19/148 ,  H05K5/0078

Abstract: An electrical device (10) includes a package body (12) having a device mounting region (14) and an electrical connection region (16). A cavity (18) resides in the package body (12) intermediate to the device mounting region (14) and to the electrical connection region (16). A leadframe (20) is positioned within the package body (12) and includes a plurality of individual leads (34) traversing the cavity (18). An electronic component (24) is electrically attached to the individual leads (34) within the cavity (18). In addition to accommodating the attachment of the electronic component (24), the cavity (18) is configured to permit access to the individual leads (34) by a bonding tool (40).