公开(公告)号：DE69129906T2

公开(公告)日：1999-03-04

申请号：DE69129906

申请日：1991-11-21

Applicant: MOTOROLA INC ,  CITIZEN WATCH CO LTD

Inventor： MULLEN WILLIAM ,  URBISH GLENN ,  FREYMAN BRUCE ,  WALKER MAURO J

IPC: H01L23/12 ,  H01L21/60 ,  H01L23/31 ,  H01L23/498 ,  H01L23/02

Abstract: A leadless pad array chip carrier package is disclosed, employing a printed circuit board (22) having an array of solder pads (34) on the bottom side. A semiconductor device (24) is electrically wire bonded (49) and attached with conductive adhesive (47) to the metallization patterns (43, 45) of the printed circuit board (22). A protective plastic cover (26) is transfer molded about the semiconductor device (24) covering substantially all of the top side of the printed circuit board (22).

公开(公告)号：DE68908419D1

公开(公告)日：1993-09-16

申请号：DE68908419

申请日：1989-09-25

Applicant: MOTOROLA INC

Inventor： MULLEN WILLIAM ,  HENDRICKS DOUGLAS

IPC: B23K1/005 ,  B23K1/20 ,  B23K31/00 ,  G02B6/44 ,  H01L41/22 ,  H01R43/02 ,  H05K3/34 ,  H05K3/36

Abstract: A method for effecting high density solder interconnects between a substrate and at least one metalized film having through holes therein is provided. Solder is first applied to metalized portions of the substrates and the solder is then subject to a reflow process to provide reflowed solder. Pressure is applied to the reflowed solder during a second reflow process to provide prestressed or shaped solder. The metalized film is then positioned with at least one metalized portion adjacent to the shaped solder. Heat, as from a laser, is directed through the through holes in the film to melt the solder and form solder interconnections between the substrate and the metalized film.

公开(公告)号：DE69129906D1

公开(公告)日：1998-09-03

申请号：DE69129906

申请日：1991-11-21

Applicant: MOTOROLA INC ,  CITIZEN WATCH CO LTD

Inventor： MULLEN WILLIAM ,  URBISH GLENN ,  FREYMAN BRUCE ,  WALKER MAURO J

IPC: H01L23/12 ,  H01L21/60 ,  H01L23/31 ,  H01L23/498 ,  H01L23/02

Abstract: A leadless pad array chip carrier package is disclosed, employing a printed circuit board (22) having an array of solder pads (34) on the bottom side. A semiconductor device (24) is electrically wire bonded (49) and attached with conductive adhesive (47) to the metallization patterns (43, 45) of the printed circuit board (22). A protective plastic cover (26) is transfer molded about the semiconductor device (24) covering substantially all of the top side of the printed circuit board (22).

公开(公告)号：DE68923790T2

公开(公告)日：1996-05-15

申请号：DE68923790

申请日：1989-12-15

Applicant: MOTOROLA INC

Inventor： ALTMAN LEONARD ,  FLAUGHER JILL ,  SUPPELSA ANTHONY ,  MULLEN WILLIAM

IPC: G01N33/15 ,  A61K38/00 ,  A61K38/22 ,  A61K39/395 ,  A61K45/00 ,  A61P3/08 ,  A61P3/10 ,  C07K7/06 ,  C07K7/08 ,  C07K14/00 ,  C07K14/575 ,  C07K14/705 ,  C07K16/00 ,  C07K16/26 ,  C12N15/02 ,  C12P21/08 ,  C12R1/91 ,  G01N33/53 ,  G01N33/577 ,  G02B6/42 ,  H01L21/60 ,  H05K3/34

Abstract: A method of forming solder bumps includes the steps of applying a thick layer of solder resist (22) to a substrate (20). The resist is selectively removed to provide wells (23) at solder pads (21) on the substrate. The solder paste (24) is applied to the substrate in the wells. The solder paste is reflowed to form solder bumps (25) on the pads. A socket for a solder bumped member (36) is obtained by first providing a substrate (30) having metallized pads corresponding to the solder bumps of the member. A thick layer of photo definable solder resist (32) is applied to the substrate. The resist is selectively removed to provide wells (33) at the metallized pads (31) of the substrate. Solder paste (34) is then deposited in the wells. The solder bumped member (36) can then be positioned so that the solder bumps (37) are located in the wells. The solder paste (34) is reflowed to bond to the solder bumps (37) and the metallized pads (31). The solder paste (34) can be selected to have a lower melting temperature than the solder bumps (37). By reflowing the solder paste (34) at a temperature lower than the melting temperature of the solder bumps (37), the paste can wet to and blend with the solder bumps while not causing the solder bumps to reflow.

公开(公告)号：DE68923790D1

公开(公告)日：1995-09-14

申请号：DE68923790

申请日：1989-12-15

Applicant: MOTOROLA INC

Inventor： ALTMAN LEONARD ,  FLAUGHER JILL ,  SUPPELSA ANTHONY ,  MULLEN WILLIAM

IPC: G01N33/15 ,  A61K38/00 ,  A61K38/22 ,  A61K39/395 ,  A61K45/00 ,  A61P3/08 ,  A61P3/10 ,  C07K7/06 ,  C07K7/08 ,  C07K14/00 ,  C07K14/575 ,  C07K14/705 ,  C07K16/00 ,  C07K16/26 ,  C12N15/02 ,  C12P21/08 ,  C12R1/91 ,  G01N33/53 ,  G01N33/577 ,  G02B6/42 ,  H01L21/60 ,  H05K3/34

Abstract: A method of forming solder bumps includes the steps of applying a thick layer of solder resist (22) to a substrate (20). The resist is selectively removed to provide wells (23) at solder pads (21) on the substrate. The solder paste (24) is applied to the substrate in the wells. The solder paste is reflowed to form solder bumps (25) on the pads. A socket for a solder bumped member (36) is obtained by first providing a substrate (30) having metallized pads corresponding to the solder bumps of the member. A thick layer of photo definable solder resist (32) is applied to the substrate. The resist is selectively removed to provide wells (33) at the metallized pads (31) of the substrate. Solder paste (34) is then deposited in the wells. The solder bumped member (36) can then be positioned so that the solder bumps (37) are located in the wells. The solder paste (34) is reflowed to bond to the solder bumps (37) and the metallized pads (31). The solder paste (34) can be selected to have a lower melting temperature than the solder bumps (37). By reflowing the solder paste (34) at a temperature lower than the melting temperature of the solder bumps (37), the paste can wet to and blend with the solder bumps while not causing the solder bumps to reflow.

公开(公告)号：DE68908419T2

公开(公告)日：1993-12-16

申请号：DE68908419

申请日：1989-09-25

Applicant: MOTOROLA INC

Inventor： MULLEN WILLIAM ,  HENDRICKS DOUGLAS

IPC: B23K1/005 ,  B23K1/20 ,  B23K31/00 ,  G02B6/44 ,  H01L41/22 ,  H01R43/02 ,  H05K3/34 ,  H05K3/36

Abstract: A method for effecting high density solder interconnects between a substrate and at least one metalized film having through holes therein is provided. Solder is first applied to metalized portions of the substrates and the solder is then subject to a reflow process to provide reflowed solder. Pressure is applied to the reflowed solder during a second reflow process to provide prestressed or shaped solder. The metalized film is then positioned with at least one metalized portion adjacent to the shaped solder. Heat, as from a laser, is directed through the through holes in the film to melt the solder and form solder interconnections between the substrate and the metalized film.

公开(公告)号：DE69129589T2

公开(公告)日：1998-12-03

申请号：DE69129589

申请日：1991-11-15

Applicant: MOTOROLA INC

Inventor： MULLEN WILLIAM ,  SUPPELSA ANTHONY ,  PENNISI ROBERT

IPC: B23K35/363 ,  B23K35/14 ,  B23K35/36 ,  C08K5/00 ,  C08L69/00 ,  C09J109/00 ,  C09J133/00 ,  C09J133/04 ,  C09J167/00 ,  C09J167/02 ,  H05K3/30 ,  H05K3/34 ,  C08K5/09 ,  C08K5/05

Abstract: A tacking agent is provided for use in temporarily adhering electronic components and providing fluxing properties for soldering electronic assemblies. The tacking agent comprises a fluxing agent and a tackifier. The fluxing agent is composed of one or more carboxylic acids having the formula where R is an alkyl group containing from 1 to 6 carbon atoms, R' is selected from the group consisting of hydrogen and hydroxyl, and R'' is selected from the group consisting of hydrogen, hydroxyl and carboxyl. The tackifier comprises one or more alcohols, aromatic hydrocarbon solvents, aliphatic hydrocarbon solvents, or polymers. The tacking agent is deposited onto a printed circuit board or other substrate, the electronic components are placed into the deposited tacking agent and soldered. During solder reflow the fluxing agent provides fluxing action for the soldering process, and the tackifier volatilizes, leaving little or no residue on the printed circuit board.

公开(公告)号：DE69129589D1

公开(公告)日：1998-07-16

申请号：DE69129589

申请日：1991-11-15

Applicant: MOTOROLA INC

Inventor： MULLEN WILLIAM ,  SUPPELSA ANTHONY ,  PENNISI ROBERT

IPC: B23K35/363 ,  B23K35/14 ,  B23K35/36 ,  C08K5/00 ,  C08L69/00 ,  C09J109/00 ,  C09J133/00 ,  C09J133/04 ,  C09J167/00 ,  C09J167/02 ,  H05K3/30 ,  H05K3/34 ,  C08K5/09 ,  C08K5/05

Abstract: A tacking agent is provided for use in temporarily adhering electronic components and providing fluxing properties for soldering electronic assemblies. The tacking agent comprises a fluxing agent and a tackifier. The fluxing agent is composed of one or more carboxylic acids having the formula where R is an alkyl group containing from 1 to 6 carbon atoms, R' is selected from the group consisting of hydrogen and hydroxyl, and R'' is selected from the group consisting of hydrogen, hydroxyl and carboxyl. The tackifier comprises one or more alcohols, aromatic hydrocarbon solvents, aliphatic hydrocarbon solvents, or polymers. The tacking agent is deposited onto a printed circuit board or other substrate, the electronic components are placed into the deposited tacking agent and soldered. During solder reflow the fluxing agent provides fluxing action for the soldering process, and the tackifier volatilizes, leaving little or no residue on the printed circuit board.