公开(公告)号：DE68908419D1

公开(公告)日：1993-09-16

申请号：DE68908419

申请日：1989-09-25

Applicant: MOTOROLA INC

Inventor： MULLEN WILLIAM ,  HENDRICKS DOUGLAS

IPC: B23K1/005 ,  B23K1/20 ,  B23K31/00 ,  G02B6/44 ,  H01L41/22 ,  H01R43/02 ,  H05K3/34 ,  H05K3/36

Abstract: A method for effecting high density solder interconnects between a substrate and at least one metalized film having through holes therein is provided. Solder is first applied to metalized portions of the substrates and the solder is then subject to a reflow process to provide reflowed solder. Pressure is applied to the reflowed solder during a second reflow process to provide prestressed or shaped solder. The metalized film is then positioned with at least one metalized portion adjacent to the shaped solder. Heat, as from a laser, is directed through the through holes in the film to melt the solder and form solder interconnections between the substrate and the metalized film.

公开(公告)号：DE68908419T2

公开(公告)日：1993-12-16

申请号：DE68908419

申请日：1989-09-25

Applicant: MOTOROLA INC

Inventor： MULLEN WILLIAM ,  HENDRICKS DOUGLAS

IPC: B23K1/005 ,  B23K1/20 ,  B23K31/00 ,  G02B6/44 ,  H01L41/22 ,  H01R43/02 ,  H05K3/34 ,  H05K3/36

Abstract: A method for effecting high density solder interconnects between a substrate and at least one metalized film having through holes therein is provided. Solder is first applied to metalized portions of the substrates and the solder is then subject to a reflow process to provide reflowed solder. Pressure is applied to the reflowed solder during a second reflow process to provide prestressed or shaped solder. The metalized film is then positioned with at least one metalized portion adjacent to the shaped solder. Heat, as from a laser, is directed through the through holes in the film to melt the solder and form solder interconnections between the substrate and the metalized film.